Conference asdg::cmp

    
     THIS IS THE B2 HARDWARE.CMP CONFIGURATION FILE. SHOULD YOU SUSPECTED 
    ANY SOFTWARE CONFIGURATION PROBLEMS, VERIFY THAT ALL SETTINGS MATCH THE
    ONES BELLOW.....TIM
    
    1 MUTLI-HEAD TRANSPORT ASSY
    1 CARRIER 1
    1 CARRIER 2
    1 CARRIER 3
    1 CARRIER 4
    1 CARRIER 5
    1 INDEX TABLE
    1 LOAD FLIPPER
    1 UNLOAD FLIPPER
    1 ELEVATOR #1
    1 ELEVATOR #2
    1 PAD CONDITIONER
    1 CONTINUOUSE POLISH
    1 NITROGEN DURING CARRIER CLEAN
    1 CLOSED LOOP
    0 PRESSURE SAVED TO FILES
    1 SCRUBBER
    1 WAFER TRACKING
    1 EIGHT INCH WAFER
    0 LOF FILES (WARNING, DO NOT SET THIS TO 1)
    0 SKIP AUTOMATION
    1 VACUUM CHECK
    0 UNLOAD STYLE
    1 PREALIGNER CENTER WAFER FLAG
    1 WAFER LOSS DETECTION
    1 CHILLER
    1 CHECK AIR PRESSURE
    1 CHECK MAIN VAUUM LINE
    0 CHECK ROBOT VACUUM
    1 CHECK NITROGEN PRESSURE
    1 CHECK DI WATER PRESSURE
    1 CHECK MIOSTURE SENSORS
    1 PAD CONDITIONER RINSE ON
    1 LOAD GRIPPER SENSORS
    1 UNLOAD GRIPPER SENSORS
    1 SECOND POLISH TABLE
    1 VAC CHECK DURING INIT
    1 PREALIGNER
    1 ADE PREALIGNER=0, FIXTURE=1
    1 KENSIGNTON MAPPERS
    0 DEMO MODE
    0 PAD COND UNITS (1=LBS)
    1 MOTORIZED PADDLE
    0 CHECK SLURRY
    0 DEBUG PRINTF STATEMENTS (1=GOOD FOR TROUBLESHOOTING, NORMAL=0)
    0 ELEVATOR #1 LIMIT SWITCHES WORK
    0 ELEVATOR #2 LIMIT SWITCHES WORK
    1 FRONT LOCKS FOR MULTI HEAD
    END
    
    
    
      

    
    * Mechanical Acceptance Activity:
    
      The Marathon Run was stopped due to Elevator #2 load problems.
      The robot repeatedly failed to pick-up wafers from slot #1 in
      Elevator #2. The Speedfam Reps are currently repairing the 
      elevator.
    
                                                             John.

    
         Things going good....
    
             The robot needed to be leveled to the animation
         frame as well as getting it parallel to the load
         elevators.  The robot, aligner, load flipper and
         elevators were then re-calibrated
    
             The water track sensors were a little flaky
         so the were tweaked to get them to stablize.
    
             50 wafers were run to verify everything.  There
         were no problems.
    
             After that was done, the marathon started and the
         wafer count is just over 100.
    
                                                D shift

    
    
    Mechanical Acceptance Update:
    
    The system Flew-Out Wafers near the end of the Acceptance run. One
    wafer broke and the Pad is, of course, in need of replacement.
    The carriers and pad have been removed from the tool. D shift,
    please build-up 5 carriers and replace the pad. See Tim Dyer's
    passdown for Meacanical Acceptance instructions.
    
                                                            John.

    
         Marathon was placed on hold three times due to wafer breakage
      on the table.  Reps are still trying figure what is going on.
      The marathon stands at (0).  Reps are currently working on the
      index table alignment.
    
                                                  D shift
    
                                      

	Rep's

		- Broke the slurry dispense head removing the carriers.
                  Went to fixture clean and Teflon welded it back together,
		  looks like new.
			
		- Ran 200 wafers running the no touch program with only 1
		  error. "Load Flipper fingers wouldn't release the wafer
		  at the load cup." 

		- Started running touch down wafers. 

		 Error #1: "head #1 not arriving to top position", had to 
		           adjust the sensor position.

		 Error #2: A wafer slid out from under carrier #3, didn't
		           break. Adjusted load cup to carrier for head #3, 
    			   it was slightly out of alignment.

		- Started the touch down run counter over, we are now at 
		  100 wafers and should hit 125 by 8 am.

						B shift
                                           

	* The Reps. made a slight adjustment to the load flipper.
	  150 more wafers were run on B shift tonight with no problems.

	* 4 Carriers were built tonight and are in the carrier rebuilt
	  room. The exposure was set between .17mm and .19mm, this equals
 	  between .007in and .008in. We had problems bringing the tolerances
	  in on 1 carrier, it's on the table with the depth gauge on it.

	* A rush was placed for 20 more retainer rings, we're out of stock.

						B shift & Mitch

	Engineering began taking particle checks.  System broke wafers on pad.
        Replaced pad and carriers.  System passed particle checks.

	One of the carriers was of the correct exposure tolerance, BUT in the 
        wrong direction of exposure ?????? Positive 7 instead of neg 7-8.

	Rep rebuilt one carrier and are currently running initial uniformity 
        tests and checking correlation of removal data between spindles.

	SBA to send 9 pressure plates was cut early this morning. before this 
        mishap.

	No Reps due in tonight. They will however, work late and be in early 
        tomorrow.
						A shift

	The Reps (Darin), calibrated his meter # 405962.   He the set up the 
head balance pressure.  The down force calibration was then performed with the 
following results:

Spindle # 1

Original reading was 164.9 lbs on the stress gauge at a set point of 377 lbs.
Original Input coefficient was .94753. 
Original Output coefficient was 3.03909

Spindle 1 was adjusted to a meter reading of 377 lbs @ a set point of 377 lbs
New input coefficient is 0.47243
New output coefficient is 5.87533

************************************************************************

Spindle # 2

Original reading was 158.9 lbs on the stress gauge at a set point of 377 lbs.
Original Input coefficient was 0.91642 
Original Output coefficient was 3.18241

Spindle 2 was adjusted to a meter reading of 377.1 lbs @ a set point of 377 lbs
New input coefficient is 0.46774
New output coefficient is 6.08488

*************************************************************************

Spindle # 3 

Original reading was 186.0 lbs on the stress gauge at a set point of 377 lbs.
Original Input coefficient was 0.85754 
Original Output coefficient was 3.29316

Spindle 3 was adjusted to a meter reading of 377.0 lbs @ a set point of 377 lbs
New input coefficient is 0.46832
New output coefficient is 5.97613


**************************************************************************

Spindle # 4


Original reading was 187.7 lbs on the stress gauge at a set point of 377 lbs.
Original Input coefficient was 0.87714 
Original Output coefficient was 3.28990

Spindle 4 was adjusted to a meter reading of 377.0 lbs @ a set point of 377 lbs
New input coefficient is 0.47421
New output coefficient is 5.95756


****************************************************************************

Spindle # 5


Original reading was 158.8 lbs on the stress gauge at a set point of 377 lbs.
Original Input coefficient was 0.97152
Original Output coefficient was 3.18893

Spindle 2 was adjusted to a meter reading of 377.1 lbs @ a set point of 377 lbs
New input coefficient is 0.46201
New output coefficient is 6.42971

****************************************************************************

	At the completion of the downforce cal, they conditioned the pad and 
went on to balance the spindles offset and cancel the effect of individual 
    carriers.

	Darin feels that the our old meter was not calibrated properly in our 
CAL LAB. The display should be zeroed then the sensor calibrated to the 
display.  I have made copies of the entire procedure and will provide this 
to our cal lab with feedback... Also kept a copy for us. 

	I picked up the orings your were looking for and also found 10 22.5" 
pads in your name from Rodel; not sure if they were for the secondary table or 
fab 4; pads and rings are in the room, paperwork is in your office.

						Brendan/Doc
    

      	CMP.B2 Process Acceptance Passdown, Friday, 11/17/95:
      	CMP.B2 Process Acceptance Passdown, Friday, 11/17/95:
    
    
    
    
    
    
    
    
    
    
      	CMP.B2 Process Acceptance Passdown, Monday, 11/20/95
    
    - The primary process acceptance was completed and report was circulated 
    with results.  
    
    
      	CMP.B2 Process Acceptance Passdown, Friday, 11/17/95:
    
- We believe the wafer breakage problem has been resolved.  The problem was
when we landed down onto the pad we were landing and ramping to full pressure
in the ID position where part of the wafer was "off" the pad.  This was 
verified by processing ~395 wafers on a full pad w/no breakage.

- 5 new carriers were installed along with an ID/OD pad.  The landing location
was modified to land in the middle of the ID/OD pad such that the entire wafer
surface is on the pad when landing and ramping to full pressure.  50 wafers 
were cycled for 3min to breakin the pad followed by 10 pre-measured wafers.
The results are:
3min oscillation=(110-145)		3min oscillation=(112-147)  
slot	removal	%dev  	center	   	slot	removal	%dev  	center
----	-----	----	-----  		----	-----	-----	-----
1	8032	6.3 	slow   	       	 6	7813	4.5	s
2	8010	3.4	slow   	       	 7	7818	4.6	s
3	7989	4.9    	slow  	       	 8	7851	2.7	m
4	7824	8.4    	fast   	       	 9	7463	9.6	f
5	7892	4.2    	slow   	       	10	7616	2.9	med

- At this point carrier #4 was changed out because it was an outlier.
Five breakins were run at 40sec and then 5 pre-measured wafers to check rate 
and uniformity 1 more time before starting the 50 wafer 3 minute polish qual.
The results are:
3min oscillation=(112-147)  
slot	removal	%dev  	center	   	
----	-----	----	-----  
1	7449	5.2	med
2	7519	3.6	med
3	7365	4.2	med
4	7110	7.0	fast
5	7353	3.1	med

- The 50 wafer 3 min polish qual was begun ~6:00.  If the results are
comparable to the 2 min run, basic process acceptance will have been completed
and Speedfam will fly home tomorrow.  The remainder of November will be spent
optimizing the recipe for the primary platen, developing a recipe for the
secondary platen for particle reduction, and verifying planarization 
capabilities.  At this point we are on or ahead of schedule to release the 
tool to production on 12/1.



******************************************************************************

      	CMP.B2 Process Acceptance Passdown, Thursday, 11/16/95:

- Things looked good after the pad change and the 50 wafer 2 min polish QUAL
was begun.  The run completed with no issues.  The results were good.  All
specs were met except the overall average head-to-head rate variation(was 6.0%,
spec is <5.0%).  Results summary:

	Average %std-dev = 4.65%(SPEC <5.0%), max = 6.05%(SPEC 8.0%), min=3.20%
	Note that the MAX and MIN ocurred in the 1st 25 wafer run.

	The polish rate increased incrementally through the 1st and 2nd run.
	Thereafter the rate was pretty stable.
	Average removal rate = 2891A/min(SPEC >2kA/min), max = 3045A/min, 
	min = 2695A/min
	The average head-to-head variation across 25 wafer using Larry's 
	formula was 6.05%(SPEC <5.0%).  If the 1st & 2nd run are dropped
	the average head-to-head variation ~3%.

	However, the head-to-head within-run removal rate was very consistant 
	and within spec <5.0%.	head-to-head-			head-to-head-
			run	rate-%std-dev.		run	rate-%std-dev.
			1 	1.25%			6	2.17
			2 	2.03%			7	2.19
			3 	1.65%			8	1.09
			4 	1.58%			9	1.72
			5 	1.44%			10	2.45

- The 50 wafer 3 min polish test was begun, but, a wafer broke in carrier #2
on the 2nd run.  Since this was the same head location that a wafer broke in
yesterday, EE took the tool to check alignment in the load cups.  All heads
were found to be slightly high and head 2 was found to off-level slightly.
This may have been the cause for the breakage.  A new pad was installed.
Carriers 2&3 were replaced and 2 retainer rings were replaced on 2 other
carriers.  

- After breaking in the pad a few test wafers were run and uniformity went 
out the window(~4%-11%).  Speedfam believes the high uniformity is due to the 
3 used carriers that sat for a while and dried.  We do not have any more 
plates available, however, to install 5 new carriers.  So additional breakins 
are being performed to see where we stand before committing the 50 wafer 3 min 
polish test. 

- 50 wafers were run for 30sec and 5 wafers for 3 min to breakin the
pad/carriers more. Then 5 pre-measured wafers were polished for 2 min and 
5 pre-measured wafers were polished for 3 min.  The results were:
<---------2min---------->	<----------3min--------->
1	5440	5.3	s	1       7446    7.1     s
2	4835	11.8	f	2       6687    7.0     f
3	5224	5.0	s	3       7389    4.7     s
4	5156	9.2	f	4       7294    3.8     s
5	5538	4.8	s	5       7399    3.7     s

- We decided to replace carriers 1&2 with new ones and try 5 more wafers.
Upon doing this we BROKE ANOTHER WAFER!!!

- AT THIS POINT WE STOPPED THE PROCESS ACCEPTANCE TESTING.  SPEEDFAM WILL WORK
AROUND THE CLOCK CYCLING WAFERS MECHANICALLY IN AN EFFORT TO ISOLATE THE 
SOURCE OF THE WAFER BREAKAGE PROBLEM WE'VE BEEN EXPERIENCING SINCE LAST FRIDAY.
PROCESS ACCEPTANCE WILL NOT RESUME UNTIL WE HAVE CONFIDENCE WE HAVE RESOLVED
THE PROBLEM.

- There are 3 new carriers in the carrier build room and 3 additional 
carriers being kept wet in the chase for B1 in case of a crash there.

*******************************************************************************

      	CMP.B2 Process Acceptance Passdown, Wednesday, 11/15/95:

- The carrier offsets were calculated in the manner described yesterday.
The offsets were:	head	offset
			1	0
			2	-1
			3	-2
			4	7
			5	-4
- A 25 wafer verification run was performed for 2min.  The results were:
	The within-wafer non-uniformity was tight across all 25 wafers. 
	Average %std-dev = 4.07%(SPEC <5.0%), max = 5.75%(SPEC 8.0%), min=2.40%
	Important to note that the 1st half of the run polished center-fast,
	while the last half of the run polished edge fast.

	The polish rate increased incrementally with each run and thus failed
	the rate uniformity spec.  
	Average removal rate = 3088A/min(SPEC >2kA/min), max = 3364A/min, 
	min = 2904A/min
	The average head-to-head variation across 25 wafer using Larry's 
	formula was 8.5%(SPEC <5.0%).

	However, the head-to-head within-run removal rate was very consistant 
	and within spec.	head-to-head-
			run	rate-%std-dev.
			1 	1.52%
			2 	2.10%
			3 	1.75%
			4 	1.97%
			5 	2.26%(SPEC <5.0%)
- We decided to process the 25 wafers at 3min to see if the trend continues.  
On the 4th run a wafer broke in carrier #2.  We cleaned up the mess enough to 
finish the 5th run, however, the wafers ended up being toast.  So we changed 
the pad and all 5 carriers.  
- Offsets for heads 3&4 were changed to -1 & +8 respectively based on the 
last run.  
- The pad was conditioned twice for 5 minutes at 100% downforce(77lbs).  Ten 
dummy wafers were processed followed by ten test wafers at 2min.  Provided this
loos ok, the 50 wafer 2 min polish test will be repeated.  
- Production, please assist Eric B. tonight in measuring wafers.

******************************************************************************

      	CMP.B2 Process Passdown, Tuesday, 11/14/95:

- Carrier extension was corrected from +6mils to -.75mils on the problem
carrier.  Also, the conditioner recipe was found to be incorrect.  The
conditioner was set-up to oscillate when it should not.  This was corrected
and the conditioner downforce was increased to 100%.  5 wafers were run to 
test rate and uniformity.  Downforce was 377lbs and polish time was 120s.
The results the rate is still low and the uniformity
poor.  They are shown below:

slot	process		amt.rem	%dev	c/e fast	rate/min
----	--------	-------	----	--------	--------
1       primary only	2763	7.4	edge		1382
2	"		3002	9.4	center stripe	1501
3	"		3653	8.1	edge		1827
4	"		3783	9.1	edge		1892
5	"		2972	11.2	edge		1486

- The process we're using on B2 was put on B1 and 5 wafers run for comparison. 
The results show B1 removal rate to be much higher.  The system was handed over
to EE to re-calibrate the downforce.  The results of B1 are below:

slot	process		amt.rem	%dev	c/e fast	rate/min
----	--------	-------	----	--------	--------
1       primary only	5345	9.5	center		2673
2	"		4997	6.2	center		2499
3	"		4847	4.3	edge		2424
4	"		4338	8.5	center		2169
5	"		5089	6.6	center		2545
note: B1 had failed regular uniformity MQCs prior to this test.  

- Darren found the downforce mis-calibrated.  When asking for 377lbs we
were only getting ~170lbs.  Also, the conditioner max. downforce was increased
from ~55lbs to 77lbs.  This appears to be the cause for the low removal
rates observed in the previous test because the test performed after the
re-calibration of the downforce are more comparable to B1.  The results are
shown below.  

slot	process		amt.rem	%dev	c/e fast		rate/min
----	--------	-------	----	--------		--------
1	primary only	?	?	wafer reclaimed before I could measure
2	"		5170	10.4	center			2585
3	"		5358	10.8	center(best profile)	2679
4	"		5197	7.7	center			2599
5	"		5266	9.9	center			2633

- The 25 wafer head offset characterization run was started(5 wafers are 
processed, then the carriers are rotated 1 head and 5 more wafers run, etc.).
The process used was 377lbs downforce(touchdown is performed at full force
with 15prm table speed) for 2min at 29/29rpm, 1L slurry, 15"ID/OD pad, 
oscillation 110-145 at .3"/sec.  
The conditioning recipe was 80% downforce(~62lbs) for 60sec.  
The results will be placed in Excel and offsets will be calculated and plugged
in to the tool.  Confirmation runs will follow.

******************************************************************************

      	CMP.B2 Process Passdown, Monday 11/13/95:

- Particles were checked today.  Mechanical particles & process particles both
w/and w/out second table were checked on ID(15")/OD pad configuration.  
Process used was 377lbs, 29/29rpm, 107-145 oscillation, 75sec primary platen,
10sec secondary platen.

Results from Particle tests
slot 	process	       		pre	post	delta
----	--------   		-----	----	-----
25	transfer only, no table 12	15	3	
24	"	       		20	36	16	(Spec <20 adders)
23	"	       		16	25	9
22	dummy
21	dummy
                                              	
24	primary table 75sec	38	679     641
23	"    			16      451	435	(Spec <5000 adders)
22	"			23	2554	2531
21	dummy
20	dummy

14	primary 75s/2nd 10sec	10	413	403
11	"			21	482	461	(Spec <5000 adders)
6	"			14	937	923
2	"			34	751	717
1	dummy

Uniformity results from process particles without second table
slot	process		amt.rem	%dev	c/e fast	rate/min
----	--------	-------	----	--------	--------
24	primary	75s	1741	8.4	edge		1392
23	"		1778	20.3	hill		1422	(Spec >2000)
22	"		1847	12.4	center		1477
21	dummy
20	dummy

14	primary+2nd	1797	7.5	edge     	14 38
11	"		2685	7.4	edge hill	2148	(Spec >2000)
6	"		1917	12.0	center		1533
2	"		1804	9.4	edge		1443
1	dummy

- Wafer crashed on pad when water was accidentally flowed on table during 
subsequent processing.  Installed new ID/OD pad, 5 new carriers and ran break-
ins.  Five wafers were run for 120sec to check rate and uniformity.  Head #2 
was found to have 0 removal rate.  It was determined that head #2 exposure was 
set at +5.5mils instead of -5.5mils...ie the wafer was not exposed at all.
Speedfam reps are in the process of rebuilding that carrier.

- Plan is to recheck rate and uniformity and the Speedfam PEs will go home.
The carrier offset characterization is scheduled to begin tomorrow morning 
provided we do not run into any more snags.

LIST OF LOT NAMES FOR CMP.B2 START-UP:  
LOT I.D.	PRE-MEASURED	TOOL	BY WHO?	FILE #'S	USED?
-------- 	------------	----	-------	--------	-----
PA0830   	YES		A5	Earl	2195-2219	YES
PA0833	 	YES		A5	Earl	2220-2244	YES
PA0834	 	YES		A5	FRANK	2313-2337    	YES
PA0835	 	YES		A5	FRANK	2338-2362	YES
PA0837	 	yes		A5	FRANK	2369-2381	YES
						2458-2470
PA0717		YES		A5	JOHN                    YES
PA0831		YES		A5      FRANK			YES
PA0832		yes                                             NO
PA0836		yes						YES
PA0712          YES		A5	JOHN			YES
PA0797                                                          NO
PA0657                                                          NO
PA0705                                                          NO
PA0656                                                          YES
PA0893								YES

The slurry supply system went down early this morning.  The pump in the 
distribution unit down stairs kicked off for excessive pressure.  This
is normally caused by a "dead-head" situation.  So, we opened the by-
pass valve in the end VMB to allow flow to increase in the loop.  The
pump down stairs remained running.  As the valve was closed down to
supply pressure to the line, we were able to get the pressure up, but 
there wasn't sufficient flow.  Found the filter clogged up pretty bad.
The bottom fittings were missing from the filter.  I'm sure the air
exposure was a vital detriment in the clog situation.  A new filter was
installed and flow was verified.  The system is now available for 
process development work to resume.

      					A shifters and Tim D

	 Load cup 5 failed to descend upon loading. It appears that the 
pedestal was not within the loadcup double L bracket. This caused the cup to 
ascend, but not to descend.  The multihead was allowed to move out to polish 
even though loadcup 5 was up, due to the fact that the position sensor 
monitors the pedestal and not the actual cup.  The ascended cup 5 struck 
carrier 5 breaking the wafer at the index table.  After cleaning 
Loadcup 5 and aligning pedestal within loadcup 5, rep (Bob G.) checked
function of cups up and down several times without issue.  Cleaned system 
and replaced both primary and secondary pads.  Put new carrier on head 5.  
Bob feels that this loadcup was improperly placed on top of the pedestal at 
the completion of the labeling(stamping) process.  Frank confirms that the 
system has not been run since that event.


	In the late afternoon the system snap the pedestal off the unload 
station.  No one present knows why this happened.  Bob G. will have a 
new load pedestal here tomorrow.... 

						Brendan/Bob G./Frank/Tim

    
    Unload Cup Air Cylinder Pedistal:
    
    The Unload Cup Pedistal was replaced by Bob Gugerty and myself
    this afternoon. The Unload Flipper was re-taught a new pick-up 
    position due to the slight variation in the Pedistal height.
    Tested o.k.
    
    
    
    Load Cup #3 Load cup sensor problem:
    
    The system errored for "all cups not down" at 7:15 p.m.
    Digital input #94 was not up. D shift, take a look at the sensor 
    on load cup #3 air cylinder.
    

    
     
         Load Cup #3 sensor wasn't detecting that the pedistal
       was done when it was.  I adjusted the sensor and all is
       well...
      
          while working on #3, I noticed #4 unload cup could free
      spin in the hole.  The dowel pin was pushed in.  I pushed
      it back out and checked the other cups.  Frank is aware of
      it and will be talking with Bob Gugerty about it.
      
                                         BJ

    
    * Unload cup air cylinder extention rod:
    
      The rod was slightly bent which caused the sensor to detect 
      intermittently. The Extension rod was replaced an the unload
      flipper pick-up position re-taught.

	System is down for a bad infornor. Replacement is 
        due in tomorrow.  Refer to Tim's passdown.


			

    
   * Collision between spindle #3 & load cup #3:
     ------------------------------------------
     The tool experienced a major crash at 7:15 p.m. this evening. Spindle
     #3 collided with load cup #3. The entire load cup assembly was torn out
     of the index table. The load cup is completely destroyed. The index
     table pulpier tub also sustained damage. There is a large piece broken 
     off the side of the tub. The load cup mounting hole has been distorted 
     from its original shape. 

     Unknowns at this time:

     1) Check carrier #3 for possible damage. 

     2) Inspect the whole index table assembly for further damage.

     3) Check spindle #3 for any possible damage.

     4) Check #3 index table air cylinder assembly for damage.

     5) Spindle alignments and index table alignments are most likely out of
        spec. Check them.
    
    

    
     
         After reviewing the entire crash, we found that the multihead
      crashed into load cup #3 twice.  Once when the arms swung in 
      after picking up wafers and then going to the center of the index
      table.  The other is when the multihead moved to the polish table
      after it had the wafers.  The wafer on head #3 crashed inside of the
      carrier.
    
         Upon removal of the index table, we notice that the pedistal
      sensor showed exposed shielding and the wires were shorting 
      against the sensor block.  The tool thought the cup was always
      down.  The cup came up and got stuck coming down.  Since the tool
      thought it was down, it moved the multihead to polish.
    
