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Conference asdg::cmp

Title:CMP
Notice:Welcome to the CMP notesfile
Moderator:FABSIX::B_TOWERLLE
Created:Tue Oct 31 1995
Last Modified:Fri Jun 06 1997
Last Successful Update:Fri Jun 06 1997
Number of topics:94
Total number of notes:6381

23.0. "CMP.B4 EE/PE PASSDOWNS" by SUBPAC::BJUBINVILLE (CMP-6 Equipment Engineering) Sat Dec 14 1996 08:48

    
                                                              
        This note is designated for the Equipment and Process Engineering
    passdowns for:
    
                            CMP.B4
T.RTitleUserPersonal
Name
DateLines
23.1first and last reply for 1996FABSIX::M_RIDLONEliminate the obliviousTue Dec 31 1996 10:216
    Reconfigured the vacuum solenoid valve, gauge, and filter/trap. The
    setup matches that on the other speedfams which gets rid of 4 elbows
    and over three feet of vacuum hose. 
    
    
    						B-shift
23.2source reportSTRATA::TDYERFri Jan 03 1997 12:13161
+---------------------------+ TM
| d | i | g | i | t | a | l |   I N T E R O F F I C E   M E M O R A N D U M
+---------------------------+
| S e m i c o n d u c t o r |
+---------------------------+

	To: Ellen Mager				Date: December 17th, 1996
      	    					From: Frank Krupa/Timothy Dyer
	    					Dept: CMP
						ENET: SUBPAC::KRUPA,
						      SCOMAN::TDYER
	cc: Stephanie Salem			DTN:  225-5737,5072
	    Dennis Goodwin
	    Kyle Wooldridge
	    Kim Conway
	    MaryAnn Piasecki
            Linda Bioseneualt
            Ray Tadry

	Subject:  CMP-V SERIAL #47 SOURCE INSPECTION REPORT 

Summary:
      Digital arrived on the morning of 12/9/96 to perform a customer source 
inspection for serial number 47.  It was our immediate impression that the 
tool was not ready for the source inspection as was the case with serial 
number 24's source inspection.  The tool was not fully configured or tested, 
see configuration issues listed below.  It is the customer's expectation that 
prior to customer arrival the polisher has been: 1) FULLY tested by SpeedFam 
prior to our arrival; 2) Operating with the latest released version of software
3) The customer's recipe has been robust tested using all aspects of the 
software including activating the alarms.  In addition our local FSE arrived 
several days ahead of us with intention of performing a pre-source inspection 
to ensure the system's readiness prior to customer arrival.  The FSE was not 
able to perform the required testing.  As a result of the above not being 
completed, the polisher errored for "low down force" on second table during 
processing of our first wafers.  The actual problem was due to head-1 not 
lowering in sufficient time.  If the polisher had been tested by SpeedFam and 
again by the FSE, this would not have occurred on the customer's time.  One 
day was lost due to this which  should have been avoided.  Speedfam needs 
to improve their pre-source inspection testing to come up to industry standards.
      Once the software was updated, the recipes corrected, and the head-1 
problem was corrected, the source acceptance ran without ANY issues.  The 
500 wafer mechanical marathon ran with out any alarms/errors.  Following the 
mechanical portion the process acceptance testing began.  Speedfam configured 
the system for process testing with old generic carriers/plates.  As a result 
10 wafers and ~2 hours were lost trouble-shooting the problem.  After locating 
acceptable carriers/plates, testing resumed.  A few small offset and ID/OD 
adjustments were made and the 50 test wafers were committed.  The process 
results were acceptable.  
      On a positive note the system ran without ANY issues once the head-1 
problem was corrected.  It was also refreshing to have an oxide measurement 
system in the same room as the testing was performed and to be the first 
customer to use the new spin-rinse dryer in the room(even though we had to
program it).


OPEN ISSUES:
	
Configuration Issues:
	1.  A/B boxes not installed
	2.  Remote terminal and key board not located
	3.  SECS-II not installed. Installation will require automation frame 
	    separation, replacement of bulkhead panel and installation of 
	    hardware. Due to any possible disturbances, Digital is requesting 
	    an additional 100 wafers to be cycled through the tool after the 
	    SECS-II work is completed..
	4.  Robot pendent not located
	5.  Chiller serial number ___________
	6.  New style door not installed.
 

Mechanical Issues:
	1.  Leak at top of  fluids manifold
	2.  Leak near vacuum tank
	3.  Leak detect not enabled
	4.  Down force calibrated with load cell and aluminum wafer directly 
	    contacting the carrier film. This procedure causes a 15-20 micron 
	    dip In the carrier films. Procedure 	needs improvement.
	
Software Issues:
	1.  Most current released version not installed, changed  from 494a to 
	    494e.
		PRODUCTION MANGER WILL SET-UP PROCEDURE WITH SOFTWARE GROUP TO
		ENSURE THE FLOOR HAS THE LATEST RELEASE OF SOFTWARE.
	2.  Carrier pressure alarm configuration screen is not configurable for 
	    primary and 2nd table to correspond with high and low end pressure 
	    settings. Second table continues to error with low down force 
	    settings of 80lbs with a 10% error limit. Need one screen for low 
	    end and one for  high end conditions.
		WILL BE AVAILABLE IN SPEED495.

Process Issues:
	1.  System configured with old generic carriers/plates for process 
	    testing.  Why was the process portion not planned with new 
	    customer carriers/plates?
		SPEEDFAM FINDS IT VERY DIFFICULT TO USE CUSTOMERS' PLATES
		BECAUSE THEY HAVE TO BE DIS-ASSEMBLED AND RE-ASSEMBLED PRIOR 
		TO SHIPPING WITH THE TOOL.  TO CORRECT THIS ISSUE THEY WILL 
		HAVE AT LEAST 5 "NEW" CARRIERS ALWAYS BUILT AND READY FOR 
		CUSTOMER USE ON THE PRODUCTION FLOOR.

Process Results:
	Parameter		Spec		Actual
	==============	=======	========================
	Avg removal rate	>=2000		3729
	Avg %Std.Dev.		<=5.0		4.26
	Max %Std.Dev		<=8.0		8.1   (6.73 without 1st run)
	Max HTHNU		<=5.0		7.88  (4.59 without 1st run)
	Throughput		>35 wafers/hr	36

These results are consistent with those observed at previous source inspections
and the system is deemed acceptable pending the closure of the open issues
listed in this report. Speedfam has agreed, and assured us the open issue WILL
be closed prior to shipping. We will call to confirm on 12/18/96. The tool
will ship on 12/19 and arrive here on 12/23....Merry Christmass!


OTHER ISSUES AND ACCOMPLISHMENTS DURING THE VISIT AT SPEEDFAM:

o Signed-up Digital for Beta testing of Speedfam oxide endpoint system.  We
  will be the 3rd beta site and are scheduled to receive the system 3/1/97.

o Signed-up Digital for the 1st beta test of Speedfam W-Endpoint system. 
  Should come with the Auriga tool#65 in 2/97.  Looked at their UEP system.
  They've run into repeatability issues with this carrier current monitoring
  system.  Also heard some negative feedback on Luxitron system from AMD.

o Met with the engineering design manager to go over CESs for Auriga.  These
  included requirements and some design ideas for the 2nd platen pad 
  conditioner and slurry pump set-up.

o Met with Randy Smith, Software Engineer, we Demo the SECSII software package
  and reviewed the VIRTUAL CONTROLLER design requirements. Both systems Look good,
  we will need to work with CIM to get Digital's end of the interface software 
  working.

o Looked at their second platen wafer-loss detect system.  Looks promising,
  however, it is too big and needs to be miniaturized.

o Held a meeting with the Reliability Manager, the Filed Service manager, 
  Reliability Engineer, NE Field Service Manager, and the NE Sales Manager to
  discus CMP.B1 head-3 stalling problem. Although Speedfam is working on a 
  long term rotation failure fix, I requested an immediate plan of action. It 
  was decide that an "old style" motor would be located, installed on head-3
  and tested at 400lbs. The initial test failed, the motors's resolver
  was than rotated 30 degrees and re-installed. Head-3 ran with out a
  stall at 400lbs. A long term motor stalling plan is in progress at Phoenix,
  due some time in January.  This fix will apply to ALL CMP.B tools. It most
  likely will include all new infranors, and some software constant changes.

o Meet with Bill Spencer, Carrier Films Manager, in Phoenix on Monday and 
  finalized the DIGITAL carrier list. There is only one plate mia. The updated
  master list will be generated and put in carrier build room. We own and can 
  account for 61 plates, plus 20 new plates shipping with B4, for a total of
  81 plates.
                
o Meet with Mike Slepekes, training manager, to discuss plan for Auriga
  training. The first available class for customers is not until late March.
  Once a schedule is finalized, it will be sent to Digital training dept.

