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Conference packer::vlsi_packages

Title:	SCO-LSI PACKAGE ENGINEERING NOTES FILE

Moderator:	PACKER::SYSTEM

Created:	Thu Dec 10 1987
Last Modified:	Tue Oct 20 1992
Last Successful Update:	Fri Jun 06 1997
Number of topics:	20
Total number of notes:	62
Number with bodies:	0

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Topic
# Replies Author Written Subject
1.0 3 DUNLIN::HAWKS Thu Dec 10 1987 INTRODUCTION TO THE PACKAGE ENGINEERING NOTES FILE
2.0 2 DUNLIN::HAWKS Fri Dec 11 1987 How to get on the Tech File Distribution list
3.0 DUNLIN::HAWKS Fri Dec 11 1987 Correction to the Diacon Cerquad Elec. Report
4.0 6 GAOV Wed Jan 06 1988 Cerquad Vs MLCC?
5.0 6 EGAV Thu Feb 04 1988 HPTP what it looks like
6.0 1 GAOV Wed Feb 24 1988 Can I buy samples
7.0 1 SBG::BENZ Fri Apr 22 1988 Heat Sinks?
8.0 3 JGO::ENG_RPT Fri May 20 1988 RIGEL CHIPSET
9.0 4 GAO::CLAVELLE Tue May 24 1988 Vapour phase reflow of MLCC
10.0 3 ESASE::ODEA Wed Jun 15 1988 MEGAN Course in HLO ?
11.0 2 CXCAD::HAAG Fri Sep 09 1988 RQST 4 HLP! IR reflow w/ LDCC-T pkg
12.0 PACKER::HAWKS Wed Nov 30 1988 Correction to the Tech File
13.0 7 ESASE::ODEA Wed Dec 21 1988 Package Electrical Parameters
14.0 ESASE::ODEA Tue Jan 31 1989 SQFP .. do we have an interest in DEC in these ?
15.0 2 KELVIN::PACHECO Fri Mar 10 1989 PREFERRED CAD TOOL FOR PKG LAYOUT?
16.0 CIRCUS::PETRAS Mon Sep 24 1990 WRL 199
17.0 --UnknownUser-- Fri Nov 09 1990 test access
18.0 CHIEFF::MAIR Mon Aug 05 1991 Need good 24 DIP model (for SPICE)
19.0 GLDOA::MADISON Thu Feb 06 1992 Dry Process Etching Info.
20.0 2 SHARE::STARVASKI Wed Sep 02 1992 Seminar: SRC Packaging Research

Topic #	Replies	Author	Written	Subject
1.0	3	DUNLIN::HAWKS	Thu Dec 10 1987	INTRODUCTION TO THE PACKAGE ENGINEERING NOTES FILE
2.0	2	DUNLIN::HAWKS	Fri Dec 11 1987	How to get on the Tech File Distribution list
3.0		DUNLIN::HAWKS	Fri Dec 11 1987	Correction to the Diacon Cerquad Elec. Report
4.0	6	GAOV	Wed Jan 06 1988	Cerquad Vs MLCC?
5.0	6	EGAV	Thu Feb 04 1988	HPTP what it looks like
6.0	1	GAOV	Wed Feb 24 1988	Can I buy samples
7.0	1	SBG::BENZ	Fri Apr 22 1988	Heat Sinks?
8.0	3	JGO::ENG_RPT	Fri May 20 1988	RIGEL CHIPSET
9.0	4	GAO::CLAVELLE	Tue May 24 1988	Vapour phase reflow of MLCC
10.0	3	ESASE::ODEA	Wed Jun 15 1988	MEGAN Course in HLO ?
11.0	2	CXCAD::HAAG	Fri Sep 09 1988	RQST 4 HLP! IR reflow w/ LDCC-T pkg
12.0		PACKER::HAWKS	Wed Nov 30 1988	Correction to the Tech File
13.0	7	ESASE::ODEA	Wed Dec 21 1988	Package Electrical Parameters
14.0		ESASE::ODEA	Tue Jan 31 1989	SQFP .. do we have an interest in DEC in these ?
15.0	2	KELVIN::PACHECO	Fri Mar 10 1989	PREFERRED CAD TOOL FOR PKG LAYOUT?
16.0		CIRCUS::PETRAS	Mon Sep 24 1990	WRL 199
17.0		--UnknownUser--	Fri Nov 09 1990	test access
18.0		CHIEFF::MAIR	Mon Aug 05 1991	Need good 24 DIP model (for SPICE)
19.0		GLDOA::MADISON	Thu Feb 06 1992	Dry Process Etching Info.
20.0	2	SHARE::STARVASKI	Wed Sep 02 1992	Seminar: SRC Packaging Research