         The sensor was removed and will be replaced when it comes in.  
      A new index table is being sent in from Texas.  The entire cups 
      assembly on L3 needs to be replaced.
    
                                                   BJ

    
    * Index Table:
      -----------
      A replacement Index Table and Load Cup are due to arrive tonight,
      by currier, at approx 2:00 A.M. The Load Cup Inserts I.D.'s will be
      measured and recorded tomorrow. Tim Dyer will take this information
      to a Machine Shop and have each Load Cup Shaft turned down to match
      its respective insert. See Tim's Passdown for further details. 
    

    
    Index Table Replacement:
    -----------------------
    The replacement Index Table Arrived this morning. It was cleaned and
    bolted onto the Index Table Mounting Supports. The damaged proximity
    sensor and cable for Air Cylinder #3 were also replaced. 
    
    All 10 Load Cup Bushings were measured for runout and taper. The
    results varied from one bushing to another. The runout varied from
    .001" on the best bushings to .005" on the worst. The measument data
    has been forwarded to Tim Dyer per his corrective action plan dated
    12/9/95. The Load Cup Shaft measurment activity is planned for
    tomorrow. Contact Tim Dyer for complete details.
     

	* The field rep. came in to work on the system tonight.  
	
	   We:
		- removed the index table to repair the threads 
		  on 1 of the holddown bolt holes, re-installed
		  and aligned.
		   
		- aligned the index table home sensor. 
	  
		- set the index table home position and checked 
		  repeatability.

		- aligned spindle to load cup positions for all 5 heads.
	
		- checked the load flipper to load cup position.

		- checked the unload flipper to unload cup position.


					B shift

	Disassembled cups and shafts. Tim had all cups trued to .012 of cup 
hole. Cups are back in room. I have begun reassembling them. All components 
are labeled.


					Brendan\Tim\Bob

	- Cleaned and re-assembled the load & unload cups.

	- Placed the cups on the index table in there designated 
	  feed-thru holes. Checked to verify that the air cylinder 
	  mushroom pedestals would clear the cup, looked good. 

	- Filled with water and checked for smooth operation, all cups 
	  traveled very smooth. Found that all cups were traveling up 
	  to fast, splashing water out of the index table. Turned the
	  air pressure to all cups down from 45 psi to 25 psi, the same 
	  as CMP.B1. 
		
	- Waited 4 hours and checked the up/down travel again, all looks 
	  good.

	Didn't run the no touch program due to no carriers available. 
 
					B shift

	Cycled 115 wafers through the system, transfer only no touch downs.
Tim changed pad and is now running "MEC2_acp" quick polish program. These 
wafers should be able to be reused several times due to the low removal rate. 
Please continue to cycle until tomorrow or wafers are used up.  Keep system in 
wet mode when not in use, this will make Tim and Frank happy campers.

					Brendan
			

    
    * Load Cup #3:
      -----------
      Cup #3 had a mis-load incedent this morning. We disassembled the
      cup and replaced the springs. We have since run 50+ wafers without
      any problems.

	* Eric B. released the system to manufacturing tonight.

						B shift

    An abnxious little alarm was heard this morning near this system. 
    Alas, it's only the TCU.  The glycol level in the resevoir was slightly
    low, causing the alarm to go off/come on.  Topped of the resevoir.  All
    is well.
    
    Later on in the day, the system failed to pickup at wafer (head 4) at
    the polish table.  The wafer was placed back on the carrier and the
    cycle was resumed.  When placing the wafer on the carrier, it was quite
    evident that there was more than sufficient vacuum, as the wafer was
    literally lifted from the placee's (Jim Sadin) hand.  Other than that,
    the system ran flawlessly.
    
    						the A shift
    

    Machine misloaded three times tonight. Twice it double loaded cup four
    and would have done it a third time but the operator saw it and emo'd
    the machine. It looks like the load flipper didn't release the wafer
    into the load cup and then came back to the aligner with the wafer. It
    then picked up the wafer that was on the aligner and the wafer it
    brought back and deposited them into the load cup, like I said this
    happened twice. The reason it didn't alarm for flipper not open and any
    other alarms associated with this is because the load flipper sensors
    and unload flipper sensors were disabled. We reenabled them and then
    exercised the load flipper manually to ensure it wasn't sticking and
    that the sensors were working properly (dig-in 2 and dig-in 3 mainly).
    Ran 35 wafers through using the same recipe that production was using 
    (I/O pmda) with the polish times zeroed and carriers left up. The
    problem didn't duplicate. The fab might be closing at 4am (its now
    3:55) but if it doesn't we'll continue to run dummies through until the
    day shift crew gets in.
                           

    Ran come more wafers through the machine to try and duplicate the
    misloading problem. Fortunately what appears to be the problem occured.
    What happened is the load flipper picked up the wafer from the aligner
    and dropped it into the load cup. BUT when it came back to the aligner
    the fingers were closed enough so that they hit the wafer that was
    there. With the load flipper sensors now enabled the machine alarmed
    and halted for load flipper time out at aligner. We removed the cover
    on the flipper but everything looked good. Nothing was binding and the
    movements were smooth. Air pressure was good at 50 psi. We then put a
    gauge in the air line that opens the flipper to see if the pressure
    would fluctuate while running but it remained solid at 50psi. Since
    it now alarms when it screws up we put the machine back up. 
    
    						B shift

           
    Continued from B shift on load gripper finger problem. The source of
    the double loading wafers has been atributed to the fingers sticking
    closed. B shift installed a pressure gauge inline with the grippper.
    The gripper was cycled, the fingers opened slowly and made a squeeking
    niose, also pressure was at 40. B1 fingers move fast and the pressure
    is at 60. Increased B2 gripper pressure to 60. Fingers move quicker
    but still squeeked. Cleaned and olied giuld rails. Cycle 50 waferes
    with out error. Returned to MFG.
    
    

        
    
        The tool was going through MQC's due to uniformity and
     high particles.  Gwen cleaned the entire machine and tried
     running MQC's again.  It failed again.  After she tried
     running some more wafers, there was a MAIN VACUUM error.
     I found the vacuum pump breaker tripped.  I found what
     appeared to be dried slurry on the black shield that covers
     the capacitor.  I touched the the black wire A-71 and an
     arc shot out and the machine powered down.  Breaker #7, which
     pretty much controls the boot-up, was tripped.  A-71 had a
     bad crimp and the wire simply fell out.  I cut it the wire
     back and re-crimped it.  The tool came back up fine and 
     the NO_TOUCH program was run to verify everything.  MQC's
     are back on their way.
                                                   BJ

    
    * Load Flipper mis-load:
      ---------------------
      The Load Flipper failed to travel all the way down to the pre-aligner
      this afternoon. It was short by at least 1/4". Earl rebooted the
      system and the problem was gone. 
    
    
    
    * Sticking Solenoid Valve:
      _______________________
      SV #65, Carrier #5 Rinse, stuck open once during C shift today. We
      gently tapped on the valve body with a screwdriver handle and the
      valve closed. 
    
      Note: Brian Jubinville observed both of the above conditions last
            night on D shift.

    
    
        The DI came on but is still out of spec so we didn't want
      to keep it to the tool so we shut off the DI feed and opened the
      by-pass.  Facilities still have some by-passes opened, that's
      why we don't have very high pressure.
    
        The slurry lines are all back to normal and slurry is flowing.
      We put the filter on but but we didn't run the slurry through
      the machine because of the DI situation.
     
                                                       Mitch,John,Leon,BJ

    
                        CMP.B2 START UP CHECK SHEET
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++

1) RE-CONNECT DI WATER					       B/C/D-12/31/95	
2) POWER ON SYSTEM		                               B/C/D-12/31/95
3) CYCLE/RUN ALL DI FUNCTIONS FOR 15 MINUTE                    B/C/D-12/31/95
4) WIPE DOWN SYSTEM CLEAN ALL DRIED SLURRY	               B/C/D-12/31/95 
5) DRY TABLES, INSTALL PADS					
6) INSTALL SCRUBBER BRUSHES				       B/C/D-12/31/95	
7) INSTALL CONDITIONER					       B/C/D-12/31/95	
8) RUN WET IDLE PROGRAM FOR 15 MIN. (ENOUGH TO CLEAN CARRIERS) B/C/D-12/31/95
9) REPLACE SLURRY FILTERS				       B/C/D-12/31/95	
10) CONTACT ASHLAND CHEMICAL, REQUEST DI TO BE PURGE FROM      B/C/D-12/31/95
    SLURRY SYSTEM AND CHARGED WITH SLURRY			
11) CALIBRATE SLURRY FLOW				       B/C/D-12/31/95	
12) PUT IN WET IDLE AND TURN OVER TO MFG FOR MQCS	       	

CMP.B2 - Continued with high uniformity. The carriers were removed and checked
         by Pro Eng (TJB) on the P2. The curvature was ~ -15u, it should be 
         closer  to -2u. The carriers were replaced, the bad plates marked
         as bad.
       

    Late afternoon / early evening, the system began to make a very loud,
    banging sound in the polish table area.  The sound would occur
    consistantly (at about 5 seconds after the carriers landed on the
    table and the table spinning at it's lowest speed).  The noise would
    disappear after that and the run would complete fine.  The noise is
    definately coming from the polish table or associated areas underneath.
    
    While trying to trace this occurrance, the problem miraculously went
    away.  The system is running fine......for now.
    
    						Doc  /  Guugs
    

    Today, due to the lack of pressure plates for the carriers, the
    carriers were removed from this system and installed on B1.  This was
    justified by the polish table banging problem that needs to be resolved
    on B2.
    
    With no good plates in-house, we installed a set of carriers that had
    DF film (black used on Strasbaughs) to assist in the trouble shooting
    of the banging noise.  We used the I_O_MQC recipe for the test as that
    was the recipe the problem first showed on.  Ran a cassette of wafers
    with no banging sound.  Tim D came in and continued on, the problem
    re-occurred.  He tried decreasing the ramp time (more stress on the
    ramp) to 4 and it happened right off the bat.  The time was then
    increased to allow a slower ramp to occur and the banging ceased.
    BUT there was vibration during the polishing cycle.  The pad may (or
    may no) be the problem of this vibration as it was stressed along with
    the belt that spins the table.
    
    So, the pad has been removed and a new one installed.  The five DF'd
    carriers will need to be re-installed.  Then the system can be broken
    in and checked out.  If banging occurs at the ramp rate of 5 seconds
    (in segment 3 or 4.....it escapes me at this typing which is the right
    one), increase the ramp rate to 8 and try again.  To recap, we need to
    see if the banging stays away at a slower ramp rate and also to see if
    the vibration has been eliminated.
    
    					Doc  /  Tim D  /  Guugs
    
    
    As I type, Bob Gugurty is making a minor adjustment to the belt tention
    to assure proper setup. 

    
    
          Bob loosened the belt and the vibration stayed.  He 
      tightened the belt back up and the noise went away.  Bob 
      ran 50 wafers and the problem with the belts went away.
      The tool is still waiting for plates/carriers.
    
          The #5 carrier rinse is staying on again.  While it
      was spraying, DIG-OUT 83 was NOT lit.  I was about to check
      the voltage and it the spray stopped before I could grab the
      meter.  I followed through the wiring and everything on that
      end looks good.   Please keep an eye on it.
    
                                                     BJ
         
    
     

rom:	FABSIX::R_GEE "Bob Gee, Beeper #184  03-Jan-1996 0808"  3-JAN-1996 08:12:00.39
To:	@CMP_ALL
CC:	R_GEE

       CMP.B2
       ------

	* Rinse for carrier #5 wouldn't shut off.

		Replaced the solenoid for carrier #5 rinse, it
		was sticking.
			
	* A loud banging noise and vibration was coming from under 
	  the polish table 15 sec. into the polish cycle.

		Found the drive belt from the motor pulley to the
	        idle pulley assembly was slipping at the idle pulley.

		Adjusted the idle pulley assembly to keep the belt 
		from slipping. Had to shim the right side of the bottom
		adjustment bracket to get both belts to tighten evenly.
	
		The belts needed to be tightened more then the spec
		advise to keep them from jumping the pulley teeth. 
		
		The table now vibrates badly, the belt tension needs
		to be rechecked before it is run. The cause of the
		problems seems to be in the belt from the motor or
		in the idle pulley assembly.

		Field service was consulted by phone last night
		and should be here this morning, weather permitting.
 
			B shift

        A wafer slid of carrier #2 and broke.  The machine errored
      right at the beginning of Step 3 and it appears that the wafer
      just wasn't seated properly.  Carrier #2 was the only one
      damaged.  The tool was cleaned up and MQC'ed with (4) heads
      since there are no more plate in.  One of the wafers came out
      with a small scratch and the uniformity was out on one head
      (4) more wafers were run and there were no scratches.  The 
      uniformity was out but .8 on one head.  Rather than rip the
      pad off and do things all over, they are going to run an 
      exercise wafer in the bad slot and run the tool.  Day shift
      will check it out and run it if they feel it is ok....

                                                      D shift
    

    The system just went back down for a wafer detection problem.  It's
    a phantom detection, seeing the beams are not being broken by a lost
    wafer or the carrier itself.
    
    I have resat the board and it's connector, but a red LED intermittently
    illuminates.  The lit LED isn't on one of the five heads, rather it is
    the next LED down (which has a label saying wafer lost).  Could be a
    flakey sensor/adjustment problem.
    
    						Doc

    Ops tried to run B2 again and it failed again for wafer detection. The
    same problem that A-shift saw. At first the wafer lost led was dimly
    lit. We couldn't find a cause for this other than something on the
    board dragging the 24volts thats on the dig-in 20 line when everything
    is fine. When a wafer loss is detected dig-in 20 is supposed to go low
    which makes the wafer lost led turn on bright plus opto isolater for
    dig-in 20 turns on. We basically banged our heads against the wall
    trying to find out why dig-in 20 24v signal was being dragged down to
    19.9vdc but couldn't come up with anything. We pulled the line out of
    BB#9 pin 28 and the voltage goes up to 24v (actually 23). We found a
    spare wafer detect board and put it in but this didn't change anything.
    We also had to replace relay k1 on the board to fix the main motor
    contactor interlock circuit. Now the wafer loss led stays brightly lit
    all the time. We must have shorted something out because U2 (a dual
    input nand gate chip) isn't working right. Pin 8 stays low no matter 
    what pins 9 and 10 do and the motor enable led doesn't light up but the
    heads still rotate. This has been a viscous circle and its time to
    almost go home. We did call speed fam but when they returned our call
    the rep was at home, didn't have prints, and wasn't supposed to be on
    call so he suggested that we just bypass it. Not enough work to justify
    that.  

    The wafer detection problem still exists.  It is strongly believed that
    the wafer detection board has a problem, but it could also have wiring
    or 24V power supply problems.  This is due to the fact that B1's board
    also showed a red LED was lit (yup, the sixth LED down).  A board,
    cable, and technical assistance should be here tomorrow or the next
    day.  And yes, B2's board would NOT work in B1.
    
    Currently, the wafer loss detection circuitry has been by-passed for
    now.  The system is in Wet Mode.  NO product should be run without 
    approval.  Start with Tim Dyer should a manufacturing need arise!
    
    						Tim  /  Doc 

    The parts arrived this afternoon for the wafer detection circuit.
    Please hold off on installing as we will have the reps perform this
    task tomorrow.  Yes, the board is bad, but something deeper is 
    taking it out.  We have already lost two boards this week!
    
    					Doc
    

CMP.B2 - Down for problems w/ the wafer detect, rotation errors on head #1, and
	 intermittent problems w/ the gripper.  Speedfam reps were on site
	 addressing these issues.  A board for the wafer detection system was
	 replaced and some wires on Terminal boards were found to be loose. the
	 problem appears to be fixed and the tool is now at verify.  The Reps 
	 will return tomorrow morning to continue working on the other issues.

    
    
    
            Carrier #3 was not able to load the wafer everytime.  
        After checking the alignment, we found the head to load 
        was out 1/2".  How it got that far??  After a while the
        load cup #3 was misloading.  The dowel pin was pushed in
        and was barely holding the cup straight.  The cup had rotated
        a little and the load flipper arm was hitting on the way
        down.  The pin was pushed back out and the other cups were 
        checked as well.
    
            Later this morning, a wafer from #2 slid out and took out
        carrier #1.  The head was checked and no problems were 
        observed.  The mess was cleaned up and the tool is ready for
        break-in.
    
                                              D shift

    
    * Vacuum system Upgrade:
      ---------------------
      The Speedfam reps removed the check & needle valves from the pnumatic
      cabinet and replaced them with a solenoid bleed-off valve & filter.
      The vacuum has increased from 24 in/hg to 29.5 in/hg.
    
      They are planning to perform the same upgrade on CMP.B1 Tomorrow.

    Last week we noticed that the pad condition spray station rinse
    (dig-out 53) wasn't coming on at all. This is the water that fills the
    dog dish. On B1 its continuously flowing which makes sense but on B2
    its always off. Last week I turned on dig-out 53 and the rinse did come
    on and overflowed. This week its off again. I turned it back on and
    then changed recipes to see if thats whats turning it off and it is. I
    checked the hardware enable screen but there's only "pad condition
    rinse - on/off" there and this controls di to the spray nozzle on the
    conditioner. The control for this must be in dos. If someone turns it
    on please put in notes how you did it. 
    
    						B shift

    Scratches on wafers. MQC's ran twice. Ran a wafer into load cups and
    out with no scratches. Changed pad and cleaned conditioner. Ran carrier
    blow off, rinse and rotated for about an hour. During the blow off,
    after I finished reassembling the conditioner, I put the arm back down
    using the service screen. This makes the multihead move back to the
    pad ( I didn't know this ) and blow remained on. After moving the
    multihead back to the index table the pad was inspected and a few black
    pieces were found on the pad. They looked liked bits of wafer. These
    were cleaned off with the di gun. After blow off was turned off the
    multihead was moved back to the pad. The water in the index table and
    the area around the second table had alot of tiny black pieces that
    looked like wafers. The water was drained and the table cleaned.
    Breakins are running now and mqc's should be done soon.
    
    						B shift 

    Came into today to find the system still scratching wafers.  Some
    expirements were run (see Tim D's shift passdown for indepth details).
    We decided to change the pad, empty and clean the index table, remove
    and clean the carriers (totally breaking them down), flush the blow off
    out, and scrub the system real good.
    
    Found debris (silicon granduals, etc) inside the carrier gimbal area.
    Thouroughly cleaned them out and re-assembled.  Reran breakin and
    MQC's on the new pad & carriers.  One small scratch was found on just
    one wafer.  The system passed MQC's and is being returned to
    manufacturing.
    
    				The entire A shift
    

-------* Carrier #3 failed to rotate, errored on the screen,dcx board and 
	 the infranor.
	
	   - checked the connectors on the infranor, looked good.

           - checked the ribbon connector on the dcx board, looked good.

 	   - swapped the module in the dcx board with the one from position
	     #6 on the board, carrier #5 rotation, no change.
 
	   - swapped the infranor with one found in the cabinet, no change.

	* Released the system back to production with carrier #3 disabled
	  do to the critical need for the system.

------* Carrier #5 is running with dummy wafers do to high uniformity 
        10.6%. Another mqc will be run when time allows.

	 		
					B shift


	   

	Scratches returned, but was traced to contact with cup/carrier, Cup 3 
down sensor was replaced. Rotation problem linked to bad cable see Tims 
passdown. System running 4 heads until wip is lowered. System passed its last 
MQC. A second MQC is currently being run at P Eng. request. If this fails refer 
to Tim's passdown.


IF THERE ARE ANY HARDWARE PROBLEMS ON B2, PAGE DARREN, 800-823-6094


					A shift

    
        The Carrier #1 not rotating error has been popping
      up just before the carriers go to pick up the wafers.
      Assists have been logged lately and I spoke to Darren
      about this.  A possible dwell time is a possible problem.
      I logged the warning so the million assist will cease.  
      This will have to be taken care of ASAP.
    
         A wafer crash occured in the early morning.  An exercise
      wafer slid out of head #1 (uh oh) and slammed #5 product
      wafer.  The tool was cleaned up and break-ins were started.
      The moose mating call was evident at the beginning of the 
      polish cycles.  The slurry flow was checked at 700 ml/mn on
      both pumps.  #1 came in at 500 ml/mn and #2 at 600 ml/mn.  
      We looked into the slurry lines around the pumps and they
      were very worn.  We replaced the lines and the flows came in
      at 700 ml/mn on #1 and 775 ml/mn on #2.  Break-ins were started
      back up and Bulwinkle wasn't seen nor heard.....
    
                                                   D shift

	Slurry died again.  Ball valves opened to provide more slurry to the 
end of the line (b2). See Tims passdown if it happens again. Slurry delivery 
nozzle broke, Brad poly weld and reinstalled. System is currently up and 
running 4 heads. Head 3 needs rotation cable repair when manufacturing puts
    the system system down after B1 comes up. 

					C shift

    
    
      The monthly PM was started but not finished.  They can't
    give up the tool at this time.  The completed items have been 
    notes in the checksheet I placed.  
    
      The carrier #1 not rotating error has not been seen all of
    D shift.  Was this repaired?  If so, please remove the WARNING
    on it.
                                           BJ

    CHANGED THE RESOLVER CABLE FOR ARM 3 ROTATION....IT IS NOW AVAILBLE FOR
    USE....
    IN RESPONSE TO THE CARRIER 1 NO ROTATION...THERE IS NOT ANYTHING I CAN
    DO ABOUT THIS RIGHT NOW....WE HAVE TO WAIT UNTIL THE NEXT REVISION OF
    SOFTWARE IS AVAILABLE..SORRY

    CMP.B2 - Down for a crack in pump #1's slurry line.  The reps. already had the
	 slurry line replaced by the time I got in. Production let us keep the 
	 tool long enough for the reps. to change head 3's  faulty rotation 
	 resolver cable and finish the monthly PM.  Tool is back to production.

	 Came in tonight and found that carrier #5 was not rotating
	 during wet mode.
	 Found the power light on the Infranor for carrier #5 rotation 
	 wasn't lit. Checked all the connections, they looked o.k.
	 Replaced the Infranor with one from the cabinet. When we flipped
	 the breaker back on the Infranor smoked and the breaker tripper
	 off. Now the breaker (CB6) won't reset and we believe that power
	 supply (PS4) may be blown. 
	
	 The original Infranor is back in the system, not connected and
	 the power is off. The carriers are in the load cups wet.
	
					B shift

	   

	Problem: Breaker 6 trips when system is powered on. Removed connector
xa3 from power supply to isolate 310 volts supply from load. Breaker still 
tripped immediately on power up.  Removed connector xa1 from 310 power supply
and cb6 did not trip. Replaced power supply and installed a new high current 
motor controller (Infranor, crt12) to replace the original motor controller 
which had errored last night.  

Please note: High Current Infranors are used for carrier rotation, and Multi 
Head.  Low current Infranors are used for carrier oscillation. 

Tested fix by running 25 wafers, first five wafers had errors at flipper 
gripper at prealign station, next 5 ran fine, then 3 errors, then rest of the 
lot ran fine. Looks like gripper is intermittently sensing that the 
gripper is closed. Maybe amplifier adjustment or sensor position is on 
the edge.

All wafers ran fine at the multihead and polish table, no Infranor errors. 

System still down for intermittent gripper errors at prealign. 

310 volt power supply and low current Infranor tagged "bad". Original Infranor 
tagged "needs verification"

    
    
        Several times there were near crashes on head #5.
     There was some loading problems with the flipper as well.
     Checked out the loading and it was fine.  I found #3, #4 
     and #5 heads out of alignment (#5 was out 1/2" again).
     Brought all (5) heads in perfect.  Will speak with Reps
     about why they keep drifting out of alignment.
    
                                 BJ

      Busy day on this baby..........

      The system was misloading wafersfrequently, mostly on head 5.
      So, the system was run using the infamous "NO_TOUCH" program.
      Right off the bat, head 5 misloaded due to the load cup not
      quite making it to it's loading destination smoothly.  It 
      raised up about 3/4ths the way, stopped there for a second or
      two, then jerked up into load position.  So, the lift cylinder
      was wiped clean and lube'd with Braycote.  The lift regulator
      pressure was put back to 45 PSI (found it <40).  The cup lift
      movement improved to where we thought this might be acceptable.
      
      Next, we tried again, and lo and behold, the Index table messed
      up.  Found that when the plexi doors were opened then closed, 
      the index table would jerk when the DCX boards/contactor kicked
      in.  When this happened, the home position for the table would
      be askewed.  It's possible this may have happened last night as 
      well, due to the heads being way out when checked by D shift.