23.3Install progressSUBPAC::BJUBINVILLECMP-6 Equipment EngineeringMon Jan 13 1997 18:4121
        Install status for 1/13/97

        KSI got alot of things done today.  They are waiting
    for an insert for the N2 line which should be done by this 
    afternoon.  They are "drawing" up plans to construct a safety
    barrier with unistrut to go around the plumbing.  They are
    waiting for a manifold set-up for in the fluids cabinet and
    in the VMB to be assembled.  They are planning on having 
    everything done for tomorrow's sign-off.  

        On our end... With SF Reps, the chiller cables were run 
    from the tool to the chiller and connected and the light
    tower was re-mounted on top of the tool.

        All of the facilities are ready at the valves on the wall
    and we'll turn them on tomorrow to check for leaks.

        The red CMP.B4 label was ordered for the front.

                                          BJ
23.4vac pump in.FABSIX::M_RIDLONEliminate the obliviousTue Jan 14 1997 09:234
    Vacuum pump is installed. 
    
    
    					B-shift
23.5CMP.B4 install progress for 1/14/97SUBPAC::BJUBINVILLECMP-6 Equipment EngineeringTue Jan 14 1997 19:3720
        Install status for 1/14/97


        KSI didn't have the parts in-house for the slurry manifolds
    so we're going to have to wait another day on that.  The did however
    construct the unistrut frame to go around the plumbing but the 
    floor panels weren't ready so don't lean on it.  

        The chiller was filled with 50/50 glycol/DI.  The system wasn't
    powered up so we'll top it off when it does tomorrow.  The PCW, DI,
    N2, CDA, PV and RAW water were turned on.  There was a tee fitting 
    that was used at the factory to flush the system of DI which we removed.
   
        Rich and Dave installed the vent covers and other panels that need
    to be installed after shipping.

        We'll be firing up this puppy in the a.m.

                                               BJ
23.6Install progress for 1/15SUBPAC::BJUBINVILLECMP-6 Equipment EngineeringWed Jan 15 1997 20:1829
        Install status for 1/15/97


            Tool was powered up in the a.m. with one minor
        issue.  The Infranor for the conditioner suffered
        electrical death during transit.  That was replaced
        with a new one.

            The chiller was powered up and topped off.  It's
        now flowing fine throughout the tool lines.

            The vacuum pump was pulled apart and cleaned out.
        the reed valves were replaced.  

            Right now there is an issue with the monitor in front
        not coming on.  There is a issue with the SF A/B box inside
        the tool.  SF Reps are looking into it now.  There is a 
        15 pin female to female adapter that is no where to be found
        so we might have to do a road trip to Radio Shack tomorrow.
        This connector is needed to connect the remote monitor to 
        the tool. 

            There is no door interlock installed on the door to the
        electrical cabinet.  This was an option for the customer.  We 
        have asked SF to install one.
         

                                          The off-shift transplant dude
23.7installation.SUBPAC::CMPThu Jan 16 1997 14:266
    Began installation of tool on Wed. found that the bleed valve for the
    vacuum installed backwards, found a bad infranor for the pad cond.
    (it was dead on power up) we are working on an issue on the switch
    box (monitor at front of tool not responding), but at this time we
    are able to use the remote monitor for the initialization. We will
    continue with the installation and update.
23.8install continuesSUBPAC::CMPThu Jan 16 1997 21:4611
    Continued the installation today with these things completed.
    
    checked and adjusted N2, air, and DI water pressure switches.
    adjusted vacuum pressure switches on the carriers and vacuum tank.
    checked and calibrated speeds and alignments for polish table,
    scrubber, and carriers.
    check and adjust epr regulators for the arms.
    check carrier to cup alignments.
    check cup heights.
    
    We will be continuing tommorow and hope to get some wafers started.
23.9interlock installed.FABSIX::L_SHKOLNIKOVFri Jan 17 1997 08:399
    

    This is just to let you know that electrical cabinet door has
    an interlock now. It connected with the EMO button in the back 
    of the tool.



                                                        Leon.
23.10MECH ACCP PLAN 1/17/97STRATA::TDYERFri Jan 17 1997 17:2750
    +---+---+---+---+---+---+---+
    | d | i | g | i | t | a | l |	  
    +---+---+---+---+---+---+tm-+
         (semiconductor)  
					I N T E R O F F I C E   M E M O
 
     To: FAB6 CMP			       Date: January 17th, 1997
     cc: Dennis Goodwin	                       From: Timothy P. Dyer
         		       	       	       Dept: Equipment Engineering
                   	       		       Ext:  5072  
                                               Node: SCOMAN::TDyer
         				       Lock/Mail Stop: HLO1-1/p-11
-----------------------------------------------------------------------------
 CMP PASSDOWN
-----------------------------------------------------------------------------
		**** I no longer have a long range pager ****

 CMP.B1,2,3 - No issues. If head stalls occur on B1, document every possible
	      detail and give me a call 

 CMP.B4  - Mechanical acceptance testing will be run this weekend with a
	   barrels connected locally to each slurry channel. Once Speedfam 
	   has completed their testing and set up, they will inform  Brian J. 
           and he will start the marathon. The following test and recipes 
	   will be run.
           
    			wafers	recipe
                	5	bin-1
			5	bin-2
			5	bin-3
			5	breakin
			5	IO_MQC
			5	IO_MQC
 pre-read 5 12k  --->	5	IO_MQC     post read and record, continue....
			5	MECH_400   (400lbs)
			5	MECH_400   (400lbs)
			5	MECH_400   (400lbs)
			450	MECH_30    (313lbs, 30 seconds)
	              ------
		TOTAL =	500

	* TWO ASSIST ARE ALLOWED IN THE 500 WAFER MARATHON, IF A FAILURE
	  OCCURS, RE-START THE MARATHON AND CALL ME.

	* PLEAS SEE BRIAN J. FOR MARATHON STATUS PASSDOWN, ONE DIGITAL
	  TECHNICIAN IS TO BE PRESENT DURING TEST.
 
    (home phone 508 699-4905)
	 
    
23.11install continuesSUBPAC::CMPFri Jan 17 1997 23:366
    The continuing installation and power up saga.
    
    We finished the alignments and checks, then started running wafers with
    the no touch recipe. We managed to finish 35 before calling it quits
    for the evening. We will start running tommorow with no touch recipe
    to check operation then start on the marathon.
23.12Don't trash the carriers.FABSIX::L_SHKOLNIKOVSat Jan 18 1997 10:136
        I shut down the CDA supply for tonight to allow the carriers sat down 
    on the pad to keep them wet. Parts (video interface box and cables)
    have arrived tonight and sitting on top of electrical cabinet.
    
                                                Leon
    
23.13500 WAFER MARATHONSTRATA::WESTPHALSat Jan 18 1997 22:5472
                           CMP.B4 MARATHON
================================================================================
================================================================================

1st attempt

11:45 - 1 assist for scrubber not operating.  Found a loose wire on break out
	board #11.  Decided to start the marathon over because we were only on
	our 3rd run.

2nd attempt

15:30 - First assist for not picking up wafers from cassette B.  Made 
	adjustments to the robot but suspect the problem was with the boat
	itself.

16:45 - 2nd assist for not picking up wafers from cassette B.  Reps. retaught 
	the robot and continued the marathon.  Errors for cross slotted wafers.
        


