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Conference packer::vlsi_packages

Title:SCO-LSI PACKAGE ENGINEERING NOTES FILE
Moderator:PACKER::SYSTEM
Created:Thu Dec 10 1987
Last Modified:Tue Oct 20 1992
Last Successful Update:Fri Jun 06 1997
Number of topics:20
Total number of notes:62
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Topic
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RepliesAuthorWrittenSubject
1.03DUNLIN::HAWKSThu Dec 10 1987INTRODUCTION TO THE PACKAGE ENGINEERING NOTES FILE
2.02DUNLIN::HAWKSFri Dec 11 1987How to get on the Tech File Distribution list
3.0DUNLIN::HAWKSFri Dec 11 1987Correction to the Diacon Cerquad Elec. Report
4.06GAOVWed Jan 06 1988Cerquad Vs MLCC?
5.06EGAVThu Feb 04 1988HPTP what it looks like
6.01GAOVTue Feb 23 1988Can I buy samples
7.01SBG::BENZFri Apr 22 1988Heat Sinks?
8.03JGO::ENG_RPTFri May 20 1988RIGEL CHIPSET
9.04GAO::CLAVELLETue May 24 1988Vapour phase reflow of MLCC
10.03ESASE::ODEAWed Jun 15 1988MEGAN Course in HLO ?
11.02CXCAD::HAAGFri Sep 09 1988RQST 4 HLP! IR reflow w/ LDCC-T pkg
12.0PACKER::HAWKSWed Nov 30 1988Correction to the Tech File
13.07ESASE::ODEATue Dec 20 1988Package Electrical Parameters
14.0ESASE::ODEAMon Jan 30 1989SQFP .. do we have an interest in DEC in these ?
15.02KELVIN::PACHECOFri Mar 10 1989PREFERRED CAD TOOL FOR PKG LAYOUT?
16.0CIRCUS::PETRASMon Sep 24 1990WRL 199
17.0--UnknownUser--Fri Nov 09 1990test access
18.0CHIEFF::MAIRMon Aug 05 1991Need good 24 DIP model (for SPICE)
19.0GLDOA::MADISONThu Feb 06 1992Dry Process Etching Info.
20.02SHARE::STARVASKIWed Sep 02 1992Seminar: SRC Packaging Research