      Upon looking it this, we checked the following things:

      -  DCX board connections (good)
      -  Swapped DCX modules (no daughter boards available)  (no change)
      -  Swapped Infranors with a known good one  (no change)
      _  Checked, cleaned and re-gapped the Index Table home sensor  
         (no change)
      
      We then tried homing the table.  It repeated proper home position
      every time.  We shouldn't have a problem with running in auto-cycle
      as the table home sensor is checked prior to every load sequence.
      We will investigate later on to why this is occuring.

      So, next we re-visited the cup alignment.  Sure enough, several
      heads were out, ALL in rotation adjustment rather than head in/out
      movement.  So, we tweaked these heads in.

      Upon re-running, load cup 5 began to fail again.  Therefore, the 
      system will have this head dis-abled until a new cylinder arrives
      (due in tomorrow at Packaging Plus, right down the hill in the
      Shaws shopping center).  The fifth carrier is up by the sink, 
      keeping wet.

      			many contributors (A & C shift, Tim, Earl, SFam)

    CMP.B2 - Down for load cylinder #5 sticking.  The system was returned to 
	 production yesterday w/ carrier #5 not enabled due to the air cylinder
	 sticking.  The part came in around noon and was installed, height was
	 checked, and forty wafers were ran to verify that it was working 
	 properly.  The pad was also changed and the tool was wiped down by 
 	 production due to a particle problem.  The tool was returned for MQCs.

 
    
            this is for CMP.B2 not B1.........
    
             <<< ASDG::DISK$SYS_DATA:[NOTES$LIBRARY]CMP.NOTE;1 >>>
                                    -< CMP >-
=============================================================================
    Note 19.68                   CMP.B2 EE/PE PASSDOWNS                     68 of 68
SUBPAC::CMP                                           2 lines  27-JAN-1996 15:01
                               -< replace cyl. >-
--------------------------------------------------------------------------------
    CMP.B1 - Replaced the cyl. for load cup5 ran wafers, at this time the
    cup is coming up and loading wafers.   SF

	A wafer slid out of carrier #5 at the begining of our shift,
	it didn't break. We check:

		Carrier to load cup height alignments, o.k.
		hub to load cup alignments, o.k.
		table repeatability, o.k.
		load flipper to load cup alignments, adjusted 25 steps back.
		 	
	Ran 75 wafers when an error began to appear "wafer not present
	at load flipper", it was there but the flag didn't see it.

		Adjusted the flag to the right slightly.

	Ran 25 wafer when another error the table and all the carriers 
	stopped. No error on the infranors but dcx board #2, led #3 and
	5# lit. 

		Powered down the system and restarted. Didn't have a
		chance to test after that.


					B shift

	   

	System ran fine today until after glitch. Around 5pm Jim complained 
that his touch up recipe #1 caused the polish table to stop turning when the 
Multi head moved out to polish, and carrier rotation started. Carriers would 
descend then with the carriers on the pad the table would try to start, 
rotation, but error out for "inverter error".

	Program looks fine, tried "notouch" program and table works fine, we 
are about to try to edit this program to a touch down program, excuse the pun 
cowboy fans.   
    
No gripper problems today.

	A wafer slid out of carrier #2, no wafers broke. Production 
	wanted to finish processing the lot running so we removed 
	the carrier and disabled head #2. The carrier is in water 
	on the table next to the sink, it looks o.k.

					B shift

	   

    CMP B2   16:40
            Due to a lurching of the index table which seemed to cause
    a possible load error on carrier 2,investigating to find out why.
    Checked voltage on infranor, swapped infranor power supplies, reseated
    cables on motor. we have a motor ordered which will arrive in the A.M.

Carrier 2 lost wafer at polish on b Shift. Checked carrier two for defects 
exposure ect. aok.  

	* reinstalled carrier on b2 
        * checked flipper load to all cups aok 
	* manually loaded 15 wafers found no problem 
        * loaded 15 wafers to carriers, no problem, 
        * ran 3 run of no touch down program, no problem, 
        * Polished 15 wafer in program #42, no problem
       
	Returned to manufacturing and system tossed a wafer from head two on 
        touchdown first run. Carriers one and two are history. 3 good carriers 
	are in water, Tim asked if you would change the water to prevent 
        bacteria growth in the during the night.

	* Installed cup to carrier alignment fixtures and "homed table" and
          performed alignment.  All cups were out in the index table ccw 
	  direction with heads 4 and 5 needing compound adjustments ( carriers 
          in). When I had it aligned, tested by moving multi head out and 
	  exercising the carrier arms. Returned to load and all alignments held.
	  
	  Reps joined the party at this point.

	  Index table was homed and position rechecked.  The Bloody Index Table
	  had drifted.  
	
	  Tim joins the fun and we verify that the calibration data is actually 
	  being stored in the DOS files.
	  
	  Reps check with factory who confirm a know software bug " index 
          table can only be safely calibrated in CW direction". If CCW 
          direction is used it subtracts the number from zero changing your 
	  home position instead of adding or subtracting from current position.

	  We over compensated in Index table CCW direction, Homed table,  then
          brought it back into alignment with the CW direction. Our success 
          assured, we homed the table and found THE @#*%# table drifted again.

	  Table is still jumping when DCX is intit /interlock is opened. 

	  Last Friday the infranor and DCX boards were swapped without success.
          So Tim has requested that the reps fedx a new index motor which will 
          be here tomorrow. 
	
	  ETCH tech have lent us a oscilloscope. We measured the infranor IDC 
          pin 1 and 2 per Darren. We found 2 volts of noise/sine wave, this 
          does not appear on other infranors on B2, nor is it on the infranor 
          for B1 index table. We unhooked the 25 pin connector from the dcx and 
          the signal cleared up. Dan and rich are now tracing back to DCX board
          swapping cables trying to get the bump to move to motor #10.

	  I cleaned up the broken wafer just before I changed aligned the table
          but i have not got to the pad change yet, torn off it by CMP.A1.

	
						A shift

    CMP.B2     SpeedFam
    
          installed new motor and we found that it indeed cure the shakes
    will continue to test and recalibrate.
    

    Come to find out that the new index table motor installed this morning
    has NOT solved the jerking problem.  It most definately still exists.
    Many things were tried today to isolate the problem.  New motor, new
    cable, different DCX boards, different DCX slots, DCX power supply
    swapped, etc.  The problem "appears" to be within the VME interface.
    
    We did some ground checks in several places.  Those are at the
    Infranors, the incoming power ground wire, the transformer in the
    pipe gallery.  Also checked the nuetrals and hot connections in the 
    transformer.  All connections were tight, except for a couple of the
    Infranors.
    
    See Tim's passdown for any additional instructions on the tool.
    
    					A Shift
     

    CMP.B2     SpeedFam
         well we thought we had it,but the problem continued to pound us.
    we checked noise levels, grounding and even tried another DCX board.
    At this time we are going to order a power supply, and the  2 cables
    for the motor.

    CMP.B2    SpeedFam
         well were almost there with the tool. Things done today were,
    check circuts for the noise, and looked at a voltage difference
    at MC6 conntactor. Found that after tracing to infranors that the
    one that was swapped last week for the problem was also bad in the same
    way. the tool was calibrated with some fancy cuss words and a little
    excitement. At this time the tool will be able to run with heads 1-3
    until the infranors come in tomorrow.

CMP.B2 - Down for the index table jumping after an interlock was actuated.  The
	 problem seems to have been traced to two bad infanors that will not
	 maintain auxillary power.  Four new infanors are on order.  The
	 alignments for the load cups have been completed but the tool still
	 needs to be cleaned up, new pad and, the three still good carriers 
	 need to be installed.

    CMP.B2     SpeedFam
         Almost there with the tool! last night the scrubber motor was
    taken because B1's died, so we installed the upgrade while the tool
    was down and we had a Rep. from infranor arrive to give some info about
    the operation of the little beasts. Need to adjust the calibration on
    the scrubber and run wafers.
    

CMP.B2 - Down for the index table jumping when an interlock was actuated
	 (waiting for parts).  The infranors came in around 11:00am along w/
	 a rep. from infranor.  The infranors for carrier rot #4 & #5 were
	 swapped out with the new parts.  The problem with the table jumping
	 has went away.  The infranors Irms values going to the motors for all
	 the infranors on both tools were adjusted under the recommendation of
	 the Rep. were as follows.  All of the carrier rotation Motor controll-
	 ers were tweaked to 9 volts (checked at test point 6 on the controll-
	 er).  All of the rest of the controllers are set to 10v.  The only 
	 exception is carrier rot #1 on CMP.B1 this one has been set to 13v
	 because of some carriers not rotating errors.  If these errors occur 
	 again the infranor should be adjusted to its max and if the problem
	 persist Tim Dyer and Daniel (Speedfam) should be contacted and the 
	 Infranor swapped w/ the one in Speedfam's office.  The scubber was
	 also upgraded and calibrated. 50 wafers still need to be run to verify 
	 proper handling and scrub operation.  Then Tim wants the pad changed
	 before the tool is returned to production. 
	 

        The tool had run 25 wafers without problems with ANYTHING.
     While running the last 25 wafers, I noticed the RPM's on the
     scrubber was way too fast.  I checked the RMP setting on both
     tools and it was the same, 300.   I changed B2 to 100.  The
     pad was removed and break-in's were run.  MQC's passed fine.

                                   all set......       BJ 

	We had a problem last nite with the scrubber on B2. The
	brushes would not spin. We checked all the connections
	and the input voltages. We found that the motor was not 
	getting the 50 Volts. We tried checking continunity from 
        the motor to motor controller #18. No continunity. We tried
        bypassing the cable by running a set of jumpers from the 
	controller to the motor and we were able to get the motor 
	to work. The cable must have a break in the wire and needs 
	to be replaced.
	
	Since we do have the Ontrak scrubbers we didn't feel it
	necessary to "Down" CMP.B2

					B  Shift

    A couple of problems with the system today...............
    
    -  The scrubber brush rotation problem is indeed due to a broken 
       wire within the liquid-tight flex tube, just as B shift indicated.
       This problem has been a major pain in the buttock on B1 in the 
       past.  This is the first occurance of this problem on B2.  As
       long as the design/wire used remains as is, we can expect this to
       happen several times a year.  
    
       The reps had just recently installed an upgrade to this scrubber,
       which I believe happen on Friday.  New wiring was suppose to have
       been part of this upgrade.  Notes entered on the scrubber upgrade
       do not reflect if this was actually performed or not.  So, the
       status remains the same, with the system running minus the use
       of the scrubber.
    
    -  Problem # 2 for the day occured when the system errored for "Main
       Vacuum Low" alarm.  Found the pump to have shut off.  Checked the 
       breaker, low and behold, it had NOT tripped off.  So, began to
       inspect the pump/wiring for obvious problems.  Bingo!  Found a 
       wire, and it's connector, burnt to a crisp.  Cut back all the 
       burnt portions.  Re-attached the wire using a butt connector.
       The pump ran well after that.
    
    -  Upon repowering the system, twice in a row we got an Inverter error
       during initialization.  Both times, it was CB #10 (15 VDC power
       supply breaker) that had kicked off.  Reset the breaker one more
       time, and the system run fine.  Not sure as to why this kicked off
       twice.   
    
    						A shift
    

	* The scrubber wouldn't rotate.

		Replaced the cable and installed a molex connector.
		Re-routed the water line so that there is more room
		for the cable.
					B shift

	   

    CMP.B2     SpeedFam
         Just want to let everyone know about the scrubber fix done on
    Friday, we replaced the motor to the unit because it was used to get B1
    up and running, also the cable was replaced on Sunday due to the old
    one breaking, THIS IS ONLY A PARTIAL UPGRADE.....We will be completing
    the upgrade this week as work permits. For those interested, the rest
    of the upgrade {should} take about 3 hours.
    

CMP.B2 - Down for srubber upgrade/pm. The scubber upgrade is complete but pm 
	 needs to be finished.

       The tool needed 25 more wafers run for the scrubber
   upgrade.  The weekly PM was done already so that didn't
   need to get done.  Everything ran fine except the tool
   failed MQC's for particles.  We cleaned the entire polish 
   table area and MQC's came in.

        While cleaning tool, we noticed a loud vibration coming
   from the vacuum area.  It ended up being the pump capacitor.
   Actually, the bracket that holds it down snaped off.  The 
   cap didn't need replacing so I'll check with the Speedy guys
   and see if they can get one shipped out to us.  The cover to  
   the cap is on the tool box.  Please don't toss it....

                                       D shift


                                                   

    CMP.B2     SpeedFam
         Just want to let everyone know that the scrubber upgrade is
    completed. For those service related type guys, the motor has a new gear
    ratio (11.5-1) and the IN and OUT sensors are now located on the side
    of the tub, and are connected to BB11 pins 18 & 19 (DG in 88 & 89) and
    power is located on the lower part of the BB strip.

CMP.B1 - Down for high particles/scratches.  The pad was changed and the polish
	 area was cleaned with a brush.  The index table was drained and wiped
	 out. The PVA brushes on the scubber were swapped out with new ones 
	 from stock.  The conditioning arm was disassembled and cleaned and 
	 operations rechecked the MQCs.  The particles passed and there were no
	 scratches but the uniformity failed on head #3 at 10.8.  Production is 
	 going to run some more wafers and it should come in.

    
    * Transfer Paddle interference:
      ----------------------------
      The Transfer Paddle is interfering with the 2 teflon bars that were
      added to the scrub station as part of the recent scrubber upgrade.
      The paddle contacts the bars on its up stroke. This causes the wafer
      to jump-up approx 1 ".  It appears that a minor adjustment will 
      clear-up this problem.

    The thumb screws for the wafer support stantions in the scrub station
    were loose. These were tightened and clearance between the teflon bars
    and the paddle was checked and found to be ok. However when the tool
    was checked a couple of hours later the left teflon bar and two wafer
    support rings were in the base of the scrub station. They were put back
    on without interrupting the unload cycle. When the paddle lifted up the
    next wafer it indeed appeared the paddle was hitting the left teflon
    bar. When ops was finished with tool the was checked. With out a wafer
    in the scrub station the paddle was raised and had plenty of clearance
    on both sides. A wafer was installed and ran thru a scrub manually.
    When the paddle came up the left teflon bar lifted. There is no
    clearance between the wafer and the teflon bars so the action of
    scrubbing them creates a vacuum between them. The teflon bars were
    flipped over as a temporary fix for now. 
    
    						B shift

    
    This morning.............
    
    	A wafer slipped out of head # 5 during segment # 3.  Wafer
    detection did it's job and shut down quickly.  No wafer breakage,
    nor pad or carrier damage was exhibited.  The Opt's folks rebooted 
    the system and unloaded the remaining wafers manually.  They just 
    resumed running the system, which ran fine for the remainder of the 
    shift.  
    
    						A shift
           

	* While the system was running 3 banging noises came from
	  polish table, it was the drive belt slipping. By the
	  time we got to the system the banging had stopped and the
	  system seemed to be running fine. On the next run 
	  the multi-head went to the polish table, slurry began 
	  to flow. When the carriers began to drop (segment #3)
	  the slurry flow stopped, the system was EMO'ed.

	  The program that was running was I_O_ILDA #33. We checked the
	  program, the slurry flow was correct. We checked the slurry  
          using the manual polish program, it looked good, no leaks.
	  Ran 25 dummies using the I_O_ILDA program and everything 
	  looked o.k. We believe the slurry flow stopped due to
	  a software problem and was cured by the re-boot.
 
					B shift

	   

    CMP  B2    SpeedFam
         I saw the note on the teflon bar lifting on the scrubber. The
    drawing shows the bar to be installed the way it was operating but
    if the tool runs better this way then we will let it run and I will 
    ask about whether the drawing could be incorrect. The bar is there 
    to keep the wafer from falling into the lower part of the tub if it
    were to slip off the flipper.
    

Entered for A shift.
    
				CMP.B2
                              ==========

      The system is currently DOWN as scheduled equipment, in the
      competent hands of Process/Equipment Engineering, for the 
      purpose of qualifying the second polish table, the blocky
      diamond, etc.  The system should remain down until released
      by either Frank or Tim.

      Some things that took place today.........

      *  Arm Oscillation Calibration was performed.  This procedure
         is to set up the arms such that they oscillate out to the
         same physical position on the polish table.  The arms were
         just slightly out, but the proper adjustment was made to
         "fine tune" the arms.

      *  The Monthly PM was performed this afternoon.  No problems
         were found.

      *  The pad and all carriers were changed out at this time.  
         This included a major clean at all the stations to remove
         a plethora of slurry buildup.  

      *  I don't have the specifics at this time, but Frank was
         making some changes to recipes.  

      					A shift and Guest

    CMP.B2     SpeedFam
    We finished the scrubber upgrades, so now B1 and B2 are completed.
    

    
    * 2nd table process released:
      ---------------------------
      Frank Krupa has completed characterization of the 2nd Table process.
      The tool has been returned to Manufacturing. See Frank's message
      for details.                

 
         A wafer slid out of head #5 for no known reason.  The handling
     looked ok on the next five wafers which were run as MQC wafers.
     If another slide out happens, further alignments will have to 
     take place.
                                          D shift
     

CMP.B2 - The tool lost a wafer from head #5 this morning.  It broke, so the pad
	 was changed, alignments checked.  All seemed okay except for the inner
	 portion of the load cup was sticking alittle.  The same was
	 disasembled and sanded. The tool slipped another wafer later in the
	 afternoon this time it lost at touch down so this time it seemed to
	 be loading problem.  Load cup #1 & #5 were swapped to see if the
	 loading problem follows the cup.  This is still to be determined. The
	 tool also had a problem w/ scatches on wafers in head #5 earlier today
	 and this problem followed the load cup to position #1.  The load cup
	 was inspected and there are a couple of embeded particle in the cup.
	 Ran out of time. 	 

     Several deep pieces of wafers were into load cup #1 and #5.  
  Everything was cleaned up and a MQC particle check was done.  
  The tool passed uniformity and particles with no scratches.
  The tool would of been up by 9pm if there were MQC wafers 
  available.  
     
       During polish, the slurry flow went to nothing.  
  We pulled the slurry filter and found a lot of crystalized
  slurry and but not as bad as last month.  Installed new
  filter and checked slurry flow.  all set.....

                                          D shift

                                                                       
    * Wafer Breakage:
      --------------
      The system flew a wafer out of carrier #5. We found broken wafers
      on both the primary & secondary tables. The system was stopped in
      segment #7 (lift off). Gwen noticed 2 error messages after the crash,
      "Invertor Communication" & "Main Vacuum Low".
    
      We feel that the first wafer broke during 2nd table clean. The system
      must have unloaded 4 wafers and loaded five more. It then moved to
      the polish table where a wafer flew out of carrier #5 & broke.
      In the end, 2 wafers were smashed at 8 were severly scratched. 
      Nine product wafers & 1 monitor were scrapped.
    
      B shift, please finish the clean-up activity and wait for the
      Speedfam rep (Tony) to arrive with further instuctions. We expect
      him to arrive at 8:00 p.m. tonight.
      
                                                               C Shift.
      
    

	  At the end of "C" shift a wafer broke on the secondary 
	  table. The system was cleaned, carriers re-installed and
	  a new polish pad installed. Tony was here and checked 
	  the system out, nothing looked wrong. Process Engineering
	  changed the recipes so the secondary table will be by-passed
	  until monday morning.

	  This morning after running 85 breakin wafers the system left 
	  an MQC wafer on the pad after polish from head #3. We believe 
	  that lifting the carriers from the center of the pad is creating 
	  a vacuum between the wafer and the pad causing a wafer to stick 
	  to the pad. Need to talk to Engineering about moving the lift-off
	  position out or in. The system is up but needs MQC's.
 
					B shift

	   

            
	Head 2 threw a wafer during touch down on the pad, prior to 
        release of vacuum. Wafer broke and took out one carrier. 
	We took the system for checkout. Installed alignment posts 
        and verified carrier to cup alignment, arm 4 needed to come out by
	320 motor counts. Head 5 was moved out 64 counts. 
	We then verified cup height alignment on all five heads at 
        there respective carriers. They were fine
. 
	Next we verified flipper load calibration.  Slight adjustments 
        were made at the flipper to load cup cal.

	15 volt power supply tripped twice while rebooting system.
	
	We removed all tape from all interlocks. The process door 
        switch was bent such that when the door was closed it would not make 
        the sensor.  Sensor block was removed and repaired. 

	Slurry dispersion tube was clogged. Removed said tube and 
        cleaned clogged.

	Jesus ran first five breakin wafers fine, on second load system 
        miss load wafer to head 4, did not pass vacuum check at pad. 	

	Head 4 seems to be coming later than the rest, and then 
        jerking up to the carrier.  

        Scratches are present on cup four hole in index table.  We are 
        attempting to remove then before adjusting pressure at cup up 
        # 4 solenoid.


					A shift

	The system was down do to a wafer being mis-aligned onto head
	#4 at the end of "A" shift. 

		We checked:
			
		- cup #4 up/down motion, it looked good.
		- spindle to cup #4 alignment, it looked good.
		- had to adjust the load flipper to load cup 15 counts 
		  because the wafers were floating out of the cups. 

	Replaced the pad do to a bubble under the pad.

	Ran 110 verification wafers then MQC's. On the first MQC 
	the system passed uniformity but failed for a scratch (?) 5.3 mm 
	on head #1, the second MQC passed.

    **** We noticed when the unload flipper goes to pickup the wafer out
	 of unload cup #1 it is to low, it still pickup the wafer, barely.

	 We found that unload cup #1 has a load cup piston plate.
	 It's about an 1/8" bigger causing the cup to raise to high.
	 This needs to be replaced as soon as possible, we have
	 none in stock.
				B shift

	Head 5 threw a wafer. It did not break. Wafer loss detector 
        picked up the loss. But vacuum sensor did not detect.  
	Tim requested that the vacuum sensor trip point be turned up 
        to 21" hg. We tried to do this but there is a difference 
	between  the turn on threshold value vs turn off threshold 
        value.  We needed to spit the difference to prevent false 
        alarms. 


		The sensors are set to the  following values

		Head		detects loss    detects vac
				

		1		18("hg) 	22("hg)       

		2		18("hg)     	22("hg)       	  

		3  		18.5("hg)      	22("hg)        

		4		18("hg)       	22("hg)       

		5		18("hg)		22("hg)

	
	Cup 5 outer ring is not retracting after being depressed when 
in it index table hole.  Movement is free is its removed and hand 
held.  Feeling is that the outer shaft of the cup is binding. Load cup 
4 also exhibits this to a lesser degree. Load cups 4 and 5 were 
swapped. Load cup 4 works fine in index table hole five position. Load 
cup 5 still binds in index table hole 4.  Were added to the base of 
all load cups, during which time it was observed that the screws/springs 
on cups 3 +  5 were backed out two far preventing compression of the 
springs. This was fixed. cup 5 outer ring still stuck.  Dual springs 
were placed on all 3 screws for cup 5. It still stuck.  It was 
disassembled, but movement was fine.  The cup was mic'ed and is in 
spec and reasonably true.  Tony will check it in other 3 remaining 
holes and possibly sand it down some.

System still has one 21 hole carrier. it needs to be swapped with the 
29 hole carrier which is labeled and on the ss table near the 
changeroom door.
					A shift

	- Head #5 was taken off line by field service do to load
	  problems. Parts are on order to repair the cups. A warning
	  has been put into RTC.

	- Swapped the piston plates for unload cup #1 and #5. #5 is
	  off line and #1 had the wrong piston plate, it was a load
	  cup piston plate. 

		** Unload #5 now has the wrong piston plate, it will need
		   to be replaced when the parts arrive.

	- On the 5th run after completing the polish cycle a wafer became
	  mis-aligned on carrier #4 giving use a vacuum error on all 4 heads.
		
		We believe it was a pad to wafer suction problem. Re-aligned
		the wafer and restarted the system.
  
	- We ran 120 wafers after that with no errors. The system past MQC's 
	  at 1:30am, and has been running product since then.

		                 		B shift

	Load cup five was disassembled and sent out for truing. 
        Received shaft five back and reinstalled it with new inner shaft.  
        Cup five has been installed in the index table between lots, but is 
        still disabled. System is running 4 heads.  Cup 5 needs to be 
        qualified at next MQC. 

	All springs have been replaced on bottom of cups. 

	Unload cup one has had its peddle base replaced (mate for cylinder 
        pedestal).
       
        All load and unload pedestals are now the correct height. 
	
	All LOAD cup inner shafts have been replaced with new ones.

        The moisture sensor at the Fluids cabinet has been relocated to allow 
        for the new slurry bulkhead fittings.
 
	SEE Tim's PD.  If System loses a wafer he wants the system to 
        remain down, five new load cups are due in house tomorrow
	


					A shift

     The tool was running a hot lot and an error for the 
  UNLOAD flipper not picking up the wafer from the load 
  cup came up.  I verified the wafer was securely in the flipper
  fingers.  I hit a button to continue as it asked and the 
  paddle came up from the scrubber with a wafer and stopped.
  The UNLOAD flipper came in to do the slam dunk and did not
  stop at the "wafer drain" step.  It proceeded to head for 
  the paddle which was still up.  The tool was EMO'ed.  Circuit
  breaker #10 tripped three times in a row.