                   CMP.B4's MQCs FROM RUN 7 2ND ATTEMPT
                   ------------------------------------

                            particles

          carrier   large/total/scratch   removal   uniformity 

            #1         49    74     0      4032      12.1
            #2        100   136     0      2716      19.9
	    #3        117   136     0      3078      16.2
	    #4         66   203     0      2760      12.3
	    #5         57    79     0      3219      15.0
        ----------------------------------------------------------
                       Removal mean        3161
                       Head-head range     1316
                       Uniformity mean               15.1
                       Uniformity range               7.8



CMP.B4 - Still having trouble picking wafers from cassette B.  The SF Reps are 
	 presently recalibrating the robot positions from scratch and will 
	 than proceed with the 500 wafer marathon (starting at wafer #0)


Tim's note:

 CMP.B4  - Mechanical acceptance testing will be run this weekend with a
	   barrels connected locally to each slurry channel. Once Speedfam 
	   has completed their testing and set up, they will inform  Brian J. 
           and he will start the marathon. The following test and recipes 
	   will be run.


                	wafers	recipe
                	5	bin-1
			5	bin-2
			5	bin-3
			5	breakin
			5	IO_MQC
			5	IO_MQC
 pre-read 5 12k  --->	5	IO_MQC     post read and record, continue....
			5	MECH_400   (400lbs)
			5	MECH_400   (400lbs)
			5	MECH_400   (400lbs)
			450	MECH_30    (313lbs, 30 seconds)
	              ------
		TOTAL =	500
================================================================================

23.14B4 problems during MarathonFABSIX::R_POIRIERSun Jan 19 1997 10:0716

	Speedfam Reps started marathon and after 180 wafers 
	cassette "A" mapper errored for cross slotting. Reps
	worked on problem for about 4 hours and problem went away.
	Started marathon again and after 100 wafers, the same problem
	occured. Reps determined problem is with the encoder for
	cassette "A". They have ordered a new tilt assy. and expect it
	in tonite (Sunday nite). Kevin will pick it up and bring it in.
	Reps will not be back in until tonite (Sunday nite).
	



					B shift
        
23.15Marathon runFABSIX::R_POIRIERMon Jan 20 1997 10:2615

	Speedfam reps replaced the tilt assmebly and tested
	it. Worked fine. They had started the marathon and
	had run 100 wafers when the Local evac sounded and 
	we had 	to leave the fab.

        7:20 AM
    
	We are back into the marathon. 150 wafers run, no errors


					B Shift

	
23.16marathon continuesSUBPAC::CMPMon Jan 20 1997 10:311
    Installed parts for the tilt unit, starting marathon again.
23.17UPDATE/PLANSTRATA::TDYERMon Jan 20 1997 16:5327
    
CMP.B4 - We are currently 350 wafers into the 500 wafer marathon. the 1st
	 marathon was stopped at the ~200 mark for a bad encoder on the
         A tilt module. Once the mechanical acceptance marathon is complete,
	 we we have several more items to address before releasing to Pro Eng.
 	 1. Down force will be recalibrated based on the high head-head range,
	    seen in the data below. A repeat MQC will be performed.
	 2. Slurry manifold needs to be built and installed.
	 3. The Mega slurry system needs to be released in order to supply bulk
	    slurry to B4.
	 4. The SECS-II kit installation needs to be completed.
	 5. Local and global slurry detection needs to be installed and
	    tested.
 
          carrier   large/total/scratch   removal   uniformity 

            #1         49    74     0      4032      12.1
            #2        100   136     0      2716      19.9
	    #3        117   136     0      3078      16.2
	    #4         66   203     0      2760      12.3
	    #5         57    79     0      3219      15.0
        ----------------------------------------------------------
                       Removal mean        3161
                       Head-head range     1316
                       Uniformity mean               15.1
                       Uniformity range               7.8

23.18Mechanical Acceptance Completed and Passed!!!!SUBPAC::BJUBINVILLECMP-6 Equipment EngineeringMon Jan 20 1997 20:3515

 
         After the motor and encoder for A-tilt was installed
     and tested, the marathon started.  Everything went well.
     The tool completed the 500 wafer marathon without a single
     ASSIST.  Rich is going to check the downforce on all (5) heads. 
     After they are checked, (5) MQC wafers will be run to check
     the removal rate and uniformity.  Jim Sadin will be running 
     the MQC's and will post the MQC data in CMP.B4 NOTES topic.
     Leave the tool in WET MODE.
 
                                                      BJ

                                          
23.19CMP.B4 downforce calsFABSIX::J_SADINFreedom isn't free.Mon Jan 20 1997 21:3318
    
    
    	CMP.B4 downforce cal info:
    
    	Head	Before	After
    	1	341.0	354.3
    	2	328.5	353.8
    	3	338.2	353.5
    	4	339.1	354.0
    	5	343.2	354.2
    
    	Pad Conditioner
    
    	before	after
    
    	59.9	67.8
    
    MQC data will be posted in the next note (currently running).
23.20marathon completeSUBPAC::CMPMon Jan 20 1997 22:114
    Fixed the tilt unit and started the 500 wafer marathon. The run
    completed with no problems observed. Checked the down force again
    and adjusted (point to point method), at this time MQC's are being 
    run to check tolerances.
23.21CMP.B4 mqc resultsFABSIX::J_SADINFreedom isn't free.Mon Jan 20 1997 22:5316
    
    
    	MQC's completed on CMP.B4. Here are the results:
    
    	Head	rem-rate	%dev
    
    	1	3420		8.4
    	2	3430		11.9
    	3	3303		9.1
    	4	3368		7.9
    	5	3319		8.4
    
    
    	have a good night.
    
    	jim
23.22useless infoFABSIX::M_RIDLONEliminate the obliviousTue Jan 21 1997 04:098
    Tightened the locking bolts on the leveling feet (7 of 10 not secure)
    and tightened 3 of the 10 feet so that they were making contact with
    the foot pads. Also, whats up with the water level in the index table? 
    There's an 1/8" from the water to the top of the index table in the
    front and in the back the water almost spills over the top. 
    
    					
    					B-shift 
23.23B4 install updateSUBPAC::BJUBINVILLECMP-6 Equipment EngineeringTue Jan 21 1997 20:2418
    

         All of the panels were re-installed on the multihead.

         The entire area was cleaned up.

         The two almost empty barrels of slurry will be removed
    from the area tomorrow.  Two full ones might go as well.

         We are still waiting for XT to make-up the manifold for
    for the slurry in the fluids cabinet.  They have been waiting
    for parts since last week.  After this gets installed, the 
    tool can be signed off.

         We are hoping to get the mega system on line for next week
    but nothing definite.

                                                      BJ
23.24CMP.B4 status....SUBPAC::BJUBINVILLECMP-6 Equipment EngineeringWed Jan 22 1997 22:0522
        
          The two empty slurry barrels were removed from the fab.
       The two unopened barrels are going to stay for a while.  
       Process Eng. is contemplating using them for Process Acceptance.
       
          Both sets of sliding doors were secured to the tool.
    
          The parts for the slurry manifold are suppose to be in
       tomorrow morning.  If they are, KSI will have it on the tool
       by tomorrow afternoon, Friday at the latest.
    
          The front window panels were due in last week so they
       should be here any day.
    
          The stack of floor panels in the B3/B4 Maint. chase will be 
       moved under the floor for storage within the next week or so.
       They all have cut-outs for the floor pedestals for B5 and B6.
       They must know something I don't!  ;^)
    
          There is also a wall panel that will be removed shortly.
    
                                              BJ
23.25FABSIX::M_RIDLONEliminate the obliviousSun Jan 26 1997 09:566
    Installed Flouroware slurry detector module and ran associated cabling. 
    All thats left is to install the sensor once the manifold arrives.
    
    						B-shift
    
    
23.26Index table Infranor/moisture sensorSUBPAC::BJUBINVILLECMP-6 Equipment EngineeringWed Feb 05 1997 09:0011


         While making the rounds, the tool was in WET MODE but 
      the is was alarming for INDEX TABLE not at home and the
      moisture sensor was activated.  The index table was traced
      to a bad infranor and was replaced.  All of the sensors were
      checked but no sensors were tripped???