    Later, the tool was running and errored for "LOAD flipper
  did not pick-up wafer at align."  The load flipper would
  not home.  After an hour of troubleshooting, I gave Tony
  a beep to help me remove the flipper box.  We traced the 
  wiring back assuming the problem was the motor itself.  While
  Tony was removing the motor, it wasn't connected to the 
  drive shaft.  The collar itself was the problem.  I don't
  want to get into the details on what exactly was found but
  only to say that the screw in the collar was broke and could
  not be removed.  Tony is going to rush the parts in this 
  morning.  He's getting a whole new motor and gear box sent
  in.
                                       BJ  
  

    CMP-B2     SPEEDFAM
         We took the gear that was broken to the machine shop and had the
    old screw shaft removed and a new screw installed, now in the process
    of putting flipper unit back together for your processing enjoyment.

    
  Index Table & Flipper Box:
  --------------------------
    
            a) 10 new Load Cups arrived and were installed into the Index
               Table.      
    
            b) 10 new Dowel Pins were installed into the Load Cup Bushings.
               (New locking type with raised sides)
    
            c) All 10 Load Cup Bushings were honed to proper size before
               installing the new Load Cups. (We now have a new GO/NO GO
               gage for sizing the Bushings from Speedfam.
     
            d) The FLipper Box Motor Coller was repaired at Bryco Machine
               this morning. The broken screw was drilled-out the threads
               were re-tapped. (While you wait service..wow!)
         
            f) The Speedfam reps had prolems with the proper positioning of
               the spline on the Flipper Box Motor Coller. As of 7:15 the 
               problem has been resolved. They have installed the Flipper 
               Box back into the tool and are now aligning the Flippers to 
               the load/unload cups. 
     
            g) Brad has installed a new N2 Gun on the tool.
    
    
            From Tim Dyer's Passdown. D Shift, here's the progress thus
            ------------------------  far:
                  
            1) Install new cup locking pins           DONE
            2) Set ALL cup to carrier head heights    NOT DONE
            3) Align ALL heads to CUPS with fixtures  NOT DONE
            4) Align gripper to load/unload cups      IN PROGRESS
            5) Cycle 50 wafers through NO_TOUCH       NOT DONE
            6) Cycle 100 wafers through QUIK_TCH      NOT DONE

    
    

 
        We went through the fine adjustments on the load and
    unload flipper.  We had a rather tough time with the unload
    flipper but it finally came.  After 150 wafer verify, a new 
    pad and without any problems, it was turned over to OPS for 
    production.   MQC's failed bad for scratches and NO_TOUCH was 
    run and ruled everything out except the pad.  More wafers are 
    being run now for testing.

                                           BJ

      The tool had problems with scratches again.  This time they
    were straight and 1" long.  It was ok during NO_TOUCH but showed
    up during touchdown.  After more MQC's were run, the scratches
    went away???????

      The tool errored for Carrier #1 not rotating several times
    tonight.

                   
                                                BJ

                                                       
    CONDITIONER SENSOR PROBLEM:
    --------------------------
    The system encountered many "Invertor Timeout" errors This Morning.
    The Speedfam rep (Tony) was paged around 10:00 a.m. He found the
    Conditioner "Wheel to Table" sensor out of adjustment. The Invertor
    Timeout errors stopped after the sensor was re-adjusted.
    
    
    SCRUBBER TIMEOUT ERRORS:
    -----------------------
    The scrubber was failing to make the "Scrubber Down" sensor Today. This
    caused numerous "Scrubber Timeout " errors. Tony adjusted the Scrubber
    Down Sensor Sensitivity pot and the problem ceased.

	Wafer breakage on secondary pad.  Wafer Broke on head 5 which 
took out head 4 in turn.  Presume wafer became slightly ajar during 
liftoff and broke on touch down at secondary pad. Head 5 shows strong 
circular and straight patterned in carrier pad.  Head 4 shows only 
circular damage. Most of the fragments were found on and around 
secondary and index table. System continued until it tried to unload 
a broken wafer from cup four.  Some collateral damage occurred to 
wafers which were next to be polished (prior to unload error). 
Fragments of silicon made their way to the polish table and caused 
scratches on the five wafers at polish table. 	

Cleaned up silicon debris and scratched wafers from polish table.  
Removed/replaced both secondary and polish pads. Replaced carrier 5 and 4. 
removed and replaced ring from carrier 3.

Removed clog from both drains at secondary table.  Had inverter error 
twice on power up, found 15v ps circuit breaker tripped.  Tried to 
power up again but errored for " waiting for pad conditioner to home" 
error.  Trouble shot found inhibit sw for cond. home made, (open), and no 
power or errors at Pad Cond infranor but power was on to its power 
supply and other infranor on its loop..  Tried to move pad conditioner off 
switch but could not.  Reset breaker for infranor.  Jumpered inhibit 
switch and used DCX to manually move it off switch and tested home position 
sensor while in DCX mode aok. Tested inhibit switches with multi meter aok.  
Had numerous errors on power up. Including inverter errors and head 
five not homing. 

Found pad condition infranor would not boot up on initial power up but 
would work for one cycle of conditioner if circuit breaker was 
manually tripped and reset. 

Replaced Infranor. System Ran fine.


Broke pad in.

On first run with new carrier we received error of "One or more wafer not on 
carrier" at polish pad vacuum check.

Checked all carriers for misload found none  but two very close to the 
edge of the ring. Checked vacuum gauge found it at 22 which is 
threshold value for vacuum sense since adjustments last week. Acknowledged 
error and it ran fine. Next three runs ran fine. System is running 
breakin wafers.
					A shift

	The system was down due to a crash on "A" shift. Since
	there was no process person to run the Speedfam's we
	decided to do the weekly p.m.

	       - Repaired a water leak coming from under load cup #4's
		 air cylinder.
		
	       - Repaired a water leak under the elevators, found
		 2 fittings with the ferrules on backwards.

	Started running verification wafers and had an error " scrubber
	not arriving down". Found the teflon sleeve that connects the
	brush spin shaft to the upper brush station stripped. Found
	a replacement in the speedfam cabinet. We need to stock this
	idem. Also, when you put the top brush station on be sure to
	align the sleeve to the square shaft. 

		                 		B shift

       * The scrub station was timing out for not arriving home.
	
		Lubricated the rails and turned up the air pressure
		slightly.

       * The scrub station wasn't traveling up properly.

		Shimmed the upper scrub station Teflon collar and the
	        lower scrub station drive shaft with Teflon washers.
   

       * At 6:ooam this morning on the 2nd run of touchups a wafer slid
	 out from under carrier # 4. The wafer slid out at touchdown to
	 the primary pad, wafer detection saved the carriers. We checked
	 all the alignments for carrier #4, they all looked good. We checked
	 the flipper to load cup alignment and it was off. The wafer was
	 being positioned to far forward resting ontop of the loadcup rim.
	 We adjusted the vertical position of the hole flipper assembly
	 by using the 2 top sets of alignment screws. The alignment is
	 better but we called like field service in to fine tune the
	 adjustments. Field service was called and should be in between
	 7:00 and 7:30. 

	  
	 The pad and carrier #4 have been changed.
 

		                 		B shift

    
    	Vacuum error on first run of MQC wafers. Found no misplaced wafers,
    vacuum was at 26" hg. UnLoaded from manual screen and restarted wafers
    loaded and ran fine, Possibly semi dry films. System is down for pad
    change. Poor uniformity 
    
                       	A shift

        
    
        Came in having to replace the pad and carriers #1, #2 and #3
     for MQC's/wafer count related problems.  Between B2 and B1, we 
     pulled (4) built SpeedFam carriers off the shelf that gave us
     18% uniformity.  They are on the cart in the maint. chase with 
     two crashed carriers from B1.  After two pad changes, it failed
     again for MQC's at 8am.  Earl is working at it now.
    
                                              BJ

          Tool was leaving wafers on the polish table after lift 
       off and was causing vacuum low alarms.  This was an issue 
       before and was corrected in the segments.  I called everyone
       in process that work with the tool and got no call backs.  
       We gave a pad change a shot and it seemed to have worked.
       the tool passed MQC's and is running product without any
       problems.
                                            BJ

    	The load flipper wouldn't move. Had to reset the computer.
    
    					B Shift
    
    	

         The slurry filter became clogged during the polish
      cycle of a production run.  The table dried up and caused
      the table to over-current and stop the machine.  The filter
      was taken from A1 since there was none in stock and the flow 
      was checked.  I had OPS run MQC's to verify there was no
      damage to the pad or tool and everything checked out ok.

                                                    BJ

       After the system was done carrier/wafer rinse on the first
     (5) wafers in the run, the index table failed to go to the
     proper location.  It appears a process door was opened while
     it was indexing and caused it to stop indexing.

                                   D shift

             
CMP.B2 - The tool had a problem with scratches on wafers from head #1.  The
	 load/unload cups were wiped out and the index table drained, the 
	 carrier inspected and the final polish pad was changed out to adress
	 this problem.  Still had what appeared to be scratches but process
         found it to be dried slurry.  Tool was allowed to run.

i

 
       System left a wafer on the table after lift-off (4) times
   tonight.  It only happened with PMD lots, not with metal lots.
   With all of the problems we are having right now, we decided
   to put the PMD's on the back burner and just run the metal
   lots on it.  A pad change fixed this problem last week.
                                               
                             
                                                     BJ

	The unload flipper wasn't picking up the wafers out of 
	unload #1 & #3. Had to calibrate the unload flipper 10 
	steps forward. 

		                 		B shift

          System failed twice for scratches.  Found the top
      outside cleaning brush had fallen off its mount and
      was inside of the tub.  How long it was there is the 
      question.
                                  BJ

    
    * Unload Track #2:
      ---------------
      The system has been double slotting wafers on track #2 all day.
      Ops has been running the tool one cassette at a time to avoid 
      this problem. We ran like this due to CMP.B1 being down for the 
      cable upgrade. D Shift will work this problem as soon as B1
      sucessfully completes MQC's. D shift suspects the water level in
      tank may be incorrect. 

At the end of D shift, the Opt people put a warning on the system for 
physical damage that occurred in the polish area.  It appears that a
polypropylene flap (a flap that shields the MHTA rails from slurry)
was snapped off.  It in turn wiped out four slurry drain tubes from
the top slurry drain ring.  This, coupled with the three previously
broken tubes, left us with only two remaining tubes.  We can not 
afford to block off ~80% of the drain system.  I was unable to find
the proper fittings in stock, therefore, I have "improvised" to the
best of my ability until we can procure the proper material.  So, I
have inserted seven (7) 1/4" PVC nipples into the ring.

It's more than adequate, in fact, it may be an improvement in keeping
the polish area clean.  The original tubes didn't extend low enough
into the bottom ring to properly contain the slurry waste.  The newly
installed nipples DO extend into the ring, preventing the slurry to
be flung to the polish area walls.  Oh boy, I can see my $500 cash
award for process improvement coming in the near future!  

By the way, please do not use these PVC nipples as turning handles.
After all, the table does weight ~800 lbs and it IS only PVC fittings.

			      			Doc

Mid-afternoon today, the system majorly vibrated such that the EMO
was hit to prevent a crash.  Upon inspection, the polish table was
found to lackenough slurry on it.  There was some slurry in the middle
of the table, but not enough to make it out to the perimeter.  We
can NOT confirm why this happened, but it's quite possible the quick
loss of slurry flow to the room happened within the time frame of 
this occurance.  After reboot, we manually flowed slurry to assure
a satisfactory amount was flowing, which there was.  The system ran
like a champ the rest of the shift.

      					A Shift

   

  SHUTDOWN:  5:00 AM ON 3/28/96

  STARTUP:   9:00 PM ON 2/28/96


                    CMP.B2 SHUTDOWN CHECKSHEET
                    --------------------------


                                                        Tech.       Date
                                                       -------     -------


  1.  Change RTC status to SCHEDULED DOWN.               BJ        3/28/96

  2.  Remove all carriers.  Any carrier that
      has a wafer count higher than 500,
      break the carrier down.  If any carriers
      have less than 500, place in DI water and
      and mark a indicated.                              BJ        3/28/96

  3.  Remove all wafer receive cassetts.                 BJ        3/28/96

  4.  Remove and discard all polishing pads.             BJ        3/28/96

  5.  Remove all PVA scrub brushes and submerge         
      in DI water.                                       BJ        3/28/96

  6.  Perform a complete clean of each system
      to remove dried slurry.  Wipe down and dry
      all wet surfaces.                                  BJ        3/28/96

  7.  Remove and discard all slurry filters.             BJ        3/28/96
                                                         
  8.  Disconnect inlet and outlet lines on each
      filter housing and remove housing.  Connect
      inlet and outlet lines together with a 3/8"
      union.  This will completely bypass the 
      filter housings.                                   BJ        3/28/96

  9.  Close main incoming DI Water valve to each
      system and open the DI Water return valve
      (UDR).  This will allow all incoming DI Water
      to flow to UDR.                                    BJ        3/28/96

 10.  Power down each system.                            BJ        3/28/96


 11.  Power down each Neslab TCU.                        BJ        3/28/96
    
    
                                                                       

          Put a warning on the tool.  Receive elevator #2 is
      still cross slotting.  Product running on tool so I 
      couldn't get the tool.   Ian from Speedfam is aware of
      it.

                                         BJ

CMP.B2 - The tool was put up with an assist in reference to a moisture sensor
	 alarm. Found The drip pan under the unload station with water in it.
	 The leak was coming from where the fitting on the quick dump drain 
	 screws into the main drain.  This was caused by a tie wrap anchor 
	 coming loose allowing the tubing to fall into the path of the 
	 elevators' travel.  The QD drain & cascade drain tubing were securely 
	 tie wrapped out of the way and the pan and sensor were cleaned up.
 

    TOOK A LOOK AT CROSS-SLOTTING PROBLEM ON ELEVATOR 2 AND FOUND 2
    PROBLEMS.
    
    1.	C CLAMP THAT HOLDS THE FIBRE OPTIC CABLES IN PLACE, WHICH IS
    LOCATED TO THE REAR OF THE FLOAT SWITCHES WAS CAUSING THE FLOAT TO
    STICK DOWN. THIS MADE THE QUICK FILL SWITCH ON AND CHANGE THE WATER
    LEVEL IN THE ELEVATOR, SO CAUSING CROSS SLOTTING.
    
    I ROTATED THE CLAMP ON BOTH ELEVATORS 180 DEGREES SO THAT CABLES WERE 
    ROUTED FURTHUR AWAY FROM FLOAT.
    
    2.	THE CASSETTE PRESENT SWITCHES WERE LOOSE AND WERE ALLOWING THE
    CASSETTES TO MOVE ON THE EVEVATOR DUE TO THEIR LOOSE FIT. THIS WAS
    CAUSING MINOR ERRORS WITH SOFTWARE THINKING THE CASSETTE WASN'T PRESENT
    BECAUSE THE SWITCHES WERE NOT ALWAYS BEING MADE.
    
    READJUSTED THE SENSOR CLAMPS NEARER TO CASSETTE TO ENSURE POSITIVE
    SWITCH ACTION AND MAKE CASSETTE A TIGHTER FIT ON BOTH ELEVATORS
      

	The robot missed a wafer from cassette #1. We found that 
	the wafers were being lifted too high when they exit the
	cassette and dragging on the top of the slot. We lowered
	the robot to cassette #1 slot #1 position slightly, all set.

		                 		B shift

    Chiller now set and calibrated (24 deg C) for remote use.
    
    Ian Lowbridge (Speedfam)

    
    
          Re-routed vacuum solenoid wires out of the way
      and neater looking.
    
          Looked into the neutral wire on the vacuum capacitor
      and found that the mount for the capacitor is once again
      broke. The capacitor is up out of the way and secured.
      The wire was ok.  All of the wires have been secured as
      well.
                                       BJ

       Tool crashed a wafer from carrier #4 on the 2nd table.  Little
    pieces came out and trashed all five carriers which had to be
    replaced.  The hub to cup alignments were done as well as the
    load positions.  Everything looked ok.  Everything was cleaned
    up and new carriers and pads were installed.  The tool ran fine
    and passed MQC's.

        The leak I discovered during the PM has been found and it
    has been resealed.  It was coming from the port between the two 
    drains.  I siliconed both top and both.  The tool will be DOWN
    for the remainder of the shift and can be used at 10am after
    Brad turns the DI feed to the scrub station brushes, to the
    scrubber spray nozzles and re-installs the brushes which are
    sitting it the elevator #1 tank.


                                                       D shift

CMP.B2 - Down for no wafers on carriers and DI leaking from the unload station.
	 Tool was down from this morning for DI leaking from the unload
	 station.  The previous shift had siliconed the leak and asked for us
	 to verify the fix.  Found it to still be leaking from the new silicone
	 weld.  Stopped working on this issue because Production asked for the
	 tool.  When the wafers were picked from the index station a "wafer
	 missing from carriers 1,2,3,4,5" error was recieved.  Vacuum could be
	 felt on the wafer.  Checked the vacuum and it was pulling 22 inches in
	 the pnuematics cabinet and 18 the multihead.  The wafers seemed to be
	 loaded ok but the alignments were Checked anyway.  The alignments
	 looked good but a small adjustment was made carriers #3 (15 out) and
	 #5 (20 out).  Ran 5 more wafers and recieved the same alarm.  Ran out
	 of time.

	"C" shift put the system down for a vacuum problem and a DI 
	water leak under the scrub station.

	- We found the main vacuum gauge was only reading 22 lbs and 
	  head #4 gauge was reading only 18 lbs. We cleaned the vacuum 
	  pump diaphragm all the connectors and the in-line filter. The
	  main vacuum gauge now reads 30 lbs and head #4 25 lbs.
	  We began running wafers and found that carrier #2 misloaded
	  twice in a row. We checked the cup to spindle alignment
	  and the carrier to load cup alignment, both looked good.	
	  Checked the load flipper to load cup alignment and found
	  that the wafers were not seating into the load cups far
	  enough. Adjusted the load flipper 75 steps back, all set.

	- A hole in the steel main frame under the scrub station was
	  siliconed on "D" shift. We found that the leak just moved to 
	  the next hole in the steel frame. The root cause for the leak 
	  was a rip in the flex hose that houses the scrub station
	  power cable. The DI water was running down the inside of the
	  flex hose and down onto the main frame. We cut the power  
 	  cable, removed the scrub station and replaced the flex hose
	  then soldered and re-installed the assembly. 
	  When we removed the top section of the scrub station we found
	  that all six stainless steel bolts had been stripped in.
	  One bolt broke off when we attempted to remove it. The others
	  needed to be replaced. The scrubber will work fine, but
	  a replacement part will need to be ordered.

		                 		B shift

	Found B2 chiller with fault and display of 12 degrees, reset and 
watched it recover to 24 degrees. aok rest of shift.


					A shift

CMP.B2 - Down for scratches.  Cleaned conditioners and process area but did not
	 pull pads as requested by process. Also drained and pulled the load 
	 cups and wiped out the index table and unload tracks.  The scrubber 
	 brushes were checked and rinsed.  Tool is presently getting MQCs

    
    * Fatal Error:
    
    
    The system experienced a fatal error at 5:00 p.m.
    Gwen said that the screen went crazy. It looked like
    lines of code zipping around the screen instead of
    the menu screens. She EMO'd the tool and rebooted without
    any further problems.
    
    

	Errored for "All cups not down", found #3 & #5's air cylinders
    	sticking. Lubricated the air cylinder shafts and adjusted the air
	pressure for cup #5, all set.

		                 		B shift

	* There was water leaking from the paddle wafer pedestal area.

	   Removed and inspected the wafer pedestals housing. Inspected,
	   cleaned and reseated the o-rings. Re-assembled the unit and
	   re-aligned the unload flipper fingers. 

	* Repaired the flex hose that houses the unload flipper cabling, 
	  it was cracked.

	* During the secondary polish an annoying squealing sound was
	  noticed. Before the scheduled MQC's we changed the secondary 
	  pad.

		                 		B shift

        During polishing, a loud noise was emitting from the
     table due to poor slurry flow.  The slurry lines on both
     pump showed excessive wear.  Both were replaced as they 
     were going to be done because of the PM due this week.
     After everything was tested, air was coming through the
     lines.  It ended up being that the slurry pumps downstairs
     shutdown due to a clogged filter.  After the filters were
     swapped over, the flow was back to normal and without any
     air in the lines.

                                       BJ

       During the weekly PM yesterday, DI water was found
    once again in the front containment pan.  A lot of it!
    We eliminated the scrubber and DI was still coming down.
    When then by-passed elevator #1 and drained all the water
    out of it.  The leak stopped....  We found the elevator #1
    DI water fill float not working.  We traced it to a broken
    wire #13 at BB-10.  After the wire was repaired, the switch
    was once again working and as of right now, the is no leak.

                                        D shift 

                                   a.k.a. Digital Water Rescue Team

       
         the fab dumped at 4:15 and B2 was still running
      product.  The tool was placed in wet idle upon return
      but both pads were slightly dried up and needed to be 
      replaced.

                                         D shift

	The system errored for "wafer not detected in the unload flipper".
	We found the wafer from unload cup #4 was only grasped by the
	two rear unload fingers. We repositioned the wafer and pressed
	start to continue. We checked all the alignments and didn't
	find any problems, the system ran fine the rest of the night. 

	Five wafers got over polished due to the error. When the system
	was restarted the five wafers on the carriers got polished a
	second time. This wasn't noticed until after thickness measure.
	
		                 		B shift

System B2 unload station

System intermittently has strange errors like releasing the wafer at it's home 
position on the way to the scrubber, and system lockup during unload.

Found outer corrugated cable on flipper box torn. Wafer drain is dumping water
on wires and into outer cable sheath. Wires are being stressed as 
flipper gripper moves from cup to clean station.

Parts not in stock, FS is attempting to order "next day".

AC2535A1 TUBING, LIQ-T,1/",PLASTIC, DRAWING AA3037 ITEM 9

AC2534A1 FITTING, 90D EL, LIQ-T,1/2"TX    Same drawing ITEM 10 

This is not the same design flex tube as the scrubber uses. The end of 
the tube is threaded and screws into the connector fitting. We had to 
tape the sections together to removed the stress on the wires, as a 
temporary water proof "band aid" until parts come,in hopefully tomorrow.

System has run the rest of the day fine.


						A SHIFT/ RICH

    Installed magnetic door closures on the pneumatic cabinet. Let me know
    what you guys think. I would like to install them on the cpu cabinet as
    well but I'll wait for a majority vote. 
    
    
    					B shift

    Tool was loading product and got hung up after loading three wafers
    into the index table. No alarms, the screen just stayed at "waiting for
    load flipper at home" and the index table did not move to the next load
    cup. Rebooted and it worked fine the rest of the night. The secondary
    pad is whistling when wafers are cleaning again. There are some bubbles
    but we didn't replace it due to B1 being down most of the night
    
    
    					B shift 

         Early in the shift, wafers slid out of carrier #1 and
     #4.  The tool didn't crash however.  Several hours later, 
     it did on the other hand.  A product wafer slid out of #1
     and took out #5 and #4 before the tool caught it.  The entire
     tool was cleaned up, pad replaced and all (5) carriers were
     replaced due to the crash and high wafer count.  The tool ran
     flawless for the rest of the shift.

                                             D shift

         Early in the shift, wafers slid out of carrier #1 and
     #4.  The tool didn't crash however.  Several hours later, 
     it did on the other hand.  A product wafer slid out of #1
     and took out #5 and #4 before the tool caught it.  All of the
     cup to head alignments were checked as well as the load 
     handling. Hi Tim! 8^) The entire tool was cleaned up, pad 
     replaced and all (5) carriers were replaced due to the crash 
     and high wafer count.  The tool ran flawless for the rest 
     of the shift.

                                             D shift
     

CMP.B1 - Down for slipping wafers from the previous shift.  Pad was changed and 
	 the tool was cleaned up.  The alignments were checked and the index 
	 table and all carriers were adjusted.  The tool slipped another wafer 
	 at lift of but no wafers were broke.  The reps. suspected that there
	 was a problem w/ the pads, so they tried breaking the pad in using a
	 modified conditioning recipe.  Fifty wafers were run and It seemed to 
	 have worked.  While running MQCs 2 wafers came out of heads 1&5.
	 inverter errors were recieved and the screen locked up all at once.
	 The tool presently sets rebooted with all wafers off the system in wet
	 idle.
    

    Installed magnetic door closures on the cpu and di cabinets. I'll
    have to scrounge up some more before doing b1.
    

	Mounted the 2 AB boxes to the side of the computer 
	cabinet.
		                 		B shift

	B2 failed MCQ's for particles, replaced polish and secondary 
        pads. System passed MCQ's aok.

					A shift

    
      Early morning......
      	The system was EMO'd due to a lack of and/or no slurry flow.
      This was evident as the system became load and vibratation was
      observed.  Rebooted the system.  Ran a manual polish segment to
      assure that slurry was flowing properly (it was).  Also, changed
      the scrubber brushes at this time.  Returned the system to MFG
      for MQC's.  All is well.

      Late afternoon, the room had a "power sag" which caused the room
      lights to noticeably waver.  The system was un-affected though.

      						Doc

        Tool down for consumables when we came in.  A set
     of new carriers and scrub brushes were installed on the
     tool.  Tool passed MQC's and was turned back over to
     production.
                                            D shift

                                           

    
    Vacuum Errors:
    -------------
    The system experienced many vacuum errors during the shift.
    We noticed that the vacuum seperator was 1/2 full of slurry.
    The slurry was drained and the system ran for a while without
    any errors. After a few hours we got an MAIN VAC TOO LOW
    error. The vac gage at the pump was displaying 29 in/hg which
    seemed unusual so we opened up the vac separator again and discovered
    that the filter element was clogged with dried slurry. The element 
    was removed and the vac system has been performing normally ever since.
    The manufacturing folks have been performing a double map at the
    begining of each run to ensure that the tank is thoroughly drained and 
    that no slurry will be pulled into the pump.  Please continue to do
    this until a vacuum separator filter element can be located.
    Also, the vac tank blow out cycle seems to last only a few seconds.
    Shouldn't it be 15 seconds?
    
    Wafer crash on the secondary table:
    ----------------------------------
    The system broke a wafer on the secondary table at 7:00 p.m. The 
    contamination was pretty extensive so we are cleaning the entire 
    tool and changing the primary pad, secondary pad & scrubber brushes.
    All cups have been removed from the index table and the tub thoroughly
    wiped out and rinsed. PLEASE CLEAN THE CUPS CAREFULLY AS SOME OF THEM
    HAVE SILICON PARTICLES DOWN INBETWEEN THE SLIDING PATS OF THE CUPS.
    SOME OF THE CUPS MAY HAVE TO BE DISASSEMBLED.
    
    
    

	Finished Load cup alignments started by "C" shift.
	Load cup 4 needed slight alignment (256 counts). All
	others ok. Took apart all Load/Unload cups to clean out 
	wafer particles. Load cup 3 had particles imbeded in the
	middle of the cup. Replaced the cup with one from the
	carrier rebuild room.  Cleaned index table and scrubber,
	replaced the scrubber brushes, both Polish pad and second 
	table pad. Cleaned conditioner. 

	Turned B2 back over to Operations for break-in and MQC's.
	B2 Passed MQC's.

	Drilled hole in the side of the computer cabinet and ran cables for 
        remote monitor. Picked up 9 pin m/m 6 foot connector at radio shack and 
        completed wiring. Tested just now and screen lights up and displays 
        data, but touch screen is not working. started to troubleshoot but ran 
        out of time.



					A shift / Tim

        Reps tried to upgrade CMP.b2 to 493 software. They found the keyboard 
        jack on cpu bad. No CPU's in stock. Kevin was trying to get one on 
        order.  System running is fine but you cant access dos via keyboard.

        Sent 30 pressure plates to speedfam today.

Continuation of yesterdays Problem (remote touch screen not working)

	Found open in remote switch box for com1. Open is on pin seven of the 
        B side of the switch. Tried to clean but its still intermittently open 
        depending on how much pressure is placed on rotary switch. Pin seven 
        of B is the only pin that has this problem. John P. could you get a 
        return on this, not sure where you bought it?


				               A shift

    
    
          The tool lost slurry slurry and is the suspect of a 
       crash on the 2nd table.  A wafer looks like it cracked
       on the polish and blew up on the 2nd table.  Ashland
       called the first time to say they were shutting down the
       slurry but it went down unexpectedly a 2nd time.  We    
       took the tool for the monthly and were making progress
       until we lost all of the 24V in the tool.  The tool is
       dead in the water and we suspect it is the 24V power 
       supply.  We are in the middle of a swap out now.
    
                                         BJ

       a long time ago, in a galaxy far far away....

       opps...  wrong story....

          The tool was still down for a couple of PM issues.  
      The monthly PM was completed and carriers were put back 
      on the tool.  While the pad was being conditioned, I had
      the carriers rotating with DI rinse on.  Only #1 was 
      spraying.  After some troubleshootin',  the 24V line that
      feed the output OPTO board was accidentally placed in the
      wrong hole from yesterdays 24V problem.  Rinse #1 is not
      in the same row as #2-#5.  That was now back to normal.
      OPS started breaking in the pad and we started get "no 
      wafers on carriers" error.  The samething OPS were getting 
      just before the crash on Tuesday before the PM.   So, we're 
      back to the original problem.  After some more hard
      troubleshootin', we noticed that there was vacuum when
      multihead was at polish but not at load.  Kinky line in
      flex track.  Yup... the new 1/2" clear vacuum line was
      just a snudge too long and was kinking when the multihead
      traveled.  Took out the slack in the line and that was 
      all better.  We then had #1, #2 and #5 not seeing vacuum
      with a wafer in place and vacuum at 20".  All of the vacuum
      pressure switches we re-checked and slightly adjusted to
      spec.  The tool 40 wafers with I_O program #1 with no 
      problems.  Tool is in verify but it needs a proper pad 
      break-in done.
                                                  BJ
        
          

	Index Table Time out error, Table would not move. Found Motor 
#11's infranor failed for no power. Its breaker and infranor power 
supply were fine. Changed with 14 amp infranor from F.S. office. That 
Infranor had current error. Changed with infranor from carrier 
rotation # 4. Index table was fine and problem followed to Carrier 
#4. No other Infranor's in office or cabinet. Borrowed infranor from 
B3 carrier #4 at F.S. request. System ran fine. 

   	REp's have infranor coming in tomorrow.

	During mqc's wafer cracked on table during segment 3. Changed 
one carrier and pad.

	Latter in the evening one wafer was left on pad at lift off.
Removed covers and checked all vacuum while running dummies, Pump was 
28 and carrier with wafers was 24-25. Ran a couple of runs and gave 
back with panel off so we can monitor. System is currently running.

					A shift

	The system wouldn't load the next 5 wafers into the index
	table until after it finished polishing the 5 on the carriers. 	
	Rebooted the system and the problem went away.		          


			       		B shift

    installed 493C, set autoexec.bat for 493C boot.
    tested 25 wafers and ran good with no hesitation.
    Returned to production.

	Came in tonight and the touch screen had froze up, 
	tried to reboot the system and came up with 2 errors.
	The first was a Dos error " DIVIDE OVERLOAD " the
	second error was " ELODEV NOT INSTALLED ", it wouldn't
	boot to the Initialization screen. By bypassing the
	A/B box the problem went away. We couldn't troubleshoot
	any further because ops. needed the tool. We believe
	the A/B box needs to be replaced.

			       		B shift & Dave B.

	System lost a wafer at lift off, manufacturing tech place it back 
on carrier, but carrier 2 failed for rotation.  System was powered down. 
We brought system up. Check for breakers or infranor errors found 
infranor for carrier 2 rotation had no power. Hit init and power was 
applied to the infranor, STRANGE. tried to replicate but could not. 
Ran test wafers aok 400lbs.


					A shift

    
                               
    Particles:
    ----------
    Both Primary & Secondary Pads were changed due to high particles.
    
    
    Special Pad:
    -----------
    A Special Primary Pad was installed at 6:00 p.m. Do not remove this
    Pad without calling Frank Krupa at home. 
    
    
    Wafer Flyout on Head #4:
    -----------------------
    A wafer fly out of Head #4 at lift-off. There was no breakage and we
    recovered with no problems.

    SYSTEM CONFUSED INDEXED WITH CUP CYLYNDER'S UP.
    TABLE WAS JAMMED AGAINST CUP'S.
    WENT INTO DCX1 INDEXED TABLE OFF OF CYLYNDERS.
    CHECKED CYLYNDERS LOOKED O.K.
    REMOVED CARRIERS THEY ARE SOAKING ON STAINLESS TABLE.
    PAD IS IN ONLY WET PAD MODE.
    CUP'S REINSTALLED 
    SYSTEM SITTING WITH TABLE AT HOME POS. 
    NEED TO VERIFY CUP TO CARRIER ALIGNMENT.
    
    
                 DOC AND HAWK

	The system went down for an index table to all cup cylinders
	up crash. Checked the spindle to load cup alignment and the
	carrier to load cup alignments, all looked good. Checked
	the locate.cmp program and the size of speed493.exe in dos, 
	everything looked normal. Checked the error log and found
	no errors logged for the crash. Replaced the pad due to high 
	wafer count, ran 25 wafers using no_touch. Gave the system back 
	to production, had no errors the rest of the night.
 
			       		B shift 

    The system slipped an exercise wafer out of head four this afternoon.
    It wiped out a few product wafers and a couple of carriers.  The system
    has been cleaned, new pad and some carriers installed.  Pad
    conditioned.  But, currently waiting for MQC wafers to arrive to CMP.
    
    						Doc
    

    today the water line in the flex track ruptured and dumped water in
    the tool. Parts are on order and will arrive in the A.M.

    The new flex tubing for the MHTA DI water supply was installed today. 
    It was leak checked and proved water tight.  A new pad was installed
    and the original carriers re-installed.  MQC's looked good.
    
    Maintenance services provided by Hawk and Rich for this fix.
    

         The tool had just got done running a METAL-3 lot
    without any problems.  OPS started up a PMD touch-up
    lot with (5) wafers.  Carrier spit a wafer and the 
    wafer detect system didn't appear to pick the the 
    slide-out.  The error that trip was MAIN VACUUM LOW.
    Head #2 wasn't rotating either.  Upon boot up,  the
    vacuum error was still present.  We found breaker #13
    tripped.  Head was also not rotating.  After a 2nd
    power-up, everything was ok.  The downforce on #2
    was checked and was ok.  The head to load cup alignment
    and head to index table alignment were fine.  Since 
    everything looked ok,  we compared the voltage on 
    head #1 and #2 Rotation Infranors voltages.  #1 was at 
    10V, #2 was at 9V.  We tweaked #2 to 10V to see if we
    saw any change.  They ran break-ins without any problems.
    OPS ran MQC's and passed particles and and uniformity but
    the range is out.  They are running more wafers now and
    it looks like it will come in.
                                                  
                                                  D shift

    Replaced infranor for head 2 rotation error. The infranor did not have
    any LED's lit and as a result no output!!!.

    

          Tool was leaving wafers on the polish table after lift 
       off from carriers #1 and #5 (4)times tonight. It was causing
       vacuum low alarms.  This was an issue before, so I checked
       Downforce, load cup to carrier alignment on the carr #1 and #5
       and vacuum, looked good. I have changed the pad and carriers 1 and 5
       and it seemed to have worked. The tool passed MQC's and is running
       product without any problems.

    
    Unload Flipper Sensor Error:
    ---------------------------
    The "Unload Flipper Wafer Present" Sensor was not enabled during a 
    product run at 4:00 p.m. on Friday. (DG-IN 7, PROX6)
    
    We opened up the unload flipper box and found water inside. The 
    metal air cylinder bracket that sweeps over the 3 proximity
    sensors was dragging water across all 3 sensors and confusing
    the auto cycle program.
    
    We dried up the water, cleaned the gaskets and applied a coating of
    DOW Corning Electrical Compound to the mating surfaces and screw
    holes. We avoided using Silicone Rubber due to the long curing time
    and the difficulty it causes during disassembly. 
    
    The system ran for the rest of the shift with no unload flipper errors.
           
    
                                                                   C Shift.

	The system locked up in the middle of a 25 wafer run.
	It completed polishing the wafers on the carriers then 
	froze. We had to reset the computer then remove the 
	wafers in manual.
	   
			       		B shift 

	System is in 24 hour required MQC. Today Multihead went out to 
polish table and stopped. System alarmed for process door switch open.
Found rear right sliding door micro switch not made. Rich adjusted 
micro switch.  System failed for main vac operator powered system 
down. At init failed for "No rotation head 3", manufacturing 
tech hit any key to continue and software dumped him to DOS. I 
reloaded Speed493 ran aok. Watched several wafer maps dump seems ok. 
But when pressure equalizes at end of dump and isolation valve opens 
pressure/vac  drops close 15" (alarm point). 


Tim would like sliding doors and stitches checked and repaired. (no done yet)
I spent rest day doing the same alignments to b "Pain in the 
backside"! (The doors and rollers not Tim!)

System just passed mqc's
					A shift

    Just a word on the rollers for the doors, we have an upgrade that will
    take place when the parts are available, so at this time we will wait
    for them to arrive instead of replacing with old style parts.
    
    
    
                                                                SF

    
    * Rear Touchscreen Monitor:
      ------------------------
      The defective A/B Box for the remote touchscreen monitor has been
      replaced with a new one. The cables have been reconnected and the
      monitor is fuctioning normally.
                                                            C Shift.

     OPS started running a lot after the tool was sitting in WET
  IDLE for some time.  While the MHTA was going to polish with (5)
  send-aheads, a lot of slurry chunks were noticed on the 2nd table.  
  The tool was EMO'ed before polish.  The tool sat off for 10 minutes
  while the tables were sprayed off.  At initialization, head #3 wouldn't
  rotate.  The rotation Infranor for head #3 cooked, no LED display with
  a slight burnt odor.  The Infranor was replaced at the volts set to 11.0.
  The carriers were scrubbed clean an the pad rinsed off thoroughly.
  At VERIFY, the tool mis-loaded a wafer on head #4.  Started over and 
  it was ok.  OPS ran particles wafers to verify the tool and the tool
  passed and came back up.

                                               D shift

    
    * MAIN VACUUM TOO LOW ERROR:
      -------------------------
      The system errored for "Main Vac Too Low" this afternoon. A reboot
      was necessary to recover from this condition. The system ran for the 
      rest of the shift with no problems.
    
    
    
    * MULTIHEAD LEADSCREW COVERS:
      -------------------------- 
      A screw backed out of one of the covers yesterday causing the cover
      to swing sideways. We replaced the screw only to discover that the
      spacer was missing. It must have fallen into the tub under the table.
      The spacer is flat on one side and spherical on the other. It looks
      like a Speedfam part. We asked the reps to order replacement hardware
      for the covers. Further inspection revealed additional loose covers.
    
                                                                C Shift.
                                                                        

    cleaned system.
    changed primary and secondary pads.
    primary pad count  1844
    secondary pad count 1859
    system passed mqc and is running production.
    
              c-shift

    Found the leak detector in the slurry pump box to be red. Checked the
    detector in the fluids cabinet and it was also red (and in water).
    Checked Hardware.cmp file and the moisture sensors were enabled. Checked
    digin 27 and this was not highlighted. Checked voltage at the digin
    opto-isolator and both sides had ~24vdc. Checked the leak sensor
    module, LCK-1000, in the fluids cabinet and this was off. Turned it on
    and the tool alarmed for moisture detected. Dried up water and placed
    new breast feeding pads under the sensors. 
    
    
    						B-shift

    Wafers cross slotting in elev 1. Ended up lowering the water level,
    reducing the water track flow, and lowering elev 1 home by 150 counts.
    Manually unloaded a cassette with no cross slotting. Also checked the
    next cassette of production wafers and there was no cross slotting.
    
    
    					B-shift

    The Moisture Sensor alarmed today..........
    
    Traced problem to the Fluids cabinet.  Found a leaking fitting coming
    out of the exit cooling line valve within the cabinet.  Retaped the
    fitting and re-installed.  Changed the oppropriate sensor paper. 
    Re-powered the moisture detection power unit.  All set.  Checked for
    leaks several hours later, none to be found.
    
    						A

	System is in 24 hour required MQC. Today Multihead went out to 
polish table and stopped. System alarmed for process door switch open.
Found rear right sliding door micro switch not made. Rich adjusted 
micro switch.  System failed for main vac operator powered system 
down. At init failed for "No rotation head 3", manufacturing 
tech hit any key to continue and software dumped him to DOS. I 
reloaded Speed493 ran aok. Watched several wafer maps dump seems ok. 
But when pressure equalizes at end of dump and isolation valve opens 
pressure/vac  drops close 15" (alarm point). 


Tim would like sliding doors and stitches checked and repaired. (no done yet)
I spent rest day doing the same alignments to b "Pain in the 
backside"! (The doors and rollers not Tim!)

System just passed mqc's
					A shift

    
	Installed the slurry detection sensors on b2. Calibrated and 
tested. aok
					A shift 

        The system alarmed today for carrier #3 not rotating.

    The system slipped an product wafer (on last sec. in segment 5)
    out of head two this night. It took out #5 and #4 before the tool
    caught it. The system has been cleaned, new pad and (3) new carriers
    installed. Pad conditioned. Currently running MQC.  
    
                                       d-shift

    Informed that head 2 had high removal rates.
    Observed  carrier offsets to be out of the +/- 30 range
 
    carrier     1          2         3         4         5
    
              + 38       - 37      + 33      + 29      + 20
    
    
    Performed  Down Force Calibration for all five heads.
    
    carrier     1          2         3         4         5       pre cal
    
              365 lbs    404 lbs   377 lbs   368 lbs   390 lbs
    
    
    carrier     1          2         3         4         5
    
              377 +/- 1% -------------------------------->      post
    
    
    
     System in wet idle waiting for MQC'S
    
    
                            C shift

	A monitor wafer slid out from under carrier #5 at the end of a
	5 sec. polish (step #5). Due to the mess and high wafer count
	it was determined that all 5 carriers should be replaced.
 	
				465 wafers on the pad
				199 on head #5

	We replaced the primary pad and all 5 carriers. The system has
	been cleaned including the conditioner. We didn't change the 
	secondary pad or condition the primary pad. 
	The system is in wet mode and down_repair in workstream. 
 
			       		B shift 

	Installed 3/8" clamp for slurry sensor and calibrated, test 
aok while room was shut down for slurry today. This amp is calibrated 
to switch position "C".

				A shift

 
     The tool first errored for heads not rotating at segment #3
    after touch down.  While trying to recover, the tool said there
    was a process door open but they were all closed.  All doors were
    checked and the culprit was the double doors in back.  The left
    microswitch wasn't making good contact, repaired same.
 
       Later on, at touchdown, there was a loud bang that sounded
    like the belt jumping and tool hung up for heads not rotating.
    Leon went to hose off the pad when he noticed the top pad all
    separated from the Suba pad.  I don't know what was holding 
    down the pad but it wasn't by much.  After the pad was replaced, 
    the tool ran fine for the rest of the morning.


                                              D shift  

    
          Tool never came up from ENG experiment.  Tool
       had massive particles.  The pads were changed,
       everything cleaned.  If you use perfect particle
       wafers on no touch and if the brushes are in
       question they aren't going to take off something
       that wasn't there. I swapped the top brushes
       with the bottom brushes and particles passed...

                              wow.....      BJ

	System crashed while engineering was running 5 breakin wafers. Crash 
        occurred during segment 5. All five carriers and pad were replaced. 
        Wafer detect alarm did not function, it was found to be jumpered out.
	Cup and carrier aliments were checked and found to be aok. Wafer detect 
        system is now operative.

					A shift

    powered system up no problems 
    installed 5 new carriers
    performed conditioner arm cal, found to be approximately @72 lbs @ 67%
    set to 76. 8 +/- 1 lb
    cut primary pad.
    retrieved new brushes from stockroom for scrubber.
    
                                  C Shift
    
    

	Calibrated the conditioner down force using the procedure
	in note 23.1. With  the analog output at 4095 the force
	was 54 lbs. we set it to 77 lbs.
 
			       		B shift 

    New Blocky conditioner installed on evening of 7/10/96.
    

CMP.B2 - Down for high particles.  The scrub brushes were not rotating.  The 
	 scrub assembly was pulled and the gear on the motor shaft was found 
	 to be stripped.  Some bearings are also bad and most of the screws 
	 were damaged.  The upper and lower scrub assemblies were swapped with 
	 CMP.B3's because it was down.  Speedfam has been notified and the
	 parts will be ordered.  The tool was cleaned up and returned to
	 production.

    
    	The brushes on the scrubber were changed out today!  What a
    pleasure it was to work with the "user friendly" 3M adhesive backings.
    
    							A shift
    

CMP.B2 - Went down for high particles.  The scrub brushes were rotating 
         but lower scrubber assy wasn't going up.  The scrub assembly was
         taken apart and teflon coupling that connect lower and upper motor
         aasy was found to be stripped. Lower motor shaft sticking inside of 
         coupling and not going up. It needs to be replaced. I will speak with
         reps in the morning. For now I temporarily swapped with B1 which 
         went down for high particles. The tool was cleaned up and returned
         to production. Running MQC's now.


                                               Leon
  

	The system failed mqc's for high particles. We followed the 
	game plan issued by process engineering. Put a precut primary
	pad from lot #6EN-JP4 on. Ran the regular breakin and mqc's
	with steps #8 & #9's ID OD set at 12.7  The system passed mqc's 
	well within spec. released to production.
    
			       		B shift 

    checked and adjusted scrubber rpm, (rpm were 3x more than normal)
    

    Noticed that the scrubber wasn't operating properly. It was going in
    fine but the motor wasn't turning on and the base wasn't going up. 
    All the proper sensors were being made at the proper times. Excerised
    it using the Dig/out and Anl/out screens but it didn't start working
    until the motor was physically turned by hand. After that it worked
    fine no matter what screen was used. Told ops to keep an eye on it.
    
    			
    						B-shift
    

    
    
           We noticed a product wafer wasn't rotating during  
       the scrub process.  While running the scrubber manually,
       the bottom brushes weren't spinning.  Upon disassembly,
       it was discovered that the drive belt had snapped.  A new
       belt was installed and test.
                                                  A shift  

    Tool was down when we came in for particles. Both pads were pulled by 
    A-shift. The first set of mqc's failed. The carriers were scrubbed
    and the polish area was given a once over again. The second set of 
    mqc's weren't measured as a wafer came off of carrier 1 on lift off. 
    A third set of mqc's will be attempted shortly. 
    
    
    						B-shift

CMP.B2 - The monthly has been wavied until next week.

	The system failed mqc's for high particles. Found the secondary
	pad was fraying in the center and around the outside edge. The 
	pad was cut to fit, originaly ment for cmp.b3. We cleaned
	the conditioner and index table, replaced the secondary pad 
	with one precut for cmp.b2 and particles passed. The particle
	counts for this tool are running high, above 1000, with cmp.b1
	& b3 running around 300.
    
			       		B shift 

	The system broke 2 wafers on the polish table. 

	After a new pad was installed the system passed mqc's, we 
	began running product. When we started running the 1 second
	touchup runs a loud vibration was noticed, usually coming off 
	and on in steps #6 thru #8. On this run the vibration occurred 
	in step #6, the vibration was so bad that one of the process 
	doors opened and the system stopped. We were watching the system 
	at the time and everything looked normal except for the loud 
	vibration. After closing the door we attempted to restart the run, 
	when the wafers went down onto the polish table #5 slid out and 
	broke on head #4. 
	We think the vibration is created by very little slurry on the table 
	while running only a 1 second touchup and the new water polish steps.
	There was no vibration noticed during the initial long polish.
    
			       		B shift 

    Broke wafers on pad. Operator didn't know what segment but apparently
    the wafer sense didn't work and the tool had to be emo'd. Two infranors
    had to be replaced upon power up (motor 10 and 13). After tool was
    cleaned up breakins were ran. It dropped a wafer on lift off in segment
    9 out of carrier 2. Under carrier 2 was found a sliver of wafer which
    may contributed to the problem. Carriers 3 and 4 were replaced after
    the initial crash the others were deemed ok. Leaving in wet mode for
    A-shift eval. 
    
    
    					B-shift (it was a lousy night).
    

    
    Monthly PM Deferred to WW8:
    --------------------------
    We have partially completed the WW7 Monthly P.M. Due equipment
    availability, we could not complete the Monthly pm today.
    
    The partially completed checksheet has been posted in the Incomplete
    PM Checksheet note.
    
    
    
     
    

    Relocated vacuum pump to the black box below the floor.
    Test fine.
    
    
    					B-shift
    
    

    
    Head #5 Dropping wafers / Vacuum trouble:
    ----------------------------------------
    Just finished a test run. The multihead covers were removed on head #5.
    The vacuum gage displayed 21 in hg as the poish cycle started. As soon
    as the multihead arrived over the polish table, and the carriers
    started to rotate, the vacuum dropped to zero. The wafer in carrer #5
    flew-out at touch down. D shift, take a look at the rotory union on
    head #5.
    
                                                             C Shift.           