                                                 D shift
             
23.27Moisture sensor againFABSIX::O_WHITFORDLead, follow or step aside.Sat Feb 08 1997 06:5918
    Same problem as last night. Found considerable puddle in the catch pan
    under the unload elevator area. Lost tool power due to the door
    interlocks and was unable to bring tool back up. Software is seemed
    locked in DOS mode, would not respond to the keyboard, tried one last idea,
    which got me to where I needed to be.  Got tool initalized and we
    are on the way to finding just where the leak is coming from. 
    
    Did find ONE drop hanging from one of the drain tube ports under the 
    scrubber. That was at the beginning of the investigation. Found a 
    significant leak around the left drain port in the scrubber bay. 
    Did some more looking and found that the leak appears to be under the
    scrub wafer pedestal. A good amount of water was foound in the far end
    of the transport paddle mount. 
    
    Dis-abled scrubber, removed brushes and put them in water track #1, put
    tool back in wet idle.  
    
                                D Shift
23.28Brushes dried upFABSIX::B_JUBINVILLEFri Feb 21 1997 09:449
            
    
           Found DI water off on scrubber.  Brushes were 
        replaced due the dehydration theory.  They were
        totally wasted!! Enabled the scrubber, got the 
        DI flowing and replaced all (6) brushes.  All
        set for process acceptance.

                                         D shift
23.29N2 GUNFABSIX::B_WESTPHALSat Feb 22 1997 22:585
CMP.B4 - Installed an N2 gun on the system.



23.30Slurry line, bracket repairedFABSIX::B_WESTPHALSat Feb 22 1997 23:0012
    
    CMP.C1 - Kept blowing a slurry line off the SC112 filter housing.  The line
	 that was blowing off was a thinner wall type tubing.  Installed the  
         masterflex tubing we normally use and put a new 10 micron filter in.
	 Noticed that the slurry flow to table #2 was low but ran out of time.
	 the slurry flow still needs to be calibrated.  The support that holds
	 the return pipe for the metal slurry broke off. Tried to polyweld it
	 several times using different rods but couldn't get a good weld.  This 
	 could be due to the different types of materials.  Bolted the bracket
	 to the upper lip of the tank w/ ss screws.  I will replace them later
	 when I find some Teflon screws.

23.31Hose broke on Slurry Pump #1FABSIX::R_POIRIERTue Feb 25 1997 10:1111

	The hose on Slurry Pump #1 split open last nite while
	in Wet Mode. DI water spilled onto the Moisture sensor 
	and the sub floor. Replaced the hose and put tool back
	in Wet Mode.


					B Shift

	
23.32"OOP's" I forgot!SUBPAC::CMPTue Feb 25 1997 11:472
    Replaced the slurry pump tubes on B4on 24 Feb 97. The tubes were worn.
    
23.33conditioner FABSIX::R_GEETue Feb 25 1997 21:467
	Errored for "conditioner not arriving at polish table". Adjusted
	the sensor up.
	Errored for "final polish pressure out of tolerance". Set the
        pressure ramp in segment #2 of the polytex final polish program 
	to 2 seconds.

					A shift
23.34loose ribbon cableFABSIX::B_FINNMon Mar 03 1997 22:3418
	System faulted for no slurry.  Found large air bubbles in the 
line.  Bob called Ashland for the mega slurry system. They had just 
added slurry. Ran slurry in manual to remove air bubbles, aok since.

System errored for vacuum.  Found double load on all five heads.
Ran again and watched, found that wafers were not being blown off the 
carriers prior to loading the next 5 wafers. We ran and monitored i/o and 
found vacuum turning off prior to blow off but the main n2 blow off 
solenoid (i/o 14) for N2 was not being told to turn on.  Check fuse and 
opto 22 aok. Problem was loose ribbon cable.  Tested aok.


						A shift and Speedfam



				
23.35regulator problemSUBPAC::CMPWed Mar 05 1997 21:493
    Worked with a problem with uniformity and found a regulator to be 
    intermitent. Ordered one from stock and found nothing there. Ordered
    2 for tomorrow morning delivery.
23.36carrier one e.p. not respondingFABSIX::J_SWENSONWed Mar 05 1997 21:529
    Carrier one E.P.
    --------------
    
    
    Carrier one E.P. not responding.
    One has been ordered, tool down awaiting part's.
    
    
                             c-shift
23.37removal rate fixSUBPAC::CMPFri Mar 07 1997 19:234
    Operator noticed the removal rate was off slightly but within spec. 
    Replaced the pad and did down force cal for pad conditioner. Also
    discovered the chiller was off. Complete the work and return to
    process eng.
23.38A and B tilts adjustedFABSIX::J_SWENSONSat Mar 08 1997 22:2124
    Tilt A and Tilt B problems
    --------------------------
    
    
             - Cassette A, Robot  detecting all wafers to be cross slotted.
               found front to back tension assy to be loose, adjusted
               accordingly and ran 100 wafers without incident.
    
    
             - Cassette B, Robot not picking up the 15th wafer and hitting
               every wafer there after.
               Adjusted the tilt front to back. Ran 100 verification wafers
               with no problem.
    
           *** Need to keep an eye on Cassette B, It seemed very strange
               that it would not pick up only the 15th wafer and every
               wafer prior was o.k. and every wafer after the end efector
               would just nick the wafers. Tried several different
               cassettes and the results were the same.
                
    
    
                                 C-Shift
    
23.39regulator replacedSUBPAC::CMPTue Mar 11 1997 18:372
    Install EP regulator and adjust down force on all carriers. Return to
    operation.
23.40Tilt Adj. loc tightedFABSIX::J_SWENSONThu Mar 13 1997 22:4211
    
    Cross slotted wafers detected @ A cassette
    ------------------------------------------
    
    - Adjusted tilt and loc tighted  adj. screw
    
    - ran verification wafers without any problems
      tool ran without any cross slotting probems.
    
                      C-Shift/Dave, Kevin
                         
23.41Slurry pump 3FABSIX::J_SWENSONThu Mar 20 1997 20:1951
    
    SLURRY PUMP 3
    -------------
    
       Slurry pump 3 has been hooked up temporarily without the presure
       guage on the line.
    
       The guage and flared tee are in the speedfam cabinet.
    
       The valve off the manifold for slurry pump 3 has been turned off so
       before using pump 3 the valve will need to be turned back on.
    
    
                              C-Shift
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
    
23.42VARIOUS ERRORSFABSIX::B_WESTPHALThu Mar 20 1997 22:519
CMP.B4 - Never went down in the system but the tool was coming up with strange
	 errors.  When production tried to run some tests for engineering they
	 got various errors.  Soft booted the tool and while it was homing I
	 received a vacuum error.  The gauges on either side of the filter had 
	 different readings so I changed the vacuum filter.  The gauges still 
	 were still reading 4lbs.  Different so I don't trust the gauges.
	 Hard booted the tool without any errors and ran 5 wafers on the 
	 IO_MQC recipe without any trouble.  Logged an assist.
23.43DI dripping under scrubberSUBPAC::BJUBINVILLECMP Equipment EngineeringSat Mar 22 1997 08:5914

       The moisture alarm was going off after lunch.  Traced 
    problem to the sensor under the scrubber area.  Water is
    dripping from the same area as just after the install.  
    The water is wiped up but we will monitor the leak.  The 
    area will most likely need RTV to seal it up.  I will be
    forwarding this note the SF dudes as this is the second time
    for this.
   


                                                 D shift
             
23.44Automation frame di water leak / slurry pump #2FABSIX::R_GEEMon Mar 24 1997 11:5413
	There was a DI water leak coming from under the scrub station.

	Found that the leak was coming from the scrub station wafer
	pedestal area.
	Removed the scrub station wafer pedestal assembly, Teflon taped
	the DI water fittings, cleaned the o-rings, silicon sealed the bolt 
	feedthru's and re-installed the assemble. No more leak.

============================================

	Slurry pump #2 hose ruptured, replaced it.

					A shift
23.45DI hose ruptureFABSIX::J_SWENSONSat Mar 29 1997 22:1927
    Di line rupture
    ---------------
    
    
    
     - Found di line ruptured in pump box.
    
     - Replaced all three lines
    
     - moisture sensor was under water and remained green.
    
     - will pass info of the moisture sensor to B-Shift.
    
    
                      
                            NOTE:
    
     - noticed vacuum line to bulkhead fitting to be the thin wall type
       which we had problems of colapsing on other B tools.
    
     - noticed DI line which feeds through the flex track to be the same
       type which ruptured on B2.
    
    
    
                                       C-Shift
                                              
23.47installationSUBPAC::CMPFri Apr 04 1997 00:213
    Started the installation of the tool this week, all was going smoothly
    until this afternoon when the GFIC relay tripped causing the tool to
    shut down. Parts are on order for tomorrow when we will continue.
23.47guage installedFABSIX::J_SWENSONSat Apr 05 1997 22:5213
    New guage
   ----------
    
    
                                   Installed new guage, guage guard setup
                                   on line 3.
    
    
                                  Pressure when not running slurry
                                        0-15 psi
    
    
                                   C-Shift
23.48Mapper Errors / Wafer BreakageASDG::POIRIERSat Apr 12 1997 23:4366
    
    Mapper Error:
    ------------
    Tilt Mechanisim #1 repeatedly created mapper errors this morning.
    We sucessfully mapped a full cassette of wafers with no problem.
    We then sucessfully mapped using 5 different full cassettes.
    Changing cassettes didn't seem to make a difference. The 
    mapper error reoccured everytime there were 15 wafers in a  
    cassette. It wouldn't with more than 20 wafers, or less than 10.
    It repeatedly failed with 10 to 20 wafers in ANY cassette.
    
    We noticed that the 3 spring loaded leveling screws under the tilt
    mechanisim platform looked different. The springs on the 2 screws
    facing the front of the automation frame were fully compressed
    while the spring on the 1 screw that faces the rear of the automation 
    frame was barely compressed. This condition requires the weight of 10 or 
    more wafers to compress the rear spring to the point where the 
    Robot will sucessfully map the cassette.   
    
    We're theorizing that the tilt mechanisim platform needs to be readjusted
    to a level position while maintaining equal compression on the 3 spring
    loaded leveling screws.  
    
    We didn't want to change the tilt mechanisim adjustment since none
    of us knew how to teach the new style robot new posistions.
    
    We managed to get through the shift by asking gwen to load more than
    10 wafers into a cassette on each run. She then selected to polish 
    wafers from the appropriate slots. 
    
    
    
    
    
    Crash at 7:00 P.M. :
    ------------------
    The system broke 2 product wafers at 7:00. We're not sure when the 
    breakage occured because there were no error messages or audible
    alarms. 
    
    This was the condition the tool was in when the breakage 
    was first noticed by operations:
    
    1) Head #4 down on table, all other heads up.
    
    2) Wafer missing out of head #4. Wafer broken on pad with chips
       under head #3.
    
    3) Wafer in head #3 scratched and cracked in half but still in
       carrier.
    
    4) Blue stripe across bottom of touch screen with words " ENDING RUN".
    
    5) The tool was running the IO_ILD1 recipe at the time of the
       crash. The tool was 10 seconds into segment #7. Gwen informed 
       us that we were half was thru the 20 sec rinse at 313lbs of
       down force and that she had been running this recipe all day 
       no problems.
    
       We're currenly cleaning up the mess and removing the carriers
       from the tool. We'll be handing over the troubleshooting and
       verification to "B" Shift shortly.
    
       P.S  Thanks gwen for assisting us in the data collection.
    
                                                               C Shift.  
23.49Load station problemsFABSIX::R_POIRIERSun Apr 13 1997 11:4817

		We had some problems with the load station.
		Load 1 kept erroring for cross-slotted wafers.
		We leveled the load platform and were able to
		clear this problem.
		
		Then a problem occured with Load 2. The robot
		is going in to far to get the wafer and putting
		it the pre-aligner off center. The pre-aligner
		doesn't know it has a wafer and when the fingers
		come down to get the wafer it can't pick it up.
		Didn't have the time to make necessary adjustments.


					B Shift

23.50CMP.B4FABSIX::J_SADINFreedom isn't free.Sun Apr 13 1997 23:4217
    
    
    
    	Had wafer crash out of head 2. Cleaned up machine, redid
    spindle/cup alignments (2 and 3 need copious adjustment) and placed new
    primary pad and one new carrier (#2) on system. Found 2 of 3 drive
    belts for main table are loose/sloppy (reps will need to address this
    issue). Left as is (no adjustments made)..table performance was ok.
    Unload flipper was driving past wafer present position (closed).
    Adjusted fingers..working ok now. Door interlock on unload side front
    is not working (bimba will not drive piston properly...binding up
    inside). Bimba seems to be ok, won't work when installed in tool.
    Passed on to b-shift.
    
    	a_shift
    
    
23.51fixes and adjustmentsSUBPAC::CMPMon Apr 14 1997 16:438
    Checked into some complaints about operation and found that the bimba
    on the door was OK but the lock shaft was bent, replaced with a new
    one, old one was straightened and should be good for the next time.
    Polish table seems to have excess play, found the belts were loose, 
    retightened pulley assy. belts are now tensioned good. Robot had mapper
    errors, we found the adjustment screws were loose, put locktight and
    readjusted(screws were ones that did not have loctight). right now
    tool is in wet mode waiting for process work.
23.52crash, program editedSUBPAC::LANDRYMon Apr 14 1997 23:4630
      Well, another rough ride today with this system......

      Several nuances from the previous day were taken care of early
      in the day.  See the previous note for details.  After all items
      were fixed, we began to perform the breakin of the pad that never
      quite got done the previous day.  All the respective "BREAK IN"
      recipes ran flawlessly.  We turned the system over to Opts for 
      MQC's.  The very first run, the system crashed.  A wafer got away
      from Head #1, taking carrier #5 all with it.  Cleaned up the mess.
      RE-checked head to cup alignment, which we confirmed as good.  Down
      force was check on all heads.  All were within 1 pound of spec except
      for head #1, which was 3 pounds out.  Regardless, all were tweaked
      to tighten things up a bit (seeing we were there anyway).

      After all the above checks were completed, we scrutinized the IO_MQC
      program for discrepencies.  We found that the post polish rinse steps
      showed that the program was delivering 40 second on rinse water with
      300+ pounds down force.  The program was adjusted (segment 7 was 
      changed) for the down force to change in segment 7 from 313 pound
      down force, to 80 pounds down force.  Therefore, segment 6 is 20
      seconds DI at 377 pounds, and segment 7 at 20 second DI at 80 pounds
      down force.

      MQC's to be run soon.  Unfortunately, a contractor messed up on some
      plumbing lines, which caused the slurry in the tank to get diluted.
      We are currently in hold (ON B4 ONLY, AS IT'S THE ONLY SYSTEM UTILIZING
      THIS SLURRY), awaiting word from Ashland Chemical that the system is 
      ready to run.

                                               A shift
23.53adjust prealignerSUBPAC::CMPTue Apr 15 1997 23:103
    The operators noticed the wafer being hit with the load flipper.
    When check on found the prealigner did not align wafer. Made an
    adjustment to the air valve to move fingers.
23.54DOUBLE LOADED A WAFER/SCRATCHESFABSIX::B_WESTPHALThu Apr 17 1997 23:3011
CMP.B4- Down for "carriers not rotating" error, the screen being locked up and 
	scratches.  There were 2 wafers on carrier #1 and wafer #1 was missing
	from unload cup #1.  Obviously carrier # 1 failed to blow the wafer off
	from the previous run.  We had the same problem on CMP.B1 last week.  
	Recovered wafers, rebooted the tool and observed tool while production
	ran 10 warm ups and 5 MQC wafers.  Tool went down later for scratches. 
	Cleaned the conditioner and process area, changed both pads and 
	carriers #1 & #2.  Dumped the index table, pulled the cups and wiped it
	out with DI wipes.  Passed all MQCs.  