CMP.B2 - Down for losing wafers from head #5.  The problem repeated itself
	 several times today.  A different carrier was installed on #5 with the
	 same result.  Removed the covers and read the gauge with vacuum drawn 
	 on head #4 & #5.  The vacuum was 26 at the carrier and 28 at the tank
	 for both.  Ran out of time.  Engineering requested that all the
	 fittings for head #5 be checked and the vacuum be rechecked at the
	 spindle #5 again with the carrier rotating.

              <<< ASDG::DISK$SYS_DATA:[NOTES$LIBRARY]CMP.NOTE;1 >>>
                                    -< CMP >-
================================================================================
Note 19.222                   CMP.B2 EEG PASSDOWNS                    222 of 222
FABSIX::O_WHITFORD                                   21 lines  23-AUG-1996 04:45
                             -< Carrier #5 Vacuum >-
--------------------------------------------------------------------------------
         Took over from C shift.
    
         Began by removing covers and panels for carrier 3 to make a
    comparison to.
    
         Loaded 5 wafers and noted carrier #5 @ 3"hg lower than #3. Ran up
    carriers to approximate RPM during process with no change in vac which
    pretty much eliminated the rotary union in the spindle. 
    
         Moved carriers to the "in" position and observed vac on carrier #5 
    drop to 0" then return to @ 22"hg. Observed the wiring bundle while the
    arm was in motion looking for kink the vacuum line. When I touched
    the bundle, reaching for the vacuum line, the solenoid chattered and vac 
    immediately dropped out.
    
         Traced the wiring to the solenoid and found a broken wire in the 24V 
    line leading to the vac solenoid valve. The wire broke at the tiewrap
    which anchored the bundle to the lower plate of the multihead. This was
    the point where the wires made the greatest flex while the arm was 
    traversing from the "in" position to the range of oscillation. We cut into 
    the outer insulation and spliced the broken wires. Heat shrank the repaired 
    area to preclude moisture damage. 
    
         Exercised with no further problem. Turned over to ops for
    verification. 25 wafers ran with no losses from carrier #5. MQC's,
    uniformity, particles etc. came out well withing spec.

                        Leon S. Dave W.

    
    Wafer Misload:
    -------------
    The system failed to load a wafer on Head #3 this afternoon. We didn't
    see exactly what happened. Its possible that Load Cup #3 may be
    sticking or the lift cylinder might be degrading. We can't get the tool
    at this time to check it out. 
    
                                                          C Shift.

CMP
___
                        monitor wafer usage
                        -------------------

	Type of monitor		Number used		Comments
        ---------------         -----------             --------
        MQC-12K MONS                16                  MQC'S

        BREAKIN WAFERS              42                  misc



CMP.A1 (Strasbaugh 6DS-SP) - UP/IDLE
CMP.A1 24hr MQCS COMPLETED: @  2:00 PM 8/24 
CMP.A1 24hr MQCS NEXT DUE : @  2:00 PM 8/25

CMP.A2 (Strasbaugh 6DS-SP) - UP/RUNNING XM0515 PMD
CMP.A2 24hr MQCS COMPLETED: @  7:30 PM 8/24 
CMP.A2 24hr MQCS NEXT DUE : @  7:30 PM 8/25



CMP.B1 (Speedfam CMP-V) -   UP/IDLE  
CMP.B1 24hr MQCS COMPLETED: @  3:00 AM 8/25
CMP.B1 24hr MQCS NEXT DUE : @  3:00 AM 8/26
CMP.B1 12hr MQCS COMPLETED: @  3:00 AM 8/25
CMP.B1 12hr MQCS NEXT DUE : @  3:00 PM 8/25

CMP.B2 (Speedfam CMP-V) -   UP/MQC 
CMP.B2 24hr MQCS COMPLETED: IN PROCESS
CMP.B2 24hr MQCS NEXT DUE : "        "
CMP.B2 12hr MQCS COMPLETED: @ 4:00 AM 8/25
CMP.B2 12hr MQCS NEXT DUE : @ 4:00 PM 8/25

CMP.B3 (Speedfam CMP-V) - : UP/IDLE
CMP.B3 24hr MQCS COMPLETED: @ 5:00 AM 8/25
CMP.B3 24hr MQCS NEXT DUE : @ 5:00 AM 8/26
CMP.B3 12hr MQCS COMPLETED: @ 5:00 AM 8/25
CMP.B3 12hr MQCS NEXT DUE : @ 5:00 PM 8/25



CMP-SCRUB.A1 (On-track scrubber) - UP/IDLE MQC'S PERFORMED 
CMP-SCRUB.A1 12hr MQCS COMPLETED: @ 6:00 AM 8/25
CMP-SCRUB.A1 12hr MQCS NEXT DUE : @ 6:00 PM 8/25

CMP-SCRUB.A2 (On-track scrubber) - UP/IDLE MQC'S PERFORMED
CMP-SCRUB.A2 12hr MQCS COMPLETED: @ 6:00 AM 8/25
CMP-SCRUB.A2 12hr MQCS NEXT DUE : @ 6:00 PM 8/25

CMP-SCRUB.A3 (On-track scrubber) - UP/IDLE MQC'S PERFORMED
CMP-SCRUB.A3 12hr MQCS COMPLETED: @ 6:00 AM 8/25
CMP-SCRUB.A3 12hr MQCS NEXT DUE : @ 6:00 AM 8/25



Hot/B lots in area:
__________________
* NONE*

Hot lots coming to area:
-----------------------
* none *

Static Lots in area:
-------------------
* NONE*

Down Equipment:
--------------
* NONE*
 
Scrap lots:
----------
* NONE*

Hold Lots:
---------
* XD0519 M1 HOLD FOR F.KRUPA, SEE REMARKS

Monitor status:
--------------
5 BOXES of 12k mqc wafers.   

Number of product lots in room:
------------------------------
1 LOT

New specs/revs posted:
---------------------
* SEE TDCO BY CMP.B1*

Lots/wafers processed:
---------------------
*XL0525 PMD 24 WAFERS (HOT)
 JD0350  M3 20 WAFERS
 JD0427  M3 24 WAFERS
 
# of carriers for strasbaugh/speedfam:
--------------------------------------
12 SPEEDFAM CARRIERS
 4 STRASBAUGH CARRIERS
 ? STRASBAUGH PLATES

              <<< ASDG::DISK$SYS_DATA:[NOTES$LIBRARY]CMP.NOTE;1 >>>
                                    -< CMP >-
================================================================================
Note 19.222                   CMP.B2 EEG PASSDOWNS                    222 of 222
FABSIX::O_WHITFORD                                   21 lines  23-AUG-1996 04:45
                             
--------------------------------------------------------------------------------
     Called for broken wafer on unload station.

     Unload flipper had tried to place a wafer onto the scrubber station before
the transfer robot had fully lowered out of the way.

     Cleaned up wafer fragments & replaced all 6 scrubber brushes due to 
visible wafer chunks in them from the crash.... vacuumed out load station, 
replaced the secondary pad and removed and scrubbed all load and unload cups.

     Re booted the computer and exercised the load/unload sequence with
no further problems.

             Dave & Leon

    Replaced carrier #5 due to poor uniformity.

	The system broke the wafers  couple times this night.
        The first time a wafer slid out from carrier #5 taking #4.
        I cleaned up the mess, replaced the pad and 2 carriers. 
        and checked the load cup position alignment -looks good.
        We started MQC and after the first cycle the tool crash 
        again. The unload flipper dropped the wafer between flipper
        box and paddle. Unload flipper alignment has been checked as 
        well. Claned up the mess again, tool passed MQC and released 
        to production.

	   
                                               Leon

    
    
    Breaker #6 Replaced:
    -------------------
    The Speedfam Rep replaced the 15 amp breaker with a 20 amp breaker.
    This was a scheduled upgrade from Speedfam. (Vacuum pump kept tripping
    the 15 amp breaker at power up).
    
    
    Index Table Infranor Replaced:
    -----------------------------
    The Infranor Motor Controller for the Index Table "blew" during power up.
    The Controller was replaced with a new one. 
    
    
    Unload Flipper:
    --------------
    The Unload Flipper dropped a product wafer while in the home position.
    The wafer fell on edge down inside the drop off area. The transfer paddle
    moved back to its home position and smashed the the wafer. 
    
    The Flipper Arm screws were loose. The black plastic knobs on the
    Flipper Arm screws were tightened a 1/4 turn with pliers. They never
    seem to remain tight when tightened by hand.
    
    
    Load Cups:
    ---------
    The load cups were not rising smoothly during the load sequence. All
    lift cylinder shafts were cleaned with alcohol and lubricated.
    
    
    Unload Elevator #1:
    ------------------
    The wafers were occasionally getting stuck half way into the cassette
    during unloading. The Speedfam rep indicated that the water level might
    be slightly low. The left drain tube was found loose. It looks like the
    reducing bushing that the left drain tube connects to is loose. (Bottom
    of tank) This loose (left) tube was lower than the right tube, which
    was tight. This may explain the low water level in the tank. We didn't
    have an opportunity to reset the tube today, maybe D shift can get to
    it tonight.
    
    
                                                      C Shift.

    Today, the system was available for many hours, so I performed the
    slurry upgrade to the system.  Quite the task.  In summary, here's
    whats up with this:
    
    *  The upgrade was to remove the "peace-pipe" slurry tube going to the
       MHTA, change out the MHTA distribution spout, and install new clear/
       flexible tubing to the MHTA.
    
    *  Upon checking out the schematic, there was a plethora of items to
       change out.  This included the feedthrough in the polish section
       tub.  Well, the present feedthrough was welded in-place with the 
       weld virtually impossible to get at.  The print also showed a P-trap
       to install in the tub section.
    
    	-  The feedthrough was not changed out.  We decided to use the
           existing feedthrough.  This necessitated that the original pipe
           on the feedthrough had to be modified, big time.  The pipe was
    	   cut to a short section and the top was welded to form a seal.
           Two holes were drilled and tapped on the pipe, where two fit-
    	   tings were installed.
    
    	-  The P-trap was not used in this senario, as B3 doesn't have this
           feature either.
    
    *  The slurry distribution tube on the MHTA was then installed along
       with several guides/brackets.  Two runs of clear tubing were run
       the feedthrough pipe fittings to this new distribution tube.
    
    *  Ran a manual polish cycle to test the flow.  Seems to be working
       just fine.  No leaks to be found.
    
    *  Please note, the slurry system was only worked on from the polish
       tub area and up.  No plumbing was changed under the tub or to the
       pumps/rinse.
    
    As a side entry, let me say this.  The poly welder we have is pretty
    useless until we get some self-feeding tips.  I borrowed the poly
    welder I had purchased while working in the HPA group.  Made life a
    little easier.
    
                   				Doc

    Noticed that the paddle to track 1 was hitting the left side of the 
    cut out as it placed a wafer in the track. Checked it at track 2 
    with the same results. The paddle at home location was also off to the
    left although it wasn't hitting the wafer posts. Recalibrated the
    paddle to track 1, track 2 and home. Tested fine.
    
    					
    					B-shift.

 	Broke a wafer between the unload flipper and the unload paddle
	at the beginning of our shift. The wafer came from unload cup #3.

	Be believe the unload flipper failed to release the wafer into 
	the scrub station, when it went to it's home position the wafer
	was dropped vertically between the unload flipper and the unload
	paddle. When the unload flipper went to place the next wafer 
	into the scrub station it broke the dropped wafer (??).

	Cleaned up the broken wafer. Checked the unload flipper positions,
	fingers and lockdown screws, everything looked good. Checked the
	unload cups and found them in the wrong index table feedthru's,
	placed them in there designated feedthru holes. Checked the unload
	air cylinder pedestal, it also looked o.k. Ran 150 wafer monitoring
	all the unload with nothing out of the ordinary found.

   
    
    					B-shift
    
    

    Load flipper failed to initialize.
    
    Investigated problem and tried exercising the load flipper in manual
    mode. Regardless of start postion or command, flipper always drove
    toward index table and ignored all flags. Swapped cables from unload
    flip to the load flip and had the same problem, thus eliminating the
    controller as the suspect.
    
    Removed load/unload flip assembly and drained copious amounts of water
    from the internal workings. The load and unload home sense electrical
    connectors are badly corroded and the rest of the wiring was damp.
    Dried it out as best we could and are in the process of replacing the
    corroded pins & sockets.
    
    Asembly will need to be aligned and sensors adjusted when tyhe wiring
    repair is completed. May  also want to check/dry up any remaining water
    in the load/unload box.
    
    Dave & Leon

    At approximately 1230 B2 slurry loss alarmed. Beeped ashland and return
    caller said to contact onsite rep. no response.  Slurry returned to
    normal 10 minutes later. No product was in process at the time. 

    installed the positive close feature on both dump valves, all tools now
    have this upgrade.
    
    Note: If bubbles are noticed it may be time to rebuild the valve, this
    is due to wear on the O rings, but it should be a long time before that
    happens.
    
                                                  Rich (Mr. Goodwrench)

    CABLE AND FLEX TRACK: FLEX TRACK APPEARED TO HANG UP ON MULTI HEAD .
    FLEX TRACK BROKE AND CABLE CONNECTIONS PULLED OUT OF BULKHEAD
    CONNECTORS. REPAIRED FLEX TRACK AND TEMPORARY FIX ON CABLES . WILL
    OR4DER NEW CABLES OR CONNECTION, WILL LOOK INTO FOR MONDAY
    DELIVERY.RELACED PAD.
    
    KEVIN:

    Profiled last pad off tool. Pad had 1750 wafers changed on 9/17/96.
    	location	thickness
    	--------	---------
    	ID		61  &  62 mils
    	1/4 radius	62  &  63 mils
    	1/2 radius	64  &  64 mils
    	3/4 radius	65  &  66 mils
    	OD		66  &  67 mils
    
    Pad is fairly uniform after 1750 wafers.  No change in conditioning
    made.
    -Frank

    Note ID/OD for last entry was set at 9.3".

CMP.B2 - Down for high particles.  Suspected that particles might be coming
	 from the 2nd table.  Changed both pads.  Cleaned the entire process 
	 area.  The Conditioner was cleaned.  Index table drained and wiped
	 out.  One of the drains were also clogged.  The same was corrected.
         Tool again failed MQCs for particles.  Changed the carriers and wiped
	 out the unload track.  Tool presently sets needing MQCs. 

        The system failed mqc's for high particles. A new pad installed at
        shift change and failed. The tool has been cleaned again and it is 
        failed. Last time two out of five carriers out of spec. with 1200
        particles on them - spec. calls for 1000. Left the tool down for
        process engineering decision. Last MQC was run about 7:00 am.  
        Looks like it' common slurry problem just move from A tools to 
        Speedfam.

                                 D shift
 

    The grounding of the mapper and the robot is now completed.

 SPEEDFAM WAFER CRASH FORM (to be filled out by MFG + EEG + PSS, together)

 1) System _ CMP.B2 _
 2) Recipe _ 1P_ILD1 _
 3) Step # _ 4 _
 4) Time into step _ 2 _
 5) Type of wafers that broke _ dummy _
 6) Carrier which wafer slid out of _ 4 _
 7) Other carriers that were damaged _ 5 _
 8) Alarms displayed by polisher _ Carrier 4 rotation error
				 _ Carrier 5 rotation error
		
 9) Did any other polisher error for slurry or crash _yes_, sysytems_A1,A2,B3
10) Did wafer detect work _ yes _
11) # of wafers on pad _ 1160 _
12) # of wafers on carrier _ 277 _
13) Was there any vibration prior to the crash _ yes _
14) Was there plenty of slurry (for step 1-5) or water (step 6-9) present on
    the table _ no _
15) Check step hight of the carrier from question #6 .0075 - .008
16) Please note any other unusual circumstances:
                               
After the crash we noticed that there was some slurry on the table, 
but not much and there wasn't any slurry in the line. Thats when B3 slipped
a wafer due to low slurry. 

We lost slurry for about an hour. 

17) Put this check sheet in CMP note #

       The tool was running TUP200 on some product and at touchdown,
    the wafer under #5 slid out and the wafer detect tripped.  
    Fortunately it was a 1 sec. touchdown and head #4 was just coming
    up.  The wafer did suffer some scratching.  The carriers and pad
    appeared to fine.  Both carriers have 91 wafers on them as well 
    as a recent pad.  The crash form at 34.last will give the details.

                                              D shift  

CMP.B2 - Scheduled down.  Engineering requested the EP regulators be calibrated
	 and the DF done.  The same was completed.  The slurry delivery tubing 
	 inside the process area was replaced.  A few more items were taken 
	 care of for the weekly PM.  Tool sets needing the old carriers put
	 back on.  The pad change and 2 items on the pm completed.

    PICKED UP FROM C SHIFT.
    
         RAN MULTIHEAD INTO CARRIER #5, DIDN'T NOTICE THE ALIGNMENT PIN
    STILL IN THE SPINDLE.... DOH!!!!!!
    
         CHECKED ALIGNMENT FOR LOAD POSITIONS OF ALL 5 SPINDLES, ALL LOOKED
    GOOD. 
    
         INSTALLED CARRIERS, REPLACED PAD, AND COMPLETED 2 REMAINING ITEMS
    TO FINISH OFF THE PM.
    
         RETURNED TOOL TO PRODUCTION. FAILED FOR UNIFORMITY 2X.
    
         CHECKED DOWNFORCE CALIBRATION, WAS IN SPEC. 267~287 BETWEN ALL 5
    CARRIERS. REPLACED ALL 5 CARRIERS AND REPLACED PAD AGAIN WITH ONE FROM
    DIFFERENT LOT. 
    
          IN MQC AT 06:15
    
    D SHIFT

    
           Carrier # 3 wold no come in below 10%.
           Changed out carrier #3 and ran MQC's. Carrier #3 still out.
           swithched carriers 2 and 3 to verify and MQC"S passed.
           head 2 @ 10%
           Tool was then put in wet idle for lunch. After lunch the tool
           during the 3rd segment of ild3 came up with vacuum error.
           (carrier 1-4 no wafer carrier5 o.k.)
           Verified I/O's o.k. manually actuated carriers 1-5 vacuum
           sequence. o.k. Ran carriers 1-5 to isolate. O.K. Checked main
           vacuum guage and witnessed no pressure increase.
           After verifying that every thing was o.k. the tool no longer
           had an error. Ran ten verification wafers no touch process and
           the Tool did not error. No root cause known, left down to pass
           on to next shift, for more verification . 
                 

    Vacuum error on head 3, found the main vacuum a little low at 23,
    checked at the head with loaded wafers and found in the 16 - 17
    range. removed the filter and the main went back to 25 - 26 and
    the head to 20 - 21. installed a new filter and plastic cup due 
    to damage of seal surface.

    Came in with b2 being down for vacuum errors. Ran no-touch and found
    that head 3 would drop off first (digin 58). Replaced carrier 3 but had
    the same results. At about this time Rich called in (C-shift must have
    paged him) and asked what was up. With the quick carrier change not
    fixing the problem coupled with A1 and A2 being down I asked him to
    come in. Figures it was the stupid vacuum filter being clogged. Oh
    well. Thanks to Rich for coming in. Maybe a vacuum filter change should
    be added to the weekly pm???
    
    
    						B-shift

	
	The system errored for a wafer detected on the table, the
	carriers went up and left all 5 wafers on the table. Found
	the slurry lines had caught the DE spray nozzle that sprays 
	the side of the polish table and pointed it upward. When the
	side spray turned on it hit #5 wafer detect sensor and activated
	it, re-adjusted the nozzle and slurry lines.
   
    					Doc & Bob
    				    
    

    Pad was profiles after 1470 wafers on CMP.B2.  Pad_step was measured
    to be 67 mils.  Pad profile was:
    	location	thickness
    	id		68
    	1/4 radius	70
    	1/2 radius	71
	3/4 radius	71
    	od		72
    Pad conditioner setting left at 9.3".  No changes made.
    -Frank

    During a PM the tool lost the wafer detect board. ordered a new one
    from stock and replaced.
    
    
                                                      Rich (Mr. Goodwrench)

       Tool removal rate was getting down around 900A, replaced
    pad.

                                          D shift

    After Ashlands work on the slurry system the tool failed particles X2.
    Point of use filters on b3 and a1 failed (caused crashes). The mqc
    recipe was modified (added 7 seconds to step 8 and 3 seconds in step 9)
    but particles still failed. Running out of options and operators (they
    have a meeting at 5) and mqc wafers. 
    
    
    					B-shift

             After the tool unloaded its last (5) wafers, the
        screen went blank.  I went to the monitor in back and the 
        display was blank as well.  A softboot wouldn't bring anything
        back as well.  After a hard boot, everything was fine.

                                          D shift

    CMP.B3 - While down at external both pads and all carriers were changed
    out due to high wafer counts on all of them.  The tool was also cleaned
    up and the conditioner cleaned.
    

        The tool crashed a monitor wafer tonight. The wafer slide out from
    carr#5 and crush on#4 - 10 sec.in segment 3. It was a 3-d slide out
    from this carrier. First two times it didn't crash. So we checked the
    carrier#5 to load cup alignment and it was off. We moved this carrier
    on 384 steps out. The tool runs fine after that and it running MQC's
    now.

                                                D shift

    Passed on from C-shift as having low removal rates. Ops did MQC's and
    they passed. 

	B2 was ready to run some send aheads. It ran a set (5)
	of dummy wafers first. When unloading the dummies,
	carrier 5 did not unload it's wafer. Tool then loaded 
	the send aheads and tried to polish. AS soon as the
	double loaded carrier hit the pad the send ahead came
	out, taking out carrier 4 also. Replaced 4 and 5 and
	manually loaded and unloaded wafers with new carrier.
	No problem found. Also replaced the pad. Conditioned
	new pad and returned tool to Operations.


				B shift
          

	The system errored for "all heads no arriving down". When
	we got to the system carrier #1 was up and all the others
	were rotating on the table. It was froze in segment #9 of 
	the TUP_B process, we had to stop the run to halt the polish.
	Unloaded the wafers in manual, homed the multi-head and index
	table. 
	Tried to run some dummies to duplicate the problem but we 
	came up with a "low main vacuum", found the vacuum was on to 
	all 5 heads. Checked the Wafer Tracking screen, it still 
	thought there were wafers on the carriers. Had to reset
	the computer to recover, ran over 100 wafers after that 
    	with no errors.

						A shift

           Whilest completing the monthly PM, we noticed
        that the I/O cables going from the bulk-head to the
        MHTA were getting worse.  We told Kevin C. about it and 
        he said they were on order.  These cables will not last
        much longer.  Also, could someone on days look into getting
        more filter elements for inside of the vacuum pumps.  All
        (4) are flaking and falling apart.
            

                                          D shift

      In the middle of the lot, the tool faulted for INVERTER ERROR.
   After that, the tool refused to power back up.  When it finally
   did, it kept erroring for the INVERTER.  We did a little tracing
   and found K2 wasn't under voltage and there was no LED display on
   the wafer loss breakout board.  We jumped out the detection system
   and the tool powered up and initialized fine.  We checked stock on the
   tube as well as manually and there was none.  I paged Kevin and he
   confirmed there was none stock since the last one was used last month
   on B2 as well.  He ordered (3) boards with at least one of them coming
   in ASAP of the next flight out.  He will be in here today to pick it 
   up and install it.  The tool is up and running.  We are just doing the
   the old method of standing by the ye 'ol EMO.  There is a WARNING on 
   the tool.       

                                          D shift

    
    Wafer Loss Detection Board:
    --------------------------
    The Wafer Loss Detection Board failed last night on "D" shift. Kevin
    from Speedfam called this afternoon, he's planning to pickup the 
    board at Logan around 6:00 p.m.  He expects to make it here by 
    the 8:00 p.m. passdown meeting. He'll be replacing the the board
    and reactivating the wafer detect circuit with "B" shift tonight.
    
                                                         C Shift.
     

    Kevin came in Sat. Nite 8:30 and replaced Wafer loss detection board.
    Returned tool to OPs.
    
    						B Shift
    

	B2 locked up between runs. Pad condition was over, but not on 
	polish table, table spinning, 5 polished wafer were in unload cups 
        and 5 new wafers in carriers, carriers were home. No visual alarms, 
        no alarms on screen just audable. Tried to exit but screen was locked.  
        AOk after reboot. Ran system to test aok

					A shift

          A product wafer slid out head #5 at touchdown.  An
      alignment was done of 35 and it was out 128 steps.  This
      is confirmed that it is drifting and will need TLC by SF 
      ASAP and E.E. will be aware in the A.M.
                             
              damn I love abbreviations late in the morning!
                         
                                            D shift

    Today an infranor was replaced for the problem that head 5 had lost 
    it's alignment several times over the past several weeks.
    We will monitor for the same problem and if it develops again
    change the dcx board. The last course of action would
    be to replace the motor.

    
    Head #5 Carrier to Cup Alignment Drift Problem:
    ----------------------------------------------
    The Infranor motor controller for head #5 oscillation was replaced and
    set to 13 volts today. The oscillation arm still shakes slightly as it
    moves in and out. We cycled the arm and the alignment remained good.
    
    We then replaced the DCX board for oscillation and tested the arm
    for 20 min running the OSCGO program. Although the arm made a squealing
    noise during the oscgo program, the alignment checked out AOK after the 
    test.
    
    The system was put back UP per Tim Dyer's action plan.  Maybe head #5
    needs to be simulated under load when polishing before the alignment
    drift occurs. Time will tell, keep a close watch on it. We will need to
    address the squealing noise at a future time.
    
    
                                                               C Shift.
    

    
    Head #5 fly outs:
    ----------------
    Wafers were repeatedly flying out of head #5 this morning. We checked
    the carrier to cup alignment on head #5 and it was AOK. (Go figure)
    We also ensured that the cup height was correct on cup #5.
    
    We ran the OSCGO program to exercise the oscillation on arm #5. The
    arm was chattering & squealing on every "IN" stroke. We called Tim D.
    and Speedfam about this condition and they agreed that we should
    replace the DCX control module (daughter card) for head #5 oscillation.
    The board was replaced and the chattering/squealing stopped.
    
    We then attempted to recheck the carrier to cup alignment when the
    system failed to initialize for an "inverter communication " error.
    The tool was also emiting a burning oder from the computer cabinet.
    We found an ic on the wafer loss detection board scorched. We are 
    attempting to locate a replacement board. There are none in the fab 6
    stock room but Tim D. & Rich Barrett are sure there are two in house.
    We're handing off the search to "B" shift.
    
    Note: THE WAFER LOSS DETECTION SYSTEM IS CURRENTLY JUMPED OUT!
          BE SURE TO REACTIVATE THE SYSTEM WHEN THE NEW BOARD IS INSTALLED.   
    
     Please follow the latest action plad per Tim Dyer:
    
     1) Locate one of the missing Wafer Loss Detection Boards and install
        it. (If one cannot be located, call Tim Dyer at home.) Do not
        run the tool without wafer loss detection.
    
     2) Run 50 wafers for a verification run. If Arm #5 performs normally,
        turn the tool over to Mfg for MQC's. If it misloads or throws a 
        wafer, keep the tool down and go to step 3.
    
     3) Order the Oscillation motor & gear reducer from the Fab6 stock
        room and replace them. Repeat verification run.
    
       Speedfam Drawing # AA2265
    
       Item #'s: 33 & 45.
       
       33 = Motor, AC Servo           AC2781A1
    
       45 = Reducer, zero backlash    AC2782A1
    
                                                             C Shift.
    

    Couldn't find any wafer loss boards in the stock room, sf's office, or
    Annie Hargrave's office. We were able to troubleshoot the board from
    last weeks failure and as luck would have it we had some replacement
    ic's in house. Located a PACE station (for you non-navy pukes a PACE
    station is a solder extraction station) and removed/replaced the faulty
    ic's (U2 and U4). Powered up and initialized fine. Attempting to follow
    through with the game plan now, however, from the looks and sound of
    arm 5 we'll be skipping the 50 wafer test and going for the motor/gear
    replacement. 
    
    
    						B-shift

    Took the covers off of arm 5 (brain fart) which turned out to be
    fortunate because we found that a set screw for the gear on the
    rotation motor had come loose and the gear had fallen down. The other
    set screw was in a shaft key way which allowed the carrier to still
    rotate. Anyway the oscillation is still shakey and sounds lousy. We'll
    pass it on to A-shift as the time is getting late. 
    
    
    						B-shift

The system is currently down for head 5 motor problems.  We have just
drawn a motor and zero reducer backlash from stock.  There are in the 
room.  We had many problems with this system today while trouble
shooting.  Head three bound up on us in the "home" position.  We could
not drive it off by using DCX commands.  We had to physically crank the 
motor to get it to where it would move.  After we moved it off, we tried
to home the heads.  When it was time for 3 to home, it drove the motor the 
opposite position. ???  So, we tried driving the head in DCX and it still
responded backwards. ???  We ended up changing the motor as the Infranor
responded as should.  The new motor fixed this fault.

Head 5 oscillation was checked eventually.  It seemed to have a big differ-
ence between running in manual in/out as apposed to running the OSCGO
program.  OSCGO ran much smoother, with some shimmering.  Manual in/out
was very rough.

While trying various things to isolate the problem, the Infranor for head 5
was lighting up on all three LED's, meaning overtemp.  Changed the Infranor,
no change.  Swapped the daughter board, no changed.  Ohm'd out the cable, all
is fine there.  There is 3.9 volts from motor 7 resolver shield to TC pins
29 & 30.  As compaired to other TC's, which were at zero (o).  Field service
recommends changing the motor out.

                                       A shift

    Removed the motor and gear reducer for head 5. INstalled the new ones
    and checked oscillation and the jerking is gone. Cup to carrier
    alignment was right on as well with no adjustments needed. New pads and
    carriers installed and broke in. No wafer fly outs from head 5 or
    others. Everything was going fine until the 4th set of the first 25
    wafers. Thats when the polish table decided to stop rotating. Rich
    called in about then to check up on things and gave us some ideas to
    check. One of them was to jump out the wafer detect board. EVen with
    both green leds lit the relay for the 24 volt interlock circuit can
    still not be made which will prevent the table rotation. Sure enough
    thats what the problem was. We pulled the board out to trouble shoot
    and it started working fine. We decided to try again to see if its just
    a brain fart. More later.
    
    
    						B-shift

Plagued by random inverter errors. Errors occurred both in automatic and 
manual modes. Occurred with wafer detect board active and jumpered out. 
Also happened with/out a load (carriers) on the table. Problem was traced 
to two non operative muffin fans on the inverter. These were changed by F.S.

Ran 70 wafers without rotation errors or wafer flyouts. Gave to 
manufacturing for MQC's. It passed both particles and uniformity. System 
is up and idle.

						A shift
 
Ran 70 wafers 

    Monday morning a problem with inverter developed. During a polish the
    motor would stop and an error was displayed on the LCD screen.
    The error could be cleared by a power off and the motor would run
    for a short time before it happened again. We found that the cooling
    fans had stopped working, so we replaced them and brought the tool
    back up. The polish table is now working fine.

    After PM, had uniformity problems with carrier #1 (449 wafers) Replaced	
    carrier #1 at ops request, return to them for verification.
    	

             There was a massive vibration coming from the 
        index table after the 1st wafer was loaded and the 
        table was rotating to LOAD #2.  The rear process 
        doors were opened and causing the tool to start and
        stop.  Found the air line that feeds the door lock 
        pistons was pulled off on the left inside door.  After
        the line was re-attached, the tool ran smooth. 
                         
                                            D shift

	System was passed down to us with a report of the following 
problem "multi head would drive to polish table extend carrier arms 
and ramp carriers, but would not descend to pad in segment 3.  No 
errors would occur until screen said timeout waiting for carriers NOT 
on pad" sic. System had been power failed and recipe changed to 
io_breakin by Roger and it still failed the same way.

	We changed recipe to io_mqc and it ran fine, checked both 
recipes for errors found none swapped back to io_breakin and system 
ran fine. Ran 20 more wafers  for 30 sec polish, aok. FM

	Later in the day the operator removed system from wet mode to 
check the pad count. The system did not decelerate at polish table, big 
bang, EMO was hit before multi head reached carrier rebuild room. Doc rebooted 
aok, and placed in wet mode, then took it out of wet mode to check pad 
count and screen locked up, rebooted and upon reboot received error message 
"elodev file not found"  Check monitors in front and back(a/b) modes, failed 
both ways. Checked connection at a/b box and switch positions. Checked for 
monitor cable errors. Found neither "red fail" light nor "green pass" 
light were illuminated on the CPU board. Green would be best but 
either is expected.

 Powered down reseated CPU. System ran fine. Ran test wafers aok.


						A shift

CMP.B2 - Down for scrubber not operating properly.  A complaint of the wafer 
	 not spinning while the scrubber was opertaing.  Found that the bottom
	 brushes were not working due to a broken belt.  The same was replaced
	 and the scubber was tested.  The tool was returned to production.

	B2 crashed last nite. After loading first set of break-ins
	Multi-head moved out to polish table. It alarmed for "No
	Wafers on Carriers 1-4. Wafers were on carriers, so we hit
	continue. Alarm went away and carriers started polishing.
	In the 10th segment carrier 5 did not lift off the pad. 
	All other carriers lifted off. The table kept turning, and 
	there was still no alarm. At some point the wafer was crushed. 
	White ring on carrier 5 polished almost down to the film.
	Alarm finally came for "Main Vacuum Low". No wafer detect 
	alarm ever came on.
 
	Carrier 5 was cooked and carrier 4 was replaced because it 
	had chips all around white retaining ring. 

	Changed pad and carriers 4 and 5. Tested carrier 5 in Manual 
	and it works fine. Also checked Wafer detect and it works ok.  
	Put tool in verify and gave it back to Operations. They ran
	boat of break-ins and no problems noted. Tool is ready for MQC's.


						B Shift



			

    
    Misload on head #5:
    ------------------
    The tool misloaded a wafer on head #5. The system was rebooted, and a
    no touch recipe was run. Head #5 loaded properly. The carrier to cup
    alignment checked out AOK. The index table rotation also checked AOK.
    
    A wafer misloaded last night on D Shift as well. Rebooting the system
    eliminated the problem both times. (Software?) Keep a close watch for
    this reoccuring problem.
    
                                                          C Shift. 
    

Had a problem with the uload flipper today.  The problem started when
running the last run of a lot.  The Multihead banged a few times at
the the polish end (after polishing).  The system was softbooted to
home everything.  We manually tried to unload 5 wafers.  It did the 
first wafer fine, but the flipper never returned to home after placing
the wafer in the scrub station.  The flipper only returned about 75%
of the way back.  Tried homing the flipper, and all worked, until we
tried to unload the remainder of the wafers.  At this point, the problem 
re-appeared.  Talked with Dave Rocha and Kevin Coleman.  They both saw
this problem late in the week.  The found that we have to hardboot the 
system, go directly into unload 5, and the system works fine.  Tried
their advice, and it worked.  No further unloading problems happened
the remainder of the shift.

In the middle of this activity, also tried working the fix through the
calibration screen.  It exhibited the same problems with homing as pre-
booting did.

                                     A shift

    Had another problem with the unload flipper this evening. While trying
    to correct the multihead lost its postioning. AFter soft booting, bkin
    wafers were ran but the first 5 crashed and took out all 5 heads.
    Recovered and mqc's failed twice for carrier 5 uniformity. Since we've
    been having some weird problems with this tool of late we decided to do
    the weekly to see if we could find anything out of the ordinary. We
    found DI/O cables 7 and 8 to be almost pulled out their connections on
    the right side bulkhead fittings. We took apart the flex track and
    repositioned all 8 cables. DI/O calbes 5 through 8 have places in the
    outer jacket that have been ripped through the inner wire insulators
    are fine. We ohmed out the 4 cables to make sure that no shorts or
    openes exsisted. After reinstalling the cables and retierapping (these
    cables were supposed to be changed due to the connectors being torn off
    about 3 months ago) we tried to bring the tool up but it would not
    reboot due to "elodev" not being installed. We called Dave Beecher for
    some help (local DOS guru) and found that the cpu wasn't seeing the
    touch screen controller. This was finally isolated to COM2 on the cpu
    being faulty (I forgot to mention that we experienced a power glitch
    while trying to boot up which probably took out COM2). We switched the
    touch screen control cable to the COM1 port on the cpu and everything
    booted up fine. NOTE: The original AUTOEXEC.BAT file was copied to
    AUTOEXEC.DJB and AUTOEXEC.BAT was reconfigured to go through COM1.
    
    I thinks that everything.....
    
    
    			            B-shift w/ Dave Beecher  

	System alarmed with no error message displayed on screen. Both Ops
	and EE personnel observed carrier 5 stuck to the pad while the others
	were up. The table was spinning at the desired speed but the carriers
	were not rotating. EE's first thought for an explanation was that 
	the wafer loss detect board didn't operate properly. This was tested
	using the same recipe and 4 dummies (carrier 5 was trashed). While the 
	carriers were on the pad a wafer was manually placed under the wafer
	loss sensor. The wafer loss board led lit up for the sensor being
	tripped but the wafer loss detect led didn't light up. The table and
	carriers kept spinning and stayed on the table. With this in mind our
	next thought was that maybe the wafer came out in step 3 while vacuum
	was still on. The alarm could have been main vac low which may cause 
	the carriers to lift off the pad and possibly stop the slurry pumps. 
	Which would explain all observations seen. 
        The wafer loss board was replaced and tested good. No pad or carriers
        were put on due to the upcoming shutdown.


                                                  B-shift 
      

    Replaced the unload flipper finger that was damaged last week.
    Replaced the CPU and found a file that was damaged, repaired the file
    and put back old CPU (no problem found) com port 2 works fine.
    Reboot tool and test. 

        
         The touch screen controller wouldn't install.  Checked
       a few things but nothing seemed wrong.  Swapped over to 
       COM1 as the weekend guys did and it was now ok.  Reps
       notified....  The original AUTOEXEC.BAT is now backed up
       and called AUTOEXEC.DJB             
    
                                                    

    loading problem for carrier five
    --------------------------------
    
    
    - wafer not seating properly on carrier five
    
    - checked go-no-go alignments. aok
    
    - checked cup height alignment. aok
    
    - found dried slurry in the mist eliminator for vacuum.
      removed filtering unit and ran test wafers.
      no error ocurred during the test.
    
    - reinstalled filtering unit and started another test run.
      tool failed during first five wafers.
    
    - removed filtering unit ran a boat of wafers with no errors ocurring.
    
    - returned tool to production .
    
    
    
     1. The filter unit and guage need thier locations swapped.
        The filter can be clogged and still read great vacuum.
    
    
                                           C-Shift
                                              

              Pad change at 180 wafers due to low removal rate.

                         
                                            D shift

    
    Wafer Breakage:
    --------------
    Eight product wafers were scrapped due to wafer breakage on the second 
    table. It appears that the wafer in head #5 slightly unseated from the
    carrier during lift off on the primary table. (Not enough vac loss for 
    alarm) The wafer in head #5 broke apon contact with the secondary table.
    A small piece of this wafer scratched the other 4 wafers. (The broken
    wafer was cracked in half with a small piece broken off the edge)
    
    The tool then unloaded 5 wafers and picked up another five. These five
    were polished then scratched on the second table. This incident became
    noticible when the unload flipper attempted to unload the broken wafer.
    (Unload Flipper alarm)
    
    Tim Dyer has published the following action plan for tonight:

    -----------------------------------------------------------------------
 CMP.B1,2,3 - OEM vacuum filters to be installed, and gauge put on BOTH sides
	      of element for DP readings. The filters from SR-94 have changed,
	      for reasons unknown and are clogging in 1-2 days. 
          
 CMP.B2  - 8 wafers from lot xd0590 broke/scratched on 2nd table. The ONLY
	   time we have experienced crashes on 2nd table is when an out of
	   pocket condition occurs during the lift off from the 1st table.  
           Test this theory by stopping the polisher immediately after lift
	   off from the primary table. Inspect all wafers for out of pocket
	   conditions. If they are in fact out, the vacuum must be improved or
	   the surface tension reduced.
	   DEC and SF reps will work to isolate a potential low vacuum problem.
	   The collapsing tubing in the multihead will be replaced, the vacuum
	   filter replaced and the pump rebuilt.  This should improve the 
	   vacuum at the carriers to ~25". If vacuum is in spec and wafers
	   continue to come out of pocket, change the last two step of the
	   recipes to 12.9 (from 12.7) and retest. If wafers remain in pocket,
	   check MQCs. If MQCs pass run marathon.
	
  INCLUDING BREAKIN AND MQC WAFERS, CMP.B2 IS TO RUN A 100 WAFER MARATHON 
  BEFORE RELEASING TO MFG. THIS SYSTEM HAS BROKEN 12 PRODUCT WAFERS IN 4 DAYS 
  ANY QUESTIONS, GIVE ME A CALL.
    
------------------------------------------------------------------------------
    
  Status at Shift Change:
  -----------------------
   1) Change OEM Vaccum Filters on All "B" tools. - Not Done (New Filters
      in CMP room)
    
   2) Stop tool after lift off from primary table and test for "wafer
      out of pocket" condition (B2). - Ongoing
    
   3) Replace thin walled tubing in multihead on B2. - Done
    
   4) Replace Vacuum Pump on B2. - Ongoing (New pump on floor next to B2)
    
                                                      C Shift.
   FYI: Richard Barrett from Speedfam will remain on site until 9 P.M. to
        assist D Shift.  

    The test is running with good strong vacuum, on average 23 - 25 hg
    during pickup and lift off. The wafers have a good fit to the carrier
    when checked before touch down. There is however a loud noise at
    lift off possibly due to very strong surface tension. The marathon
    will continue with Bkin3 being used with bkin and MQC recipes to
    finish off the run.       
    At this time the tubing on the multi head has been changed to the
    heavier style which may account for the improved vacuum. The unload
    flipper had to be adjusted today due to poor pickup.
    

           Tool had already run 40 wafers ok on the tool to
       verify the vacuum line replacement in the flex track.
       There was great vacuum after lift-off and at load.
       Two of the action items Tim wanted done weren't done
       prior to starting the marathon so we stopped the 
       run and installed the vacuum filter and another vacuum
       gauge.  While installing the 2nd gauge, we found the
       electric solenoid in-line with the liquid separator
       had excessive slurry build-up in so we replaced that
       as well.  We didn't have a rebuild kit for the pump so
       we replaced it with the pump that was next to the tool.
       We continued on with the marathon run and it completed
       fine without any issues. all loads and lift-offs held at 
       24.5 to 25 in/hg on all 20 runs.  MQC's were run and passed
       on particles and we are just waiting for the range and
       deviation results to come in.
                  
                                            D shift

	Main vacuum error intermittently.  Vacuum was good 28" and 26" on 
either side of filter, but pumping speed was slow. Removed water from filter 
glass trap. Dried filter. Did a manual flush of tank,(vacuum reservoir was 
filled with water). Pulled check valve and cleaned. Found two pieces 
of Teflon tape across the seat of the check valve. Cleaned rinsed and 
reinstalled. Took pump apart and dried seals and diaphrams. Reassembled and 
tested. AOK

						A shift

    Operator found tool alarming whilst processing. Observations made were;
    MHTA was over the index table, the pad conditioner was over (but not on)
    the polish table, the table was rotating, the transfer paddle at track
    1, no wafer was blocking the track sensors, the mhta had unloaded and
    loaded fine, main vac was good, screen had locked up. All DIN's were
    checked and nothing out of the ordinary was found. Those that should be
    lit were lit and those that would indicate a problem were not lit.
    EMO'd tool to recover since the screen locked up. While unloading the
    wafers manually from the index table 1 broke. It broke real easily as 
    no excessive pressure was used and the fracture was straight across the 
    wafer starting from the notch. May have been a chip in the edge. PSS
    was informed. Since the transfer paddle remained at track 1 while the
    mhta unloaded and loaded, 5 wafers were ran with the "NOT_TOUCH" recipe
    to insure proper operation of the unload module. 
    
    
    						B-shift 

          Tool failed MQC's for particles.  We ended up
      taking the tool for the Monthly PM and a thorough
      cleaning.  The PM was completed was turned over to
      OPS.  The particles passed but the range was slightly
      out.  OPS are currently trying to bring it in.
               
                                            D shift

    Replaced the 2 cables from the bulkhead connector through the flex
    track to the multi head. During initialization we lost the Infranor
    for rotation 4, replaced and tested tool.

    Installed cables 5 & 6 in the flex track to the multi head.
    This completes the cable repair/replacement.

    Operator found tool not running when it should have been. Isolated to a
    broken cassette in elevator 1 (it wasn't tripping the sensor which
    stopped the process once the wafers were done polishing). Replaced the
    cassette and resumed.
    
    
    					B-shift

	Flow and temp alarms, for B2 Chiller. Found heater ON! And fan tripped.
Reset fan and turned heater off. Unit controlled down to 28'c but we found we 
could not adjust pot for set point. Check set screws on cap aok removed and 
tried to controlled by pot shaft still no control, Check wiring as best we 
could, (unit is installed close to wall and cover does not open all the way.
Omhed out put it is adjusting.  Need to find schematics. Unit is at proper
set point, but we can't adjust up or down. 

        The tool went down for the chiller alarm. We could not reset the
   chiller because on/off switch is totally destroyed and should be replaced
   with a new one. Recirculation pressure gauge on chiller shows 0.
    Temperature at the time being is 9'c - well below alarm setpoint and
    can't be adjusted.
    
                                                          Leon.

    Arrived and found the chiller idle. Put the chiller in manual mode and
   disconnected from tool, adjusted the set point (chiller must be in
    manual  mode for this adjustment), powered the chiller off and
    connected the cables, powered on the chiller, put in remote mode and     
    monitored. No problem was noticed and tool was brought back up. 

   


             The chiller wasn't working this morning.  The low
         alarm setting was at 8C and the SET POINT was set below
         that at 3C.  Thus...  it will always alarm and not flow.
         To change the SET POINT, in back of the chiller, set the
         slide switch from REMOTE to MANUAL, set your SET POINT 
         at 24C and the slide the switch back to REMOTE.  The REMOTE
         is for the SPEEDFAM tie-in.   The on/off/start switch is 
         totally junk.  I've contacted Neslab and I getting a spare
         parts listing sent to me so I can get some things for it.

                                               BJ

    
    Conditioner Wheel Replaced:
    --------------------------
    A new conditioning Wheel Was installed on the tool. The new diamond
    wheel I.D.# is 218. The Total wafer count on the tool at the change
    over was 60,477. 
    
                                                            C Shift.
       

    
    
            
        2nd ASSIST in 12 hours for two wafers in the scrubber.
     Took tool down and watched 10 wafers unload.  Noticed that
     the unload flipper wasn't opening and closing smooth.  The
     cover to the unload flipper was removed and everything looked
     ok.  We gave the bimba a slight lubing and the fingers open 
     and close fine now.  While running more VERIFY wafers, we
     wanted to know why the beam sensor alarm didn't trip when 
     a wafer didn't break the beam.  We pulled a wafer off of the
     paddle before it go to wafer track #1 and the tool tried
     sending nothing to elevator #1.  It should of timed out and
     alarmed it didn't.  It just waited about 15 seconds and then
     went for the next wafer.  This will be brought to SF attention.
    
                                                 D shift

    Checked operation of unload flipper, and found that it's OK. Checked
    the operation of water track sensors and they checked out OK. Returning
    tool to ops. 

           The unload flipper issue came right at us around 9pm.
       From Dave (SF), if there handling issues again, go for
       the bimba.  After we replaced the bimba cylinder, we
       were checking to make sure everything was ok when the
       unload flipper started screwing up.  When asked to HOME
       coming from the UNLOAD cup, it would home fine.  But when
       the flipper was told to go HOME from the SCRUBBER, it would
       find a HOME position about an 1" before where it should of
       found it.  The flipper box was removed and inspected.  It was
       discovered that home sensor was setting home on a set screw
       on the cam.  The home sensor amplifier was adjusted to not 
       pick-up the screw.  The wafer present sensor for the 
       UNLOAD flipper wasn't always seeing a wafer.  That sensor
       was adjusted as well.  The actually might have been part
       of the problem all along.  Everything was put back together  
       and verified.  The tool loaded and unloaded wafers fine.  
       The tool came back up and has been running great since
       without any problems.
                                                 
                                          D shift

The system's computer locked up today.  The alarm sounded for an error in
the Unload area of the tool, but it was uncertain as to the exact termin-
ology, as the error vanished from view soon after the alarm.  The only
indication to the Unload area being the problem was that a wafer was
found angled in a position such that the paddle wound have smashed it
should it have tried to transport it to the water tracks.  Anyway, we
tried to resume running after repositioning the wafer onto the paddle,
but the computer had no response.  The conditioning arm was still out 
over the Polish Table, with the table spinning at conditioning speed.
We then softbooted, skipped initialization, exited to DOS and powered
down the tool.  Waited, then brought the tool back up.  Checked the
unloading sequence after the reboot.  Found the unload grippers to be
below the wafer when trying to unload from the unload cup.  Re-calibrated
the flipper at unload cup position.  Tested several unload sequences
with positive results.

                                        A shift

	While polishing system began loading the next series of 5 wafers.
	It appears that a white Guide roller fell off the process door
        (while load cup one was up) and rolled under the cup preventing it 
        from descending all the way to the base of the index table. When the 
        table indexed it crashed into the unload cup pedestal, bending it. 

	A second guide roller ( but no screws ) was found under the index 
        table. We backed the cup off in DCX mode. Now that the roller is 
        removed the pedestal clears the cup but is bent and does not make the 
        cup down sensor. Ran out of time, verbal Passdown given to B shift.
        Left system powered down during Passdown.