23.55PROBLEMS W/ CARRIER #2FABSIX::B_WESTPHALSat Apr 19 1997 00:4910
CMP.B4- The tool never went down in the system but it was not blowing the wafer 
	off carrier #2 very well.  It was noticed that Air was bubbling out
	between the secondary housing and the gimbal assembly.  Took the 
	carrier apart and found that the carrier plate was not tight against 
	the secondary housing even though the bolts were torqued to 8 lbs.
	With process engineering's permission the bolts were tweaked a little 
	to pull the plate against the housing.  This corrected the condition 
	and the tool was returned to engineering. 

23.56IF PRODUCTION NEEDS CMP.B4FABSIX::B_WESTPHALSat Apr 19 1997 00:5010
* Note Concerning CMP.B4 from Bruce Tower- CMP.B1 was put to external to begin 
decontamination and preparation for shipment back to SPEEDFAM.  Engineering 
would like to keep CMP.B4 as long as the other tools are running okay.  In the
event that production should need the tool Bruce requested that slurry pumps 1 
& 2 be hooked up to a barrel of SC112 (which is at the tool).  The proper 
tubing to hook the barrel up to slurry pump #1 & #2 solenoids are on top of the
barrel.  This is because the MEGA SLURRY SYSTEM's percent solids is at 18%.
An MQC must be done to verify there is no problems w/ the slurry.

23.57Need SC112 drum hooked up for Ops.STRATA::BTOWERSat Apr 19 1997 15:4510
    The last 2 test lots using SC1 blended to 18% should be done today.
    Gwen will let Brad know for sure when that happens. We will not be
    Testing SS25 at 18% until Tuesday. So, we need to hook the SC112
    drum up to the system and turn over to production for the rest of the
    weekend. Please keep a close eye on the barrell to make sure there is
    enough before Ops starts each lot. The system was fully qualified
    at 12.8% solids before we started the other slurry tests. Process Eng
    has also sent out a note stating such. Of course the Ops folks will
    run MQC's again to make sure of system integrity before any product is
    run through it. Any questions or concerns give me a call at home.  
23.58Tool now running on 12% slurry from drum.ASDG::POIRIERSat Apr 19 1997 23:5024
    
    Slurry Drum:                                                       
    -----------
    The tool is now running on 12% slurry from a 55 gal drum in the 
    service chase. Keep an eye on the level!
    
    
    Carrier #2 Blow Off Problem:
    --------------------------- 
    Carrier #2 was changed due to the wafer not blowing off. The carrier
    was replaced and no further problems with the blow off were observed.
    The carrier was returned to Sammy for tear down and inspection.
    
                                                             C Shift.
    
    
    Slurry build up on Carriers:
    ----------------------------
    Carriers #4 & #5 had to be scrubbed again today due to slurry build up.
    We've been cleaning #4 & #5 daily for this condition. 
    
    
    
                                                               C Shift.
23.59Failed MQC's for particlesFABSIX::R_POIRIERSun Apr 20 1997 11:4014

		B4 failed MQC's for high particles. We replaced
		the pad. Also found that the slurry pump #1 had 
		blown. The moisture sensor had not alarmed because
		a rag was founf under the sensor used instead of 
		the proper pad. We couldn't find any pads in the
		room. SGMR was down. Unable to order more pads.
		Replaced tubing for pump #1 and put another rag
		under the sensor.


						B Shift

23.60CMP.B4 passdownFABSIX::J_SADINFreedom isn't free.Sun Apr 20 1997 23:3722
    
    
    	Machine was vibrating during a run and it was noticed that no
    slurry was flowing out of the dispersion tubes. Checked drum and found
    it to be full. Checked the slurry pumps and found the lines on all
    three peristaltic pumps were cracked and leaking profusely (leak
    detector didn't alarm?). Replaced all the lines and placed a piece of
    "leak detector paper" under the leak detector. Slurry flow was
    restored. 
    
    	Had another error for "scrubber not in". Checked sensor and it was
    being met. Ran a few test runs without another error. Not sure what is
    up with that.
    
    	Hooked up slurry loss detector to the slurry lines being used out
    of the barrel....it works, too (we ran out of slurry late in the day and
    it set off the sensor). Replaced drum with a fresh one. 
    
    
    a-shift
    
    
23.61door swFABSIX::B_FINNMon Apr 21 1997 23:4717
	
	System had vibration during polish. Operator EMO'ed the tool. Doc and I 
were downstairs at ashlands. No slurry or other alarms. We started up tool.
It would not initilize due to open process doors. All doors were shut. Found 
intermittent double door sw. Removed and repaired. aok.


Brought up new slurry barrel. Installed at 5pm and brought empties back for 
5 cent deposit.



						A shift and Speedfam



				
23.62slurry barrelSUBPAC::LANDRYTue Apr 22 1997 23:315
    Put a new barrel of slurry onto the system today6 at 1:30 PM.  The Mega
    system is still not ready to be turned on at this point.
    
                                         A shift
    
23.63Froze-Up at segment 1 twiceFABSIX::A_QUILLENNobody will get away with anythingWed Apr 23 1997 11:118
    During the shift, system went down twice. It froze-up at segment 1 with
    the screen indicating "wating for carrier 1 to home". The first time
    system was soft booted and tested fine. We greeted second incident
    with an EMO. Checked voltages on the infanors. Re-seated cables to the
    CPU and DCX cards. Re-booted and ran 40 test wafers without a problem.
    Back to production.
    
                                         B shift
23.64waf detect/carrier positionFABSIX::B_FINNWed Apr 23 1997 23:3926

System continued intermittent errors first notice on b shift, where system 
would fault for carrier not at home as soon as the multi head reached the 
polish table with wafers (always second run of wafers on touchup b).

No hardware errors found, whilst trying other recipes and deleting and 
rewriting touchup b, error changed to "time out waiting for carriers at clean
station".  Keep in mind this is seconds into segment 1. Traced k2 power fail 
back to wafer loss board. When we jumpered out wafer loss, no errors occurred.
Frequency of error increased to every run and error was finally captured by 
wafer loss board and IO35 as a momentary intermittent wafer loss detect signal.
adjusted sensor 5. 

We are now repeating I/O MQC and touch up recipes to verify the fix since 
the problem changed and evolved into a wafer detect error.

System is still running off the local slurry barrel, not the house system.
New barrel of slurry was installed today.  You will need to monitor its 
level during the night.

						A shift and Speedfam



				
23.65Conditioner, pads, infranors oh my...SUBPAC::BJUBINVILLECMP Equipment EngineeringThu Apr 24 1997 07:5620
           Christened the tool for it's first PM.  I'm going to 
        start inverting money in the Infranor business.  We had
        the tool powered down for 20 minutes or so and we were 
        looking into a leak in the drip pan under the scrub station.
        When we powered the tool back up, we had L2 lit up on 
        the Infranor for head #3 rotation.  That was replaced and
        things were running again.  When we were taking the conditioner
        of the tool, 4 out 6 screws/helicoils were completely out of 
        conditioning disk adapter.  How this didn't fall off is beyond
        me.  Anyways, this tool has the new teflon/plastic adapter ring.
        The only ones in stock were the metal style.  We installed the
        metal style ring adapter and had to re-cal the conditioner
        downforce because of the weight difference.  After we brought 
        the tool up, it was discovered there were over 2000 wafers on
        both pads.  Both pads were replaced and the tool was turned
        back over to OPS.
                                                    
                                                 D shift
             
23.65Infranors, pads and flippers oh my......SUBPAC::BJUBINVILLECMP Equipment EngineeringThu Apr 24 1997 11:4127
                   Christened the tool for it's first PM.  I'm going to 
        start inverting money in the Infranor business.  We had
        the tool powered down for 20 minutes or so and we were 
        looking into a leak in the drip pan under the scrub station.
        When we powered the tool back up, we had L2 lit up on 
        the Infranor for head #3 rotation.  That was replaced and
        things were running again.  When we were taking the conditioner
        of the tool, 4 out 6 screws/helicoils were completely out of 
        conditioning disk adapter.  How this didn't fall off is beyond
        me.  Anyways, this tool has the new teflon/plastic adapter ring.
        The only ones in stock were the metal style.  We installed the
        metal style ring adapter and had to re-cal the conditioner
        downforce because of the weight difference.  After we brought 
        the tool up, it was discovered there were over 2000 wafers on
        both pads.  Both pads were replaced and the tool was turned
        back over to OPS.  Unfortunately, the tool never got off the
        ground.  The unload flipper had a wafer but kept alarming because
        the sensor wasn't being made.  We calibrated the unload flipper arm
        and seems to be ok now.

            on a side note... the robot is either going into get the wafer
        too far or it doesn't go in enough at the pre-aligner.  It will
        need to be cal'ed.  The pre-aligner is centering it ok though.
                                           
                                                    
                                                 D shift
             
23.66NO SLURRYFABSIX::B_WESTPHALFri Apr 25 1997 00:0810
    
CMP.B4 -  An assist was made for a "no slurry" error.  The tubing floated up in 
	  the barrel so it could not draw slurry.  This I believe damaged the
	  wafers that were polishing.  Tied some more weight on the line, 
	  cleared the alarms soft booted the tool and returned it to production.