							A shift

    Found an unload cup pedestal in stock (3 remaining) and
    installed/adjusted. We also took the liberty of modifying the process
    doors a bit in the hopes that we can avoid this type of problem until
    new doors can be installed. The modification consisted of removing the
    two right doors drilling and tapping any existing holes that were
    stripped and drilling and tapping two new holes on top and bottom
    giving us 5 rollers instead of 3. The right front is a little tight
    when moving but the right back moves well. 
    
    
    					B-shift.

        When the OPS tech went to start-up the pad break-in
    after the monthly was completed, the software had a brain 
    fart.  The conditioner was conditioning when is wasn't 
    suppose to, the arms wouldn't move out ect.  After a hard
    boot, the tool ran smooth for the rest of the morning. 

                                          D shift

    
    Head #2 Uniformity Out Of Spec:
    ------------------------------
    The system experienced uniformity problems on head #2 today.
    
    1st Attempt: DF offsets were reclaculated.
    2nd Attempt: ID/OD offsets were adjusted.
    3rd Attempt: Carrier #2 was replaced.
    4th Attempt: Down force on all 5 heads were recalibrated.
    5th Attempt: (Ongoing) Pad replaced, MQC's to commence. 
                 
                 The pad that was just removed from the tool was put on
                 during the Monthly P.M. last night. It pulled off with
                 very little force. The pad count is 105. We suspect the
                 pad may be the cause of head #2's uniformity problem.
    
                 Even though the unformity problem is isolated to head #2,
                 we're changing the pad after trying everything we can 
                 think of related to head #2.
    
                                                                 C Shift.
    

    
    Head two only removal rate excessive
    ____________________________________
    
    
     This only happens on product wafers.
     Ops mqc wafers are right on the money, but when product is run the
     removal is off on only head two.
     All offsets are very close also.
     will pass on to D-shift to check head 2 down force.
    
    
                                  C-shift
                   

          COULDN'T FIX THE TOOL. FOUND NOTHING WRONG WITH IT.

ALL WAFERS WERE RUN FOR 120 SECONDS ON THE BELOW NOTED RECIPES
ILD1 RECIPE WAS THEN DEL AND ILD2 COPIED IN ITS PLACE. TWO LOTS
PROCESSED, ONE ILD1 AND 1 ILD2, BOTH LOTS PROCESSED WITH NO REMOVAL
RATE PROBLEMS FROM ANY ONE CARRIER. BOTH LOTS WERE DEVICE DC1043.

              REMOVAL RATES AT DIFFERENT RECIPES

CARRIER      MQC RECIPE  ILD1 RECIPE  ILD2 RECIPE
-------      ----------  -----------  -----------
  1            3396        2970         3149       
  2            3328        3018         3182
  3            3288        3001         3170
  4            3227        3126         3198
  5            3314        3065         3200
AVRG           3309        3036         3179
RANGE           169         156           51


                                                  D - SHIFT

    Had a couple of "unload flipper timeouts today".  Observed it's
    functionality and found that the flipper at unload cup height was
    mis-adjusted.  The flipper was driving into the cup.  This caused the
    periodic timeout of the flipper (unable to close grippers to make the
    sensor).  The pick up position was adjusted through the calibration
    screen.  Ran fine the remainder of the shift.
    
                                           A Shift
                                                    

	Errored for low slurry flow. Found air in the slurry lines.
	Called and paged Ashland chemical they said they did change filters
	without notifying use, they were told that we must be notified.
	Manually pumped slurry and restarted the tool.

					A shift
		

    

           Tool alarmed for LOW VACUUM and ARM #4 NOT AT HOME.
        Found Infranor for #4 oscillation cooked, replaced same.
        Proc. Eng. wanted head #4 and #2 swapped at next MQC 
        because there was a process concern with #2.  After we
        swapped them we tried starting tool back up but we kept
        having vacuum problems.  Thinking it was a head #4 problem,
        we disabled head #4 and the vacuum problem went away.  We
        pulled the carrier off and blocked the hole on the spindle
        and verified it was a carrier issue.  When I picked up the 
        carrier (which was #2) to inspect it, (3) out of the (6)
        M5? screws fell through the floor. :^)   I checked the other
        (3) and they were ready to come out as well.  After we put
        a new carrier on the tool, everything was fine.  The new
        carrier went on #2 and old #4 went being #4.
      
                                              D shift

    
    
    	Machine alarmed for "wafers missing" at the end of 'b' shift (tool
    was emo'd because conditioner would not stop conditioning pad). Found
    wafers on only heads 2-5 (no wafer on head 1). Blew off remaining
    wafers and checked alignments (all ok). Adjusted load flipper to
    aligner position forward 20 steps. Ran 25 test wafers w/o incident.
    Returned tool to production.
    
    	Also had to reboot chiller since pump had shut off after CMP.B2 was
    emo'd. 
    
    	a-shift 

    Had slurry flow alarm. Found a significant "bubble" in slurry #1 lines.
    Exercised slurry system #1 and bubble purged itself.
    
    Why B1 & B3 DIDN'T alarm? Beats me. Maybe B2 DID alarm as it was the
    "idle" tool at the time. (With the others running, any bubbles would
    be there and gone. THIS looked like it got trapped there after a pad
    wetting cycle in wet mode....) Makes me wonder if Ashland did anything
    to the slurry system or filters at or around 8:00 PM.....
    
    Too came back on line o.k. after purging the lines. Also completed
    weekly PM and replace weakened slurry pump hoses tonight during PM.
    
                                  D shift

	System went down scheduled for semi annual pm and index 
table replacement.  All Index Table, carrier and flipper alignments 
checked. 

PM is well on its way to completion. Most of the lubrication on was 
not done due the absence of a grease gun. Incomplete pm check sheet 
was mailed out and entered into CMP note # 77.


					A shift/  Dave Rocha

    wafer slipped out of unload flippers. Checked adjustment and found that
    the fingers were gripping wafer and pushing slightly forward, made an
    adjustment to the fingers, ran wafers,and found it to run better.
    Return tool to operation.

	Operator called us off cmp.a2 to look at cmp.b2.   Kevin Jubinville 
had just hit the EMO. We found the multi head over the polish table with the 
conditioner arm crashed into the multi head. Water was on at the clean station 
secondary table spraying up to toward the top of the system. 

We moved the multi head to load manualy and turned the system back on. The pad 
conditioner homed, but over shot and caught the lip of the condtioner bird 
bath.  Multi head was also free wheeling (not moving) and could be moved by 
hand.  

Checked infranor and breakers. aok. Found key had fallen out of the multihead 
shaft/pully.  Had to remove (drill out rivits) exhaust and back pannel to gain 
acess to key/pully.  Reinstalled key, tightend compression fixture.  Tried to 
power up to check multi head travel but system would not power up. Found one 
phase missing at fuse at T1. Replaced fused. aok. Reinstalled all hardware. 
Adjusted conditioner position sensors. Pulled carrier 3 and inspected aok.

Ran test wafers aok, returned to manufacturing. Great team effort.


				A shift/Speedfam



  

         The tool went down at the beginning of the shift
       for wafers breaking in the scrub station.  After the 
       mess was cleaned up, we ran wafers to verify the handling.
       Everything ran smooth until the tool was unloading 21-25.
       The unload flipped had the wafer but it said it missed it.
       Acknowledging it would just keep the tool running and the 
       flipper would go to get another wafer with a wafer already 
       in the fingers.  After visual inspection of the unload
       flipper box guts,  the arm that swings over the proximity 
       sensors which tells the tool the status of the fingers was
       binding up and not always making the sensors.  After everything
       was moving smooth, the amplifiers for the CLOSE and WAFER
       PRESENT position needed to be tweaked.  (25) wafers were 
       run after that and it ran great.  OPS ran full MQC's on 
       the tool and everything passed fine.  The tool came back 
       up and was running product. 

                                          D shift

         Found another Neslab controller in stock so
     we swapped it out with the one on the chiller
     due to the broken switch.  However, new controllers
     need calibrations which we didn't have documentation
     on so therefore, the new controller was floating between
     17C and 28C.  We ended up swapping out the on/off switch 
     on the old one with the new which is really the only
     thing wrong with it.  The chiller is now all set and 
     stabilized at 24C.

 
                                          D shift

CMP.B2 - Down for the unload flipper missing a wafer.  Rebooted the tool and
         ran a boat of wafers on the no_touch recipe to observe the unload  
         alignments.  The flipper unloaded fine.  Returned the tool to
	 production.

    Came onto shift with A-shift working on carrier to cup alignments after
    a crash. We were able to get the alignments in returned the tool to
    production. It passed mqc's and hasn't had a problem since.
    
    
    					A & B shifts

    Today we did the new style door upgrade. They work a lot nicer than the
    old style. 
    Just a reminder, make sure that the new doors are fully
    positioned closed to insure the interlocks are working.

		B2 reached EOL on pads and carriers. Changed
		both pads and the carriers and did weekly Pm.
          

					B Shift

             

          Tool was running product when the tool timed out
        for "one or more heads not down."  Same errors as B1????
        It was in segment #3 before downforce was applied.  
        The carriers and pad kept rotating while the screen and
        process clock were froze.  The INPUTS for the carriers
        were checked and they were all lit, indicating that they
        were all down.  The tool was EMO'ed.  After recovery,
        the heads were cycled up and down 15 times and all of the
        switches were being made.  OPS ran 15 wafers for VERIFY
        and they ran fine.  On a side note, carrier #1 was missing
        (4) screws out of the retaining ring.  They were missing 
        in every other slot so I am leaning towards the fact that
        they were never installed.  I checked around under both
        tables and there were no screws to be found.  Please be sure
        that when you install new carriers that all of the hardware
        is present and at proper torque.

                                                    BJ

    
    Load Flipper Timeout:
    --------------------
    The system errored for "load flipper timeout" once this afternoon.
    Pressing the error message on the touch screen resumed the auto cycle.
    
    FYI: The identical error occured last Thursday on C Shift. I don't
         remember documenting it at that time.
    
                                                               C Shift.

    
    Leak Detection Sensor:
    ---------------------
    The system errored for leak detection tonight. The sensor under the 
    index table was activated. A small puddle of D.I. water was wiped up
    around the sensor. We were unable to determine the source of the leak.
    
                                                             C Shift.

    
    LOAD FLIPPER:
    ------------
    (This information was left out of yesterdays passdown)
    
    The system experienced a "load flipper timeout error".
    The load flipper failed to lift a wafer out of the 
    pre aligner. The alarm was silenced using the touchscreen
    and load flipper resumed normal operation. 
    
    FYI: This exact error occured last week on C Shift. 
     

		B2 dropped a wafer out of carrier #1 during
		segment 7. Wafer did not break and ended up 
		in lower tub area. Wafer detect went off and
		"main vacuum low" alarm. Screen was frozen
		so we had to re-boot. Unloaded all wafers
		and removed carrier #1. Did Load cup alignment
		check for Cup #1. Alignment was fine. Checked
		Step height for the carrier it ranged from
		.003 to .008. Also noticed white ring was
		scratched in a couple of places. This could
		have happened when it lost the wafer. We then
		replaced the carrier and returned tool to ops.


		When they tried to run break-in a new alarm
		occured. Time-out waiting for carriers down.
		Carriers had loaded wafers and went out over the
		polish table, carriers and table started rotating
		but the carriers wouldn't go down onto the table.
		Couldn't clear problem, so we had to re-boot the
		tool. Started new set of break-ins and tool ran 
		fine.


					B Shift

			We had a few problems with B2 tonite.
			During a run, the unload cup missed
			a wafer. This only happened once. 
			Also during a later run Carrier #2
			didn't pick up a wafer at load. Hand
			loaded and continued run. When run
			was complete, we checked load cup
			alignments. All were ok. Then on the
			next run multi-head loaded wafers,
			went out to polish table, started to
			spin, as did the table. But carriers
			never came down. Kept getting time-out
			errors fro carriers not down and tool
			would not let us quit run. Had to do
			a soft boot. Next, during the following
			run tool froze up. Unload flipper got
			lost and didn't know what to do. Tool
			timed out waiting for unload flipper.
			I hit start and tool finished it's run.
			When operator was done, I exited out to
			DOS and shut down the tool for five mins.
			Powered it back up and tool ran fine rest
			of the night. 

			Except for Carrier #1. The removal rate for
			#1 is way off the other four (higher). They
			ran MQC's and verified it was high. They adjusted
			the off-set, re-ran MQC's. Still out. But just
			barely out. Awaiting A shift to decide on either
			replacing #1 or adjusting Off-set again.


						B Shift

              <<< ASDG::DISK$SYS_DATA:[NOTES$LIBRARY]CMP.NOTE;1 >>>
                                    -< CMP >-
================================================================================
Note 17.549                  CMP.B1 EE/PE PASSDOWNS                   549 of 549
SUBPAC::LANDRY                                       20 lines  16-APR-1997 07:15
                 -< wafer broke, computer mishaps, fuse blown >-
--------------------------------------------------------------------------------
    This is a late entry, should have been entered 12 hours ago...
    
    The system broke a wafer IN THE POLIS AREA, but NOT on the table.
    A wafer flew out of one of the heads, made it off the table and broke
    in the tub rinse section.  No data was captured, as the system was
    EMO'd.  We verified head alignments, which weren't really bad, but
    we did bring the Index Table over a couple of hundred motor counts.
    
    After starting up the system, the system was initialized.  But things
    weren't well.  The Multihead got lost, and slammed against the stops
    at the polish table end.  EMO'd that problem.  Rebooted.  Then 
    experienced problems with initialization with the Inverter.  That was
    traced to a faulty door switch.  We got by that, then the system just
    powered inself off.  Would not repower up.  Found a 3 A fuse on T2 had
    blown.  The system was turned over at this time to the oncoming shift.
    
    Carriers have been removed and placed in water.  The pad is also keep
    wet with a spray gun.  Good luck with this baby.
    
                                      A shift

        Oh what a night... last December back in '63 , what a
    polisher, what a night...

        Came in to clean up the tool after a most wonderful
    crash from A shift.  Apparently a product wafer was left 
    on the table after lift-off and slid off the table where
    is miraculously fell just right...  Right into the drain
    overflow track of the table and one of the PVC stems blew
    away the wafer...  Ripley's - Believe it or not!!!

        The tool wasn't able to come back up because the tool
    lost its 24VAC.  That problem was traced to a blown 3A
    circuit limiting slow blow fuse on one of the legs of
    primary 240/24 AC line.  Wow...  That fuse was replaced
    and the tool started working again.  Whilst running some
    VERIFY wafers, the tool errored for Inverter Comm. error
    and rotation errors.  Powered down tool and found the OTHER
    3A fuse on the OTHER leg of the primary circuit was tripped.
    that fuse was replaced as well, however..  we installed the
    same fuse except the tool fuse holder requires an indentation
    at the end of the fuse to properly go into the fuse holder.
    The one that we found didn't have the indentation so we swapped
    the 30A fuse and incoming/outgoing wires with the 3A wires and
    fuse to accommodate the fuses.  Rich B. will be getting the 
    proper fuses in the a.m. as there are none in stock.  After
    the fuse was replaced, the 8-sec relay wasn't pulling in so we
    looked at the process doors.  This is the only thing that is
    in the circuit along with the wafer detect board that could 
    cause the problem.  The wafer detect board was easy...  That
    was working fine and wasn't causing the problem.  We tried
    the process doors and looking at the tool, the right front
    door switch was dead.  We verified this by jumping the switch.
    The switch was replaced and the tool started running again.
    The tool ran for 2 hours then went down again for the same
    Inverter Comm. error.  The 8-sec relay was working after I 
    powered the tool back up.  We went through all of the doors
    again and found that if you pull on the rear doors, the right
    switch would break contact.  The switch was set for better contact.
    The tool started running again, until it went to unload the wafers
    from the first run.  The flipper had the wafer but the computer
    didn't think so.  The INPUT wasn't lit.  Another softboot 
    brought the flipper back to life.  We are now attempting another
    VERIFY...

    
 
                                          D shift

    Late note.
    
    Worked with an unload flipper problem for flipper not open. Found the 
    pivot point target was not being seen by the sensor. Install shim
    on the pivot point to bring the target closer to the sensor. Tested
    and returned to production.

    
         Both pads were replaced due to primary step height,
      wafer count on both at 1890.
    
         All (5) carriers were replaced.  The two special
       carriers with prototype clamp rings are on heads
       #3 and #4.
       
         the delrin ring carrier is on #3 and the PPS is on #4.
     
                                                 BJ

    
 During the first run after pad change the tool was alarming for 
 wafer detect activated. All wafer detect sensors have been checked.
 Found sensor #4 pointed on the very edge of the carrier, so had to
 adjust this one and rebooted the tool. By the the way, carriers #3
 and #4 are experimental and were placed on the tool per EE request. 
 Both pads were replaced due to pad life and OPS were using the 
 break-in recipes.  When the OPS went to run the I/O-BRKIN recipe,
 the tool errored for carrier #4 not rotating, 6 sec. into the seg.#5. 
 Checked wafer detect -  looked fine. Powered tool down. Tried to power 
 it back up - got no power on the screen. Monitor turned on but 
 nothing on the screen. All voltages, infranors,interlocks and 
 whatever else have been checked everything fine except CPU board 
 which has two LED's "pass"  and "fail" . Both of them were ON. After 
 the switching the CPU reset switch several times and reseating the 
 CPU board itself the screen started work again. Started running breakins
 During the second run got 6 sec. into seg.#5 got the same error carr#4 not
 rotating. So we rebooted the tool again and swapped carr#4 with carr#1.
 The tool errored for carr#1 during the next run. The wafer exposure has 
 been verified and we got "+.035" instead of" -.075" and new experimental
 guide ring was polished all way down and looked nice and shiny.  Since
 the tool had run ~6 wafers in that carrier alone, the original exposure
 could of been up near +7.  Since B1 is going down in the a.m., we
 put a near carrier on #1 and took the PPS style ring off and got
 them running again.  The delrin ring is still on #3.  The PPS style
 carrier is in the chase next to A1.  Please leave for Bruce to
 inspect.

                                       Is Hal-Bop gone yet??
 
                                              D-shift
 

CMP.B2- Down for losing a wafer and failing MQCs.  The tool lost a wafer out
 	head #3 which was an experimental carrier.  Because of the problems 
	the previous shift had W/ the experimental carriers it was decided to 
	put a regular carrier on.  The tool then failed for head to head rates
	and a questionable removal rate so a new pad was put on.  The tool then
	failed for particles but operations is running the MQC again.
 

    Tool errored for carriers 1 & 2 not rotating.
    
    Excessive vibration prior to error. Ops EMO'd tool and when
    investigated further, no slurry was on the polish table and slurry line
    leading to MHTA were full of water and NOT slurry.
    
    Checked slurry flow and adjusted for 500 mL/min. It was initially found to
    be @150 mL/min low.
    
    While observing tool operaton, it was noted that the flex track on the
    right side of the MHTA forward edge was broken in several places and
    the end point was shattered. Replace several links and the end point.
    Now runs straight and true. Cleaned a lot of debris abraided from cable
    insulation. Looks much better.
    
    Ops ran 10 wafer verify with no problems. Back to ops.
    
                                         D SHIFT

         Almost forgot. The end bracket which connect automation frame and flex
     track on cmp.b2 and actually was causing the problem we took from CMP.B1
     temporarily till new bracket will rushed in.  
                                                           
                                                       D -shift.

    
    Wafer Breakage:
    --------------
    The system broke 2  monitor wafers at 8:05 a.m. this morning.
    The system was 6 seconds into segment #7 of the IO_TUP recipe
    when the crash occured. The wafer slid out of carrier #4 and
    hit the wafer in carrier #3. The pad and 2 carriers were replaced.
    The tool ran for the rest of the shift with no further problems.
    
    
                                                           
    
    
    Removal Rate out of Range - Carrier #1:
    --------------------------------------
    The removal rate on carrier #1 was way out of range while the other 4
    were close. The carrier was replaced and the tool passed MQC's.
    
          
    
                                                              C Shift.
    

		B2 dropped a wafer out of carrier #2 or 3 while 
		on the the secondary pad. Don't know what segment
		tool was in as it was EMO'ed. Carriers thought
		they all still had wafers and unloaded and loaded
		new wafers. Tool errored when Unload fingers didn't
		find a wafer in unload cup 2. Meanwhile multi-head 
		went out to polish table and started polishing. 
		When operator saw the wafer crash in the index table 
		area he EMO'ed the tool.		

		We cleaned up the index table area and replaced the
		pad. The wafers on the carriers all came off and 
		were on the polish table. A product wafer was broke
		when I tried to lift it off the table. All carriers
		and the pad were replaced. Checked load cup alignment 
		for #2 and 3. Both ok. Cleaned up, re-booted and 
		returned tool back to Ops.

					B shift

    Today, we had to replace an Infranor on carrier 2 rotation.
    
    It all started with a weird senario.  The tool errored for a MHTA
    Timeout.  The head didn't move to the polish section at all when
    commanded.  Pressing a button to continue, it jumped to the Index Table
    movement, where we proceeded to also get a Timeout.  Not seeing any
    other alarms exhibited, we exited out to DOS and powered down to
    reboot.  Upon reboot, we had a serious problem.  We couldn't get the
    screen to appear.  So, we decided to check the CPU breaker, which was
    fine.  Having seen this problem elsewhere before, we checked the door
    interlocks.  Sure enough, the back double doors switches were not being
    made.  The doors were closed, but while pushing on the bottom, the
    latches kicked in.  With this door open, it quickly explained the
    timeouts on the MHTA and Index Table.  Somehow, the door switches
    joggled out of position.  Anyway, we powered down for a while and
    rebooted.  Upon this reboot, we got a rotation error on carrier 2.
    The Infranor was dead, no power what so ever.  We found one in the room
    labled as possibly good.  It was installed and tested fine.  All is
    back to normal.  
    
     					A shift
    

		Tool alarmed for robot not picking up wafers.
		Then alarmed for "Waiting for wafer to break beam"
		Screen froze up. We had to re-boot tool. While
		rebooting, Carrier #2 would not rotate. Found the
		Infranor to be bad. Replaced Infranor and re-booted.
		Carrier #2 would start to rotate but then just stop.
		Tool would not alarm. Tried to rotate carrier using
		Manual screen, no luck. Infranor is fine. Disabled
		carrier #2 and returned tool to operations, due to
		heavy work load. They are running MQC's using 4
		carriers.


					B Shift

    
    
    	Carrier 2 rotation problem (continued from B-shift):
    
    	Swapped rotation infranors 1 and 2 and the non-rotation problem
    followed the infranor. Replaced infranor and all is well. Pad and
    carriers replaced due to drying out/high counts. Also found connector
    to oscillation motor (on top of multihead) was loose. Reconnected and
    tightened.
    
    
    a-shift 
              

    System went down for carrier #1 not rotating. The infranor was out and
    remained so following re-boot and plug connections check. Replaced same
    and system is back to production.
    
                             B shift

    Tool went down hard for breaking two wafers.  As near as I can tell
    carrier #1 loaded up two wafers and broke the first one over the index
    table, then broke the second one over the polish table.  Cleaned up the
    mess and replaced both pads and all five carriers.  Ran a boat of 25
    using the notouch rcp and ran with out error.  Returned tool to
    production.

    	Tool failed MQC's for scratches. Replaced carriers, 
        and both pad. Also cleaned index table. Gave tool
    	back to OPs and it passed.
    
    
    					B shift
    

	System shuttered when it failed to see either sensor for table at 
polish and kept driving. Operator EMO the tool to make the room stop shaking.
Powered up and system ran fine in manual out and back. We noticed the bottom 
scrub brushes were not spinning. We began to address this unrelated error and 
disassembled the scrubber to check the belt. Turned out to be a bad belt. 
Meanwhile back on the farm, we check out the multihead proximity sensors and 
verified the operation of the inhibit switches which should protect system 
from overtravel. They all work fine! Had numerous boot problems i.e. CRT 
screen not coming on, elevator 1 not homing (not seeing home), and carrier 3 
infranor showing no power or error light. Power supply to infranor was good.  
We replaced this infranor and the problem of the dead infranor switched to the
pad conditioner. What the ....! System acted like it was randomly not seeing 
i/o inputs. Reseated DCX Card and CPU Card. Booted aok and ran fine. Oh ya the
problem  seen on front and remote screens cleared if we rebooted with the 
switch boxes in the A positions. 


						A shift

		We found a large puddle in the bulkhead (right side)
		that tripped the moisture sensor. Traced leak up to
		connector for the hand held spray line. Tightened
		the connector, cleaned up the water and returned the
		tool to Operations.



						B Shift

    CMP.B2    Went down due to the scrubber brushes upper and lower set not
    turning.  Disassembled unit and found the gear on the motor shaft had
    stripped out.  Replaced defective motor, reassembled scrubber.  Checked
    out operation of motor OK.  Returned tool to production.