23.67Mega slurry system repaired. New Tank on order.LUDWIG::BTOWERFri Apr 25 1997 19:4210
    The Mega slurry tank has been welded and tested for leaks. Looks good
    right now. Ashland Chemical is currently in the process of flushing
    Loop 1(B4) and Loop 2(Auriga) of water. In about an hour they should
    have slurry for us. It may be slightly off the normal 12.8% but close.
    They will be beeping John Swenson when they are all set. Please remove
    the SC112 barrel and hook us back up to the Mega system. OPS should 
    run MQC's again. 
    
    FYI: Monday we will begin testing of SS25 diluted to 18% out of a drum
         on this system.
23.68POOR UNIFORMITY/SLURRY NEEDS TO BE HOOKED UPFABSIX::B_WESTPHALSat Apr 26 1997 00:0011
CMP.B4 - Down for poor uniformity on all heads.  The uniformities were in the 
	 20s so we changed the pad and put the tool to verify.  The tool came
	 back to us for the same thing.  The pad conditioner down force and 
	 centering.  The down force was at 78 so that was left alone and the 
	 centering looked pretty good but that was moved from 9.2 (ID & OD) to
	 9.1 (ID & OD).  A new primary pad was put on for good measure.  The 
	 tool sets needing conditioning, breakin, and MQCs.  The okay was also
	 given to hook back up to the MEGA slurry system so that also needs to
	 be done.

23.69Nothing but trouble.FABSIX::L_SHKOLNIKOVSat Apr 26 1997 11:4915
            The tool was hooked up to the mega system and trouble has begun.
     First of all we have tried to calibrate the slurry flow and we couldn't
     get it right. Found inconsistent slurry pressure out of mega system.
     Ashland has been called and problem corrected for a while. The slurry
    pumps finally were calibrated at 550 ml each. The slurry detection
    system was verified after that and it did not responded at all. The
    sensor seems to be worked but the control unit not, so this one was
    replaced with a new one. The tool was released to manufacturing and 
    passed mqc's with removal rate ~3300 and st.dev. 7-8%.First product
    send ahead 5 wafers have been run with r/r 4600 st.dev 12-18% and
    dead center . At this point we decided to replaced all 5 carriers and
    check it again. All 5 carriers which were removed from the tool got 
    guide rings polished all way down.

                                                    d - shift.
23.70AIR IN MEGA SYSTEM CAUSES SLURRY TO SPUTTERLUDWIG::STANDINGSat Apr 26 1997 23:166
 CMP.B4   Went down for not distubuing slurry evenly, air in line (MEGA SLURRY
           SYSTEM).  Ashland was called.  They found both filters were online. 
           One was taken off line.  You can still see an air bubble in the
           slurry line right before SV70,71.  Ran pumps to purge out any air
           that still might be entrapped in the line. Changed pad due to poor
           uniformity, and changed carriers 3,4 because poor uniformity.
23.71vibrationFABSIX::B_FINNMon Apr 28 1997 23:1424

Vibration occurred on Ild3 recipe. Ops tech EMO'ed the tool, segment and 
time was not caught prior to EMO. We were paged from the metals room. 
Started tool up and unloaded product. No breakage.  Slurry was present at input
to slurry valves and Mega system computer showed no recent history of alarms.
Ran slurry in manual aok. Ran notouch recipe and monitored i/o's and valves for
proper operation. Found pump 1 shutting off intermittently in recipe then 
restarting on its own. Tried different recipes still errored. Edited Notouch 
recipe to toggle pumps on and off. Swapped pump 1 controls at molex connection.
problem swapped to pump two.  Set pump molex connections back to original 
positions, and swapped i/o inputs to pump controllers. Problem swapped to pump 
two. Changed Analog output board 7. Rich also lowered all pump setting below 
1000. Ran 4 runs including ILD3 recipe aok. Need to monitor due to its 
intermittent nature.




						A shift and Rich



				
23.72ACTION ITEMS FOR SPEEDFAMSUBPAC::BJUBINVILLECMP Equipment EngineeringWed Apr 30 1997 10:3512
    

    Some warranty items for Speedfam....

     
        1) continuous leak under scrubber into drip pan

        2) robot to pre-aligner needs to be adjusted

        on a side note - in HARDWARE.CMP, Check Main Vacuum Line
        was set to 0.  If we lost main vacuum, it would never alarm
        for it.
23.73slurry alarm.FABSIX::L_SHKOLNIKOVThu May 01 1997 09:445
        The tool was alarming for no slurry available, found air bubbles in
    the line. Run pumps to purge out any air that still could be in the
    line. No problems since then.
    
                                                    D - shift.
23.74musical slurryLUDWIG::BTOWERMon May 05 1997 20:245
    Matt should be able to complete the SS25 (18%) test lot today. When
    his lot is complete we need to remove the barrel and hook the system
    back up to the mega system. Please keep the barrel of SS25 in the room.
    The lot that we ran Saturday will be back for ILD3 later this week or
    early next and we'll need to hook the ss25 back up.
23.75re_seal as best we can pleaseLUDWIG::BTOWERMon May 05 1997 20:303
    Addendum to previous note: Please re_cap or tie wrap a glove or
    something to the opening in the barrel to keep air out as best we 
    can. Thanks....................BT
23.76Wafer loss sensor adjusted (head #5)ASDG::POIRIERThu May 08 1997 23:218
    
    Wafer loss error:
    -----------------
    The system errored for wafer loss on head #5 while in seg #1 of
    the t_UP_A recipe. The sensitivity on head #5 wafer loss sensor was
    adjusted. There were no futher problems or the rest of the shift. 
    
                                                              C Shift.
23.77Wafer detect sensor lossSUBPAC::BJUBINVILLECMP Equipment EngineeringFri May 09 1997 09:188
    
      Tool failed for wafer detect system.  Found #3 and #5
    wafer loss sensors tripped on the board.  The sensors
    were not hitting anything, they just needed re-calibration.
 
    
                                        D shift
       
23.78Elevator#2.FABSIX::L_SHKOLNIKOVFri May 09 1997 10:275
        Tool went down for crossloting wafers in elevator #2.
      We adjust the water level in the elevator and run 25 wafers
      to verify. Tool returned to production.

                                                       D - shift.
23.79Unload flipper box sealed & adjusted / Srubber station leak / high particlesASDG::POIRIERFri May 09 1997 23:2938
    
    Unload Flipper to Unload Cup Alignment:
    --------------------------------------
    The unload flipper box cover was removed and sealed with rtv.
    After the box was closed up, the flipper fingers were moved which
    caused a wafer pick-up misalignment. The flipper to cup and flipper
    to scrub aligments were reset. A 15 wafer verification run was 
    completed with no further problems.
    
    
    Scrub Station leak:
    ------------------
    The leak under the scrub station was sealed with RTV this afternoon.
    The RTV cured for 2 hours before the water was turned back on.
    We just checked it and its now leaking about 2 inches away from the
    sealed area. It looks like another application of RTV will do the job.
    Put a bead of RTV around the cut out under the scrubber area. 
    (A green air line is located in the center of the cut out)
    
    
    
    High Particles:
    --------------
    The system went down at 6:30 P.M. for Pad step height and HIGH
    PARTICLES. 
    
    1)  We noticed a small quantity of rust particles around the 
        inside edge of the pad. A closer inspection revealed rust comming out
        of the center of the platen. (At the junction of center ring and the 
        main platen) We cleaned with a scotch pad and rinsed with DI water.
    
    2) The Di water pressure was at the low end of spec.   20 psi
       The spec is 20 -30. It was increased to 29 psi.
       The gage on the wall is reads zero.
      
       B2 = 27 psi
       B3 = 30 psi    
    
23.80Load flipper errorsASDG::MORINThe Quest is onSat May 10 1997 09:397
    System went down for wafer present sensor of load flipper not being
    made. Checked the digital i/o's,lights intermittent. Opened upper
    assembley of the flipper box and adjusted the sensor block and
    lubricated the mechanical parts. Ran 25 wafers for verify and returned
    back to production.
    
    D-shift
23.81Input 70FABSIX::J_SWENSONSat May 10 1997 22:3815
    All Clamps Not Up
    -----------------
    
    
              - found input 70 not cooperating.
    
              - clamp 2 upper switch not making.
    
              - adj. switch
    
              - 20 or so multihead moves no problem found.
    
    
    
                           C-Shift
23.82safety upgradeSUBPAC::CMPTue May 13 1997 23:253
    Today we installed a safety lock for the multi-head. To use this
    device, you place it under the multi-head lock lever when in the locked
    position. This prevents the multi-head from moving.
23.83carrier 3/robot problem.FABSIX::J_SWENSONThu May 15 1997 23:3416
    carrier three slow on coming up.
    --------------------------------
    
      Trouble shot 24vdc solenoid while disconecting and connecting
      lines and testing the cda loop problem disapeared and tool was
      returned.
    
      Robot missing wafers intermittently on cassette B.
    
      Tightened tilt plate screw and retaught robot pos for cassette B
      and also noticed that the robot was not placeing the wafer correctly
      at the alighn station so retaught that position.
    
      Everything tested fine so returned tool back to production.
    
                              C-shift and Rich
23.84Rotation tolerance errorSUBPAC::BJUBINVILLECMP Equipment EngineeringSat May 17 1997 01:407
              
       Tool alarmed for rotation tolerance out of spec.  Inspected
    rotation on arms and table.  No problems observed.  Cycled 
    power to the tool to clear out any software bugs and 25 wafers 
    for VERIFY.  Good to go...
    
                                            D shift
23.85HIGH PARTICLESFABSIX::B_WESTPHALBradley BP#661 EXT# 6610Sat May 17 1997 23:525
CMP.B4 - Down for high particles.  Particles were over 1300 for each head.  
	 Ashland chemicals was contacted and a filter change was done. 
	 Particles came in under 300 per head.
    
23.86High particlesFABSIX::R_GEESun May 18 1997 23:186
	The tool failed MQC's for high particles. We suspect the filter
	for the mega system needs to be changed, this took care of the 
	particle issue yesterday. Called 3 different Ashland beeper #'s and
	left a message at 6112, with no response back. Will have "B"
	shift follow up with Ashland.                        
					A shift
23.87scratchesFABSIX::J_SADINFreedom isn't free.Tue May 20 1997 16:5612
    
    
    	found severe scratching on five product wafers run on CMP.B4. Tried
    to isolate the cause by running wafers only on the primary table, and
    then only on the secondary table. Neither produced scratches. Cleaned
    up all the carriers and the conditioner. Replaced the scrub station
    brushes as they looked a bit dirty/worn. Ran a set of mqc wafers and
    particles came out great (in spec, no scratches). Turned tool back over
    to production.
    
    	
    	a-shift 
23.88Slurry barrell replacedFABSIX::R_POIRIERWed May 21 1997 10:308
    		Replaced Slurry barrell at 6:15 am.
    		Ran slurry in manual to get rid of 
    		any air in the lines. Gave tool back
    		to OPs.
    
    
    					B shift
    
23.89Barrel swapSUBPAC::BJUBINVILLECMP Equipment EngineeringThu May 22 1997 09:017
    
            Drum on tool almost out.  We put a new barrel
        on and purged the lines.  MQC's are due around 9am
        so C shift, please put the tool back on the Mega-system
        and check flow at that time.
    
                                   D shift
23.90Slurry barrel swap-outSUBPAC::BJUBINVILLECMP Equipment EngineeringFri May 23 1997 08:598
              Slurry barrel was real low and OPS was throwing
          on a metal-3 lot so the barrel was replaced.


                                                    
                                                 D shift
             
23.91Slurry barrellFABSIX::R_POIRIERSun May 25 1997 03:555
    		Slurry running low. Replaced barrell at 9 PM.
    
    
    					B shift
    
23.92Infranor, PM and unload flipper issueSUBPAC::BJUBINVILLECMP Equipment EngineeringWed May 28 1997 11:2833
            Slurry barrel was getting low so it was replaced.

            During the run, it appeared that the unload flipper
         had the 3rd wafer of the run and some how dropped it
         in the paddle track.  The tool was alarming when the 
         operator noticed that the paddle was trying to go home
         with the product wafer in its way and the tool was alarming 
         for wafer not present at unload.  The tool was EMO'ed
         while it was still polishing.  All of the load and unload
         wafers were removed and the tool powered back-up.  Tool 
         alarmed for heads #2, #4 and #5 not rotating.  All (3)
         infranors had L2 lit on them.  Multihead transport was
         also red with L2 lit up.  After another reboot, only 
         #4 wasn't rotating.  The infranor was replaced and the 
         tool powered back up.  Now only @2, #5 and MHTA where lit
         with L2.  After another powerdown, just #5 rotation was
         lit with L2.  There were no more in stock.  Rich was called 
         and is trying to get (3) in here ASAP.  OPS gave us the 
         tool for the week-late monthly.  All of the PM's were
         completed for the week on the tool.  Head #5 was taken
         off line and the carrier in staying wet.  A WARNING will
         will be placed on tool.  The leak was investigated but still
         no source found.  

             The unload flipper sensor block was loose and needed to
         be tightened.  Wafers were run for VERIFY.  Tool ready for
         break-ins.  
               

                                                    
                                                 D shift
             
23.93Particles and awaiting infranor for head 5LUDWIG::BTOWERWed May 28 1997 21:409
    Spoke with Ashland this morning. They felt the mega slurry system
    should be clean after multiple days of flushing it out. Removed barrel
    and ran MQC's hooked to mega system. Particles still high.  "Large"
    around 300 and total 1100 on 3 out of 4 heads. Hooked barrel back up but
    have had problems getting an MQC done due to scrubber issues. Gwen
    should be doing one now. The infranors were ordered and should be here
    "around" 11:30 tonight. Plan is to run 4 heads until the infranor's
    show up. 
    
23.94Barrel changeSUBPAC::BJUBINVILLECMP Equipment EngineeringFri May 30 1997 10:584
    
        Replaced slurry supply barrel at 9pm
    
                              D shift
23.95heater off on chillerFABSIX::J_SADINFreedom isn't free.Mon Jun 02 1997 23:047
    
    
    	found chiller heater was turned off. Please leave the heaters on. 
    Thanks.
    
    
    a-shift
23.96primary table motor leaking oilFABSIX::J_SADINFreedom isn't free.Mon Jun 02 1997 23:069
    
    
    
    	Weekly pm completed. Found green oil from motor (primary table) in 
    catch pan. Bruce Tower is working the issue with Speedfam. 
    
    
    	a-shift 
    
23.97oil leakage on .b4FABSIX::J_SADINFreedom isn't free.Wed Jun 04 1997 20:457
    
    
    	Checked oil leakage at Bruce Tower's request. Found about 1/2 cup
    of oil in catch pan. Cleaned up what was there. 
    
    
    	a